Kin Chan Chen

Array ( [id] => 1050091 [patent_doc_number] => 06861370 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-03-01 [patent_title] => 'Bump formation method' [patent_app_type] => utility [patent_app_number] => 10/149651 [patent_app_country] => US [patent_app_date] => 2000-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 26 [patent_no_of_words] => 8004 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/861/06861370.pdf [firstpage_image] =>[orig_patent_app_number] => 10149651 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1532653 [patent_doc_number] => 06410438 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-25 [patent_title] => 'Method and device for polishing work edge' [patent_app_type] => B1 [patent_app_number] => 09/691946 [patent_app_country] => US [patent_app_date] => 2000-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 4579 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/410/06410438.pdf [firstpage_image] =>[orig_patent_app_number] => 09691946 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1412246 [patent_doc_number] => 06508953 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-01-21 [patent_title] => 'Slurry for chemical-mechanical polishing copper damascene structures' [patent_app_type] => B1 [patent_app_number] => 09/692729 [patent_app_country] => US [patent_app_date] => 2000-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3337 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/508/06508953.pdf [firstpage_image] =>[orig_patent_app_number] => 09692729 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1418687 [patent_doc_number] => 06514873 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-04 [patent_title] => 'Method for fabricating semiconductor device' [patent_app_type] => B1 [patent_app_number] => 09/688196 [patent_app_country] => US [patent_app_date] => 2000-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 86 [patent_no_of_words] => 13816 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/514/06514873.pdf [firstpage_image] =>[orig_patent_app_number] => 09688196 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1594699 [patent_doc_number] => 06383943 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-07 [patent_title] => 'Process for improving copper fill integrity' [patent_app_type] => B1 [patent_app_number] => 09/687160 [patent_app_country] => US [patent_app_date] => 2000-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 1949 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/383/06383943.pdf [firstpage_image] =>[orig_patent_app_number] => 09687160 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1453670 [patent_doc_number] => 06461975 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-08 [patent_title] => 'Method of etching insulating layer in semiconductor device' [patent_app_type] => B1 [patent_app_number] => 09/685097 [patent_app_country] => US [patent_app_date] => 2000-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3598 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/461/06461975.pdf [firstpage_image] =>[orig_patent_app_number] => 09685097 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1412828 [patent_doc_number] => 06524959 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-25 [patent_title] => 'Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control' [patent_app_type] => B1 [patent_app_number] => 09/686766 [patent_app_country] => US [patent_app_date] => 2000-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 4981 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/524/06524959.pdf [firstpage_image] =>[orig_patent_app_number] => 09686766 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1545447 [patent_doc_number] => 06444587 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-03 [patent_title] => 'Plasma etch method incorporating inert gas purge' [patent_app_type] => B1 [patent_app_number] => 09/677531 [patent_app_country] => US [patent_app_date] => 2000-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 4601 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/444/06444587.pdf [firstpage_image] =>[orig_patent_app_number] => 09677531 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1264594 [patent_doc_number] => 06660648 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-12-09 [patent_title] => 'Process for manufacture of semipermeable silicon nitride membranes' [patent_app_type] => B1 [patent_app_number] => 09/678418 [patent_app_country] => US [patent_app_date] => 2000-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1508 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/660/06660648.pdf [firstpage_image] =>[orig_patent_app_number] => 09678418 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1146784 [patent_doc_number] => 06770218 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-08-03 [patent_title] => 'Composition for polishing metal on semiconductor wafer and method of using same' [patent_app_type] => B1 [patent_app_number] => 09/672776 [patent_app_country] => US [patent_app_date] => 2000-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3703 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/770/06770218.pdf [firstpage_image] =>[orig_patent_app_number] => 09672776 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1367994 [patent_doc_number] => 06566271 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-05-20 [patent_title] => 'Method of producing a semiconductor surface covered with fluorine' [patent_app_type] => B1 [patent_app_number] => 09/671827 [patent_app_country] => US [patent_app_date] => 2000-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3087 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/566/06566271.pdf [firstpage_image] =>[orig_patent_app_number] => 09671827 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1520757 [patent_doc_number] => 06413875 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-02 [patent_title] => 'Process and apparatus for improving the performance of a temperature-sensitive etch process' [patent_app_type] => B1 [patent_app_number] => 09/666261 [patent_app_country] => US [patent_app_date] => 2000-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3293 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/413/06413875.pdf [firstpage_image] =>[orig_patent_app_number] => 09666261 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1152424 [patent_doc_number] => 06767840 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-07-27 [patent_title] => 'Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method' [patent_app_type] => B1 [patent_app_number] => 09/664715 [patent_app_country] => US [patent_app_date] => 2000-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 21 [patent_no_of_words] => 8107 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/767/06767840.pdf [firstpage_image] =>[orig_patent_app_number] => 09664715 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4276208 [patent_doc_number] => 06281136 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-28 [patent_title] => 'Apparatus for etching glass substrate' [patent_app_type] => 1 [patent_app_number] => 9/645331 [patent_app_country] => US [patent_app_date] => 2000-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2648 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/281/06281136.pdf [firstpage_image] =>[orig_patent_app_number] => 645331 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1467081 [patent_doc_number] => 06458708 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-01 [patent_title] => 'Method for forming metal wiring in semiconductor device' [patent_app_type] => B1 [patent_app_number] => 09/644840 [patent_app_country] => US [patent_app_date] => 2000-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 28 [patent_no_of_words] => 3384 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/458/06458708.pdf [firstpage_image] =>[orig_patent_app_number] => 09644840 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1299894 [patent_doc_number] => 06624086 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-09-23 [patent_title] => 'Effective solution and process to wet-etch metal-alloy films in semiconductor processing' [patent_app_type] => B1 [patent_app_number] => 09/640250 [patent_app_country] => US [patent_app_date] => 2000-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1262 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/624/06624086.pdf [firstpage_image] =>[orig_patent_app_number] => 09640250 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1056043 [patent_doc_number] => 06855266 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-02-15 [patent_title] => 'Polishing system with stopping compound and method of its use' [patent_app_type] => utility [patent_app_number] => 09/636246 [patent_app_country] => US [patent_app_date] => 2000-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8377 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/855/06855266.pdf [firstpage_image] =>[orig_patent_app_number] => 09636246 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1416926 [patent_doc_number] => 06509274 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-01-21 [patent_title] => 'Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate' [patent_app_type] => B1 [patent_app_number] => 09/632486 [patent_app_country] => US [patent_app_date] => 2000-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 20 [patent_no_of_words] => 2145 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/509/06509274.pdf [firstpage_image] =>[orig_patent_app_number] => 09632486 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1397438 [patent_doc_number] => 06531404 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-03-11 [patent_title] => 'Method of etching titanium nitride' [patent_app_type] => B1 [patent_app_number] => 09/632455 [patent_app_country] => US [patent_app_date] => 2000-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 5388 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/531/06531404.pdf [firstpage_image] =>[orig_patent_app_number] => 09632455 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1458927 [patent_doc_number] => 06426301 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-30 [patent_title] => 'Reduction of via etch charging damage through the use of a conducting hard mask' [patent_app_type] => B1 [patent_app_number] => 09/628822 [patent_app_country] => US [patent_app_date] => 2000-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 16 [patent_no_of_words] => 3862 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/426/06426301.pdf [firstpage_image] =>[orig_patent_app_number] => 09628822 [rel_patent_id] =>[rel_patent_doc_number] =>)