
Kim Kwok Chu
Examiner (ID: 4012)
| Most Active Art Unit | 2506 |
| Art Unit(s) | 2752, 2653, 2627, 2516, 2899, 2651, 2506 |
| Total Applications | 1354 |
| Issued Applications | 1184 |
| Pending Applications | 15 |
| Abandoned Applications | 155 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18840187
[patent_doc_number] => 11848267
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-12-19
[patent_title] => Functional component within interconnect structure of semiconductor device and method of forming same
[patent_app_type] => utility
[patent_app_number] => 17/532672
[patent_app_country] => US
[patent_app_date] => 2021-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 7378
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17532672
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/532672 | Functional component within interconnect structure of semiconductor device and method of forming same | Nov 21, 2021 | Issued |
Array
(
[id] => 17463692
[patent_doc_number] => 20220076998
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-03-10
[patent_title] => SEMICONDUCTOR DEVICE HAVING A LANDING PAD WITH SPACERS
[patent_app_type] => utility
[patent_app_number] => 17/526118
[patent_app_country] => US
[patent_app_date] => 2021-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9273
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -4
[patent_words_short_claim] => 48
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17526118
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/526118 | Semiconductor device having a landing pad with spacers | Nov 14, 2021 | Issued |
Array
(
[id] => 18363069
[patent_doc_number] => 20230144660
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-05-11
[patent_title] => ELECTRONIC FUSE STRUCTURE EMBEDDED IN TOP VIA
[patent_app_type] => utility
[patent_app_number] => 17/453670
[patent_app_country] => US
[patent_app_date] => 2021-11-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7519
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453670
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/453670 | Electronic fuse structure embedded in top via | Nov 4, 2021 | Issued |
Array
(
[id] => 19964880
[patent_doc_number] => 12334399
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-06-17
[patent_title] => Structures and methods for fabricating staircase regions of a three-dimensional NAND memory device
[patent_app_type] => utility
[patent_app_number] => 17/451188
[patent_app_country] => US
[patent_app_date] => 2021-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 11
[patent_no_of_words] => 1124
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 293
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17451188
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/451188 | Structures and methods for fabricating staircase regions of a three-dimensional NAND memory device | Oct 17, 2021 | Issued |
Array
(
[id] => 19260943
[patent_doc_number] => 12021009
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-25
[patent_title] => Semiconductor device with plug structure
[patent_app_type] => utility
[patent_app_number] => 17/500456
[patent_app_country] => US
[patent_app_date] => 2021-10-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 7748
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17500456
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/500456 | Semiconductor device with plug structure | Oct 12, 2021 | Issued |
Array
(
[id] => 18782218
[patent_doc_number] => 11823984
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-11-21
[patent_title] => Method for fabricating semiconductor device with plug structure
[patent_app_type] => utility
[patent_app_number] => 17/497775
[patent_app_country] => US
[patent_app_date] => 2021-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 7759
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 191
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17497775
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/497775 | Method for fabricating semiconductor device with plug structure | Oct 7, 2021 | Issued |
Array
(
[id] => 18126133
[patent_doc_number] => 20230011752
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-01-12
[patent_title] => LOCAL INTERCONNECT
[patent_app_type] => utility
[patent_app_number] => 17/496414
[patent_app_country] => US
[patent_app_date] => 2021-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7405
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17496414
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/496414 | Local interconnect | Oct 6, 2021 | Issued |
Array
(
[id] => 17373733
[patent_doc_number] => 20220028785
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-01-27
[patent_title] => TOP VIA INTERCONNECT HAVING A LINE WITH A REDUCED BOTTOM DIMENSION
[patent_app_type] => utility
[patent_app_number] => 17/495980
[patent_app_country] => US
[patent_app_date] => 2021-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5873
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 114
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17495980
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/495980 | Top via interconnect having a line with a reduced bottom dimension | Oct 6, 2021 | Issued |
Array
(
[id] => 18284641
[patent_doc_number] => 20230100113
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-30
[patent_title] => BACKSIDE POWER RAILS
[patent_app_type] => utility
[patent_app_number] => 17/488389
[patent_app_country] => US
[patent_app_date] => 2021-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5995
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 64
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17488389
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/488389 | Buried power rails located in a base layer including first, second, and third etch stop layers | Sep 28, 2021 | Issued |
Array
(
[id] => 18081035
[patent_doc_number] => 20220406647
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-12-22
[patent_title] => Reducing Oxidation by Etching Sacrificial and Protection Layer Separately
[patent_app_type] => utility
[patent_app_number] => 17/480201
[patent_app_country] => US
[patent_app_date] => 2021-09-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7981
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17480201
