| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 19244655
[patent_doc_number] => 12015110
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-18
[patent_title] => Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor
[patent_app_type] => utility
[patent_app_number] => 17/892788
[patent_app_country] => US
[patent_app_date] => 2022-08-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 21
[patent_no_of_words] => 3012
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17892788
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/892788 | Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor | Aug 21, 2022 | Issued |
Array
(
[id] => 19244655
[patent_doc_number] => 12015110
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-18
[patent_title] => Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor
[patent_app_type] => utility
[patent_app_number] => 17/892788
[patent_app_country] => US
[patent_app_date] => 2022-08-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 21
[patent_no_of_words] => 3012
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17892788
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/892788 | Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor | Aug 21, 2022 | Issued |
Array
(
[id] => 18081869
[patent_doc_number] => 20220407481
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-12-22
[patent_title] => DEVICES AND METHODS FOR OFFSET CANCELLATION
[patent_app_type] => utility
[patent_app_number] => 17/891860
[patent_app_country] => US
[patent_app_date] => 2022-08-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11132
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 183
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17891860
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/891860 | Devices and methods for offset cancellation | Aug 18, 2022 | Issued |
Array
(
[id] => 18975951
[patent_doc_number] => 20240056043
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-15
[patent_title] => LINEAR AND BANDWIDTH RECONFIGURABLE CURRENT BUFFER OR AMPLIFIER
[patent_app_type] => utility
[patent_app_number] => 17/886887
[patent_app_country] => US
[patent_app_date] => 2022-08-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 18798
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -26
[patent_words_short_claim] => 26
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17886887
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/886887 | LINEAR AND BANDWIDTH RECONFIGURABLE CURRENT BUFFER OR AMPLIFIER | Aug 11, 2022 | Pending |
Array
(
[id] => 18408937
[patent_doc_number] => 20230170290
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-01
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 17/886872
[patent_app_country] => US
[patent_app_date] => 2022-08-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11776
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17886872
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/886872 | SEMICONDUCTOR PACKAGE | Aug 11, 2022 | Pending |
Array
(
[id] => 19277303
[patent_doc_number] => 12027435
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-07-02
[patent_title] => Packages including multiple encapsulated substrate blocks and overlapping redistribution structures
[patent_app_type] => utility
[patent_app_number] => 17/818742
[patent_app_country] => US
[patent_app_date] => 2022-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 27
[patent_figures_cnt] => 37
[patent_no_of_words] => 6628
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 125
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17818742
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/818742 | Packages including multiple encapsulated substrate blocks and overlapping redistribution structures | Aug 9, 2022 | Issued |
Array
(
[id] => 18041034
[patent_doc_number] => 20220385251
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-12-01
[patent_title] => WIRELESS RECEIVER
[patent_app_type] => utility
[patent_app_number] => 17/883580
[patent_app_country] => US
[patent_app_date] => 2022-08-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4417
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17883580
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/883580 | Wireless receiver | Aug 7, 2022 | Issued |
Array
(
[id] => 20389293
[patent_doc_number] => 12489028
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-02
[patent_title] => Electrode structure including metal and heat dissipation layer and semiconductor including the electrode structure
[patent_app_type] => utility
[patent_app_number] => 17/874400
[patent_app_country] => US
[patent_app_date] => 2022-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 4479
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17874400
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/874400 | Electrode structure including metal and heat dissipation layer and semiconductor including the electrode structure | Jul 26, 2022 | Issued |
Array
(
[id] => 18008559
[patent_doc_number] => 20220367326
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-11-17
[patent_title] => ELECTRONIC COMPONENT APPARATUS HAVING A FIRST LEAD FRAME AND A SECOND LEAD FRAME AND AN ELECTRONIC COMPONENT PROVIDED BETWEEN THE FIRST LEAD FRAME AND THE SECOND LEAD FRAME
[patent_app_type] => utility
[patent_app_number] => 17/874898
[patent_app_country] => US
[patent_app_date] => 2022-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 20511
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -21
[patent_words_short_claim] => 238
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17874898
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/874898 | Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame | Jul 26, 2022 | Issued |
Array
(
[id] => 19582536
[patent_doc_number] => 12148664
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-11-19
[patent_title] => Semiconductor device and method having a through substrate via and an interconnect structure
[patent_app_type] => utility
[patent_app_number] => 17/874741
[patent_app_country] => US
[patent_app_date] => 2022-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 57
[patent_figures_cnt] => 57
[patent_no_of_words] => 12450
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 218
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17874741
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/874741 | Semiconductor device and method having a through substrate via and an interconnect structure | Jul 26, 2022 | Issued |
