Search

Kimberley S. Wright

Examiner (ID: 10413, Phone: (571)270-3328 , Office: P/3637 )

Most Active Art Unit
3637
Art Unit(s)
3637
Total Applications
991
Issued Applications
671
Pending Applications
77
Abandoned Applications
264

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19153765 [patent_doc_number] => 11978688 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-07 [patent_title] => Semiconductor device having via protective layer [patent_app_type] => utility [patent_app_number] => 17/966864 [patent_app_country] => US [patent_app_date] => 2022-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 26 [patent_no_of_words] => 7527 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17966864 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/966864
Semiconductor device having via protective layer Oct 15, 2022 Issued
Array ( [id] => 19071274 [patent_doc_number] => 20240105700 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES [patent_app_type] => utility [patent_app_number] => 17/955253 [patent_app_country] => US [patent_app_date] => 2022-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12711 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17955253 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/955253
SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES Sep 27, 2022 Pending
Array ( [id] => 18122687 [patent_doc_number] => 20230008292 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-12 [patent_title] => MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS [patent_app_type] => utility [patent_app_number] => 17/932401 [patent_app_country] => US [patent_app_date] => 2022-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 23009 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17932401 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/932401
Methods of forming stacked semiconductors die assemblies Sep 14, 2022 Issued
Array ( [id] => 18494225 [patent_doc_number] => 11699646 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-11 [patent_title] => Semiconductor structure [patent_app_type] => utility [patent_app_number] => 17/943215 [patent_app_country] => US [patent_app_date] => 2022-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4522 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17943215 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/943215
Semiconductor structure Sep 12, 2022 Issued
Array ( [id] => 19621539 [patent_doc_number] => 20240407219 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => Display Substrate and Display Apparatus [patent_app_type] => utility [patent_app_number] => 18/697209 [patent_app_country] => US [patent_app_date] => 2022-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 22869 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18697209 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/697209
Display Substrate and Display Apparatus Sep 12, 2022 Pending
Array ( [id] => 18456390 [patent_doc_number] => 20230197672 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/930988 [patent_app_country] => US [patent_app_date] => 2022-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8148 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17930988 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/930988
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device Sep 8, 2022 Issued
Array ( [id] => 19980277 [patent_doc_number] => 12347765 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-01 [patent_title] => Semiconductor structure and method for fabricating same [patent_app_type] => utility [patent_app_number] => 17/903060 [patent_app_country] => US [patent_app_date] => 2022-09-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 19 [patent_no_of_words] => 1134 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17903060 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/903060
Semiconductor structure and method for fabricating same Sep 5, 2022 Issued
Array ( [id] => 19964941 [patent_doc_number] => 12334461 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-06-17 [patent_title] => Bonding structure using two oxide layers with different stress levels, and related method [patent_app_type] => utility [patent_app_number] => 17/929790 [patent_app_country] => US [patent_app_date] => 2022-09-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 16 [patent_no_of_words] => 1097 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17929790 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/929790
Bonding structure using two oxide layers with different stress levels, and related method Sep 5, 2022 Issued
Array ( [id] => 18254199 [patent_doc_number] => 20230081238 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => IMAGE SENSOR [patent_app_type] => utility [patent_app_number] => 17/901335 [patent_app_country] => US [patent_app_date] => 2022-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12073 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17901335 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/901335
Image sensor Aug 31, 2022 Issued
Array ( [id] => 19964949 [patent_doc_number] => 12334469 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-06-17 [patent_title] => Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methods [patent_app_type] => utility [patent_app_number] => 17/898330 [patent_app_country] => US [patent_app_date] => 2022-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 0 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17898330 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/898330
Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methods Aug 28, 2022 Issued
Array ( [id] => 19007916 [patent_doc_number] => 20240071987 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND METHODS [patent_app_type] => utility [patent_app_number] => 17/898356 [patent_app_country] => US [patent_app_date] => 2022-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5493 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17898356 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/898356
Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and associated systems and methods Aug 28, 2022 Issued
Array ( [id] => 19007870 [patent_doc_number] => 20240071941 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF [patent_app_type] => utility [patent_app_number] => 17/897648 [patent_app_country] => US [patent_app_date] => 2022-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8514 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17897648 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/897648
Semiconductor packages and methods of manufacturing thereof Aug 28, 2022 Issued
Array ( [id] => 19007911 [patent_doc_number] => 20240071982 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus [patent_app_type] => utility [patent_app_number] => 17/895321 [patent_app_country] => US [patent_app_date] => 2022-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7855 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17895321 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/895321
Device bonding apparatus and method of manufacturing a package using the apparatus Aug 24, 2022 Issued
Array ( [id] => 19951283 [patent_doc_number] => 12322654 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-06-03 [patent_title] => Semiconductor structure, method for forming same, and wafer on wafer bonding method [patent_app_type] => utility [patent_app_number] => 17/893218 [patent_app_country] => US [patent_app_date] => 2022-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 1148 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17893218 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/893218
Semiconductor structure, method for forming same, and wafer on wafer bonding method Aug 22, 2022 Issued
Array ( [id] => 20080852 [patent_doc_number] => 12354929 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-08 [patent_title] => Package structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/890262 [patent_app_country] => US [patent_app_date] => 2022-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 16 [patent_no_of_words] => 1046 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17890262 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/890262
Package structure and manufacturing method thereof Aug 16, 2022 Issued
Array ( [id] => 20267117 [patent_doc_number] => 12438116 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-07 [patent_title] => Bonding apparatus and method of controlling the same [patent_app_type] => utility [patent_app_number] => 17/888771 [patent_app_country] => US [patent_app_date] => 2022-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 0 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17888771 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/888771
Bonding apparatus and method of controlling the same Aug 15, 2022 Issued
Array ( [id] => 20346082 [patent_doc_number] => 12469817 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-11 [patent_title] => Support structure to reinforce stacked semiconductor wafers [patent_app_type] => utility [patent_app_number] => 17/888569 [patent_app_country] => US [patent_app_date] => 2022-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 30 [patent_no_of_words] => 6353 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17888569 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/888569
Support structure to reinforce stacked semiconductor wafers Aug 15, 2022 Issued
Array ( [id] => 18265665 [patent_doc_number] => 20230086907 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-23 [patent_title] => SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES [patent_app_type] => utility [patent_app_number] => 17/888906 [patent_app_country] => US [patent_app_date] => 2022-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5778 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17888906 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/888906
Semiconductor devices having crack-inhibiting structures Aug 15, 2022 Issued
Array ( [id] => 19886938 [patent_doc_number] => 12272670 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-08 [patent_title] => Integrated semiconductor packaging system with enhanced dielectric-to-dielectric bonding quality [patent_app_type] => utility [patent_app_number] => 17/819639 [patent_app_country] => US [patent_app_date] => 2022-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 9384 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17819639 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/819639
Integrated semiconductor packaging system with enhanced dielectric-to-dielectric bonding quality Aug 14, 2022 Issued
Array ( [id] => 18704795 [patent_doc_number] => 11791313 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-17 [patent_title] => Semiconductor package and method of forming the same [patent_app_type] => utility [patent_app_number] => 17/884524 [patent_app_country] => US [patent_app_date] => 2022-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 23 [patent_no_of_words] => 8914 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17884524 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/884524
Semiconductor package and method of forming the same Aug 8, 2022 Issued
Menu