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/480201 | Reducing oxidation by etching sacrificial and protection layer separately | Sep 20, 2021 | Issued |
Array
(
[id] => 17536661
[patent_doc_number] => 20220115270
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-04-14
[patent_title] => METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/480746
[patent_app_country] => US
[patent_app_date] => 2021-09-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 15447
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -14
[patent_words_short_claim] => 232
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17480746
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/480746 | Method of manufacturing semiconductor device | Sep 20, 2021 | Issued |
Array
(
[id] => 19168482
[patent_doc_number] => 11984395
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-05-14
[patent_title] => Semiconductor device containing bit lines separated by air gaps and methods for forming the same
[patent_app_type] => utility
[patent_app_number] => 17/479637
[patent_app_country] => US
[patent_app_date] => 2021-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 43
[patent_figures_cnt] => 58
[patent_no_of_words] => 22754
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 114
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17479637
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/479637 | Semiconductor device containing bit lines separated by air gaps and methods for forming the same | Sep 19, 2021 | Issued |
Array
(
[id] => 17339401
[patent_doc_number] => 20220005732
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-01-06
[patent_title] => TOP VIA WITH DAMASCENE LINE AND VIA
[patent_app_type] => utility
[patent_app_number] => 17/479346
[patent_app_country] => US
[patent_app_date] => 2021-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5236
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 53
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17479346
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/479346 | Top via with damascene line and via | Sep 19, 2021 | Issued |
Array
(
[id] => 18967506
[patent_doc_number] => 11901287
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-02-13
[patent_title] => Microelectronic devices with multiple step contacts extending to stepped tiers, and related systems and methods
[patent_app_type] => utility
[patent_app_number] => 17/476344
[patent_app_country] => US
[patent_app_date] => 2021-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 33
[patent_no_of_words] => 17070
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 120
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17476344
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/476344 | Microelectronic devices with multiple step contacts extending to stepped tiers, and related systems and methods | Sep 14, 2021 | Issued |
Array
(
[id] => 18250969
[patent_doc_number] => 20230078008
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-16
[patent_title] => VIA CD CONTROLLABLE TOP VIA STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 17/475463
[patent_app_country] => US
[patent_app_date] => 2021-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8890
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 57
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17475463
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/475463 | Via CD controllable top via structure | Sep 14, 2021 | Issued |
Array
(
[id] => 19199114
[patent_doc_number] => 11996363
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-05-28
[patent_title] => Interconnect structure including a heat dissipation layer and methods of forming the same
[patent_app_type] => utility
[patent_app_number] => 17/473573
[patent_app_country] => US
[patent_app_date] => 2021-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 6628
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17473573
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/473573 | Interconnect structure including a heat dissipation layer and methods of forming the same | Sep 12, 2021 | Issued |
Array
(
[id] => 17448711
[patent_doc_number] => 20220069216
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-03-03
[patent_title] => LOW RESISTANCE CROSSPOINT ARCHITECTURE
[patent_app_type] => utility
[patent_app_number] => 17/468167
[patent_app_country] => US
[patent_app_date] => 2021-09-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11293
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -10
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17468167
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/468167 | Low resistance crosspoint architecture | Sep 6, 2021 | Issued |
Array
(
[id] => 18241613
[patent_doc_number] => 20230073924
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-09
[patent_title] => SELF-ALIGNED BURIED POWER RAIL CAP FOR SEMICONDUCTOR DEVICES
[patent_app_type] => utility
[patent_app_number] => 17/466104
[patent_app_country] => US
[patent_app_date] => 2021-09-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11253
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 93
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17466104
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/466104 | Self-aligned buried power rail cap for semiconductor devices | Sep 2, 2021 | Issued |
Array
(
[id] => 17993250
[patent_doc_number] => 20220359287
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-11-10
[patent_title] => RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME
[patent_app_type] => utility
[patent_app_number] => 17/465499
[patent_app_country] => US
[patent_app_date] => 2021-09-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11755
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17465499
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/465499 | Recessed contacts at line end and methods forming same | Sep 1, 2021 | Issued |
Array
(
[id] => 18226051
[patent_doc_number] => 20230065045
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-02
[patent_title] => CONTACT FORMATION METHOD AND RELATED STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 17/461638
[patent_app_country] => US
[patent_app_date] => 2021-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9863
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17461638
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/461638 | Contact formation method and related structure | Aug 29, 2021 | Issued |