Array
(
[id] => 19260958
[patent_doc_number] => 12021024
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-25
[patent_title] => Semiconductor device including a semiconductor die and a plurality of antenna patterns
[patent_app_type] => utility
[patent_app_number] => 17/870798
[patent_app_country] => US
[patent_app_date] => 2022-07-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 13
[patent_no_of_words] => 6435
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 108
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17870798
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/870798 | Semiconductor device including a semiconductor die and a plurality of antenna patterns | Jul 20, 2022 | Issued |
Array
(
[id] => 19741206
[patent_doc_number] => 12218051
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-02-04
[patent_title] => Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts
[patent_app_type] => utility
[patent_app_number] => 17/869196
[patent_app_country] => US
[patent_app_date] => 2022-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 25
[patent_no_of_words] => 13878
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 180
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17869196
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/869196 | Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts | Jul 19, 2022 | Issued |
Array
(
[id] => 18759928
[patent_doc_number] => 11810968
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2023-11-07
[patent_title] => Method for induced quantum dots for material characterization, qubits, and quantum computers
[patent_app_type] => utility
[patent_app_number] => 17/864617
[patent_app_country] => US
[patent_app_date] => 2022-07-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
[patent_figures_cnt] => 26
[patent_no_of_words] => 8028
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 197
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17864617
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/864617 | Method for induced quantum dots for material characterization, qubits, and quantum computers | Jul 13, 2022 | Issued |
Array
(
[id] => 20390872
[patent_doc_number] => 12490623
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-02
[patent_title] => Display panel and display device including a cathode layer having a plurality of cathode units
[patent_app_type] => utility
[patent_app_number] => 17/759808
[patent_app_country] => US
[patent_app_date] => 2022-07-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 0
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 148
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17759808
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/759808 | Display panel and display device including a cathode layer having a plurality of cathode units | Jul 12, 2022 | Issued |
Array
(
[id] => 19108702
[patent_doc_number] => 11961816
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-16
[patent_title] => Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar
[patent_app_type] => utility
[patent_app_number] => 17/860291
[patent_app_country] => US
[patent_app_date] => 2022-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 35
[patent_no_of_words] => 11157
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 261
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860291
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/860291 | Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar | Jul 7, 2022 | Issued |
Array
(
[id] => 19108702
[patent_doc_number] => 11961816
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-16
[patent_title] => Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar
[patent_app_type] => utility
[patent_app_number] => 17/860291
[patent_app_country] => US
[patent_app_date] => 2022-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 35
[patent_no_of_words] => 11157
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 261
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860291
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/860291 | Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar | Jul 7, 2022 | Issued |
Array
(
[id] => 19108702
[patent_doc_number] => 11961816
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-16
[patent_title] => Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar
[patent_app_type] => utility
[patent_app_number] => 17/860291
[patent_app_country] => US
[patent_app_date] => 2022-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 35
[patent_no_of_words] => 11157
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 261
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860291
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/860291 | Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar | Jul 7, 2022 | Issued |
Array
(
[id] => 19108702
[patent_doc_number] => 11961816
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-16
[patent_title] => Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar
[patent_app_type] => utility
[patent_app_number] => 17/860291
[patent_app_country] => US
[patent_app_date] => 2022-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 35
[patent_no_of_words] => 11157
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 261
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860291
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/860291 | Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar | Jul 7, 2022 | Issued |
Array
(
[id] => 18113731
[patent_doc_number] => 20230006611
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-01-05
[patent_title] => AI-ASSISTED POWER AMPLIFIER OPTIMIZATION
[patent_app_type] => utility
[patent_app_number] => 17/857132
[patent_app_country] => US
[patent_app_date] => 2022-07-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4957
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17857132
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/857132 | AI-ASSISTED POWER AMPLIFIER OPTIMIZATION | Jul 3, 2022 | Pending |
Array
(
[id] => 17949385
[patent_doc_number] => 20220336404
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-10-20
[patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/857035
[patent_app_country] => US
[patent_app_date] => 2022-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8024
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17857035
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/857035 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Jul 2, 2022 | Issued |