Koosha Sharifi-tafreshi
Examiner (ID: 1458, Phone: (571)270-5897 , Office: P/2623 )
Most Active Art Unit | 2623 |
Art Unit(s) | 2623, 2629, 2695 |
Total Applications | 1151 |
Issued Applications | 889 |
Pending Applications | 55 |
Abandoned Applications | 207 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 9844811
[patent_doc_number] => 08946729
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-02-03
[patent_title] => 'Light emitting diode'
[patent_app_type] => utility
[patent_app_number] => 13/912476
[patent_app_country] => US
[patent_app_date] => 2013-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13912476
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/912476 | Light emitting diode | Jun 6, 2013 | Issued |
Array
(
[id] => 9081538
[patent_doc_number] => 20130267069
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-10-10
[patent_title] => 'METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/905893
[patent_app_country] => US
[patent_app_date] => 2013-05-30
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/905893 | Method of manufacturing a semiconductor device | May 29, 2013 | Issued |
Array
(
[id] => 9121533
[patent_doc_number] => 20130288455
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-10-31
[patent_title] => 'METHOD OF FORMING A FREESTANDING SEMICONDUCTOR WAFER'
[patent_app_type] => utility
[patent_app_number] => 13/853567
[patent_app_country] => US
[patent_app_date] => 2013-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/853567 | Method of forming a freestanding semiconductor wafer | Mar 28, 2013 | Issued |
Array
(
[id] => 9081555
[patent_doc_number] => 20130267085
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-10-10
[patent_title] => 'METHODS FOR FABRICATING A METAL STRUCTURE FOR A SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/852346
[patent_app_country] => US
[patent_app_date] => 2013-03-28
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/852346 | Methods for fabricating a metal structure for a semiconductor device | Mar 27, 2013 | Issued |
Array
(
[id] => 9148457
[patent_doc_number] => 20130302980
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-11-14
[patent_title] => 'TUNGSTEN FEATURE FILL'
[patent_app_type] => utility
[patent_app_number] => 13/851885
[patent_app_country] => US
[patent_app_date] => 2013-03-27
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13851885
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/851885 | Tungsten feature fill | Mar 26, 2013 | Issued |
Array
(
[id] => 9081546
[patent_doc_number] => 20130267076
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-10-10
[patent_title] => 'WAFER DICING USING HYBRID MULTI-STEP LASER SCRIBING PROCESS WITH PLASMA ETCH'
[patent_app_type] => utility
[patent_app_number] => 13/851442
[patent_app_country] => US
[patent_app_date] => 2013-03-27
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13851442
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/851442 | Wafer dicing used hybrid multi-step laser scribing process with plasma etch | Mar 26, 2013 | Issued |
Array
(
[id] => 9054692
[patent_doc_number] => 20130252406
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-09-26
[patent_title] => 'Techniques for drying and annealing thermoelectric powders'
[patent_app_type] => utility
[patent_app_number] => 13/849692
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[patent_app_date] => 2013-03-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/849692 | Techniques for drying and annealing thermoelectric powders | Mar 24, 2013 | Abandoned |
Array
(
[id] => 9118323
[patent_doc_number] => 20130285245
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-10-31
[patent_title] => 'MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURES'
[patent_app_type] => utility
[patent_app_number] => 13/849562
[patent_app_country] => US
[patent_app_date] => 2013-03-25
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[patent_drawing_sheets_cnt] => 9
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/849562 | MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURES | Mar 24, 2013 | Abandoned |
Array
(
[id] => 9844142
[patent_doc_number] => 08946057
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-02-03
[patent_title] => 'Laser and plasma etch wafer dicing using UV-curable adhesive film'
[patent_app_type] => utility
[patent_app_number] => 13/847964
[patent_app_country] => US
[patent_app_date] => 2013-03-20
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/847964 | Laser and plasma etch wafer dicing using UV-curable adhesive film | Mar 19, 2013 | Issued |
Array
(
[id] => 9068782
[patent_doc_number] => 20130260538
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-10-03
[patent_title] => 'METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE'
[patent_app_type] => utility
[patent_app_number] => 13/844894
[patent_app_country] => US
[patent_app_date] => 2013-03-16
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13844894
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/844894 | METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE | Mar 15, 2013 | Abandoned |
Array
(
[id] => 9662196
[patent_doc_number] => 08809172
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-08-19
[patent_title] => 'Self-aligned patterning for deep implantation in a semiconductor structure'
[patent_app_type] => utility
[patent_app_number] => 13/839888
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/839888 | Self-aligned patterning for deep implantation in a semiconductor structure | Mar 14, 2013 | Issued |
Array
(
[id] => 9339014
[patent_doc_number] => 20140065796
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-03-06
[patent_title] => 'GROUP III NITRIDE WAFER AND ITS PRODUCTION METHOD'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/835636 | Group III nitride wafer and its production method | Mar 14, 2013 | Issued |
Array
(
[id] => 10844476
[patent_doc_number] => 08871652
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[patent_title] => 