Kiran B. Patel

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Array ( [id] => 20033681 [patent_doc_number] => 20250171903 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-05-29 [patent_title] => ELECTRODE FILAMENT CONNECTION MEMBER, CHEMICAL VAPOR DEPOSITION APPARATUS, AND METHOD FOR MANUFACTURING RECORDING MEDIUM SUBSTRATE [patent_app_type] => utility [patent_app_number] => 19/040221 [patent_app_country] => US [patent_app_date] => 2025-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2345 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -1 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19040221 [rel_patent_id] =>[rel_patent_doc_number] =>)

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Array ( [id] => 19684517 [patent_doc_number] => 20250003062 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-02 [patent_title] => MATERIAL LAYER DEPOSITION METHODS, SEMICONDUCTOR PROCESSING SYSTEMS, AND COMPUTER PROGRAM PRODUCTS FOR CONTROLLING THICKNESS OF PRECOAT MATERIAL LAYERS IN SEMICONDUCTOR PROCESSING SYSTEMS [patent_app_type] => utility [patent_app_number] => 18/755620 [patent_app_country] => US [patent_app_date] => 2024-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12562 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18755620 [rel_patent_id] =>[rel_patent_doc_number] =>)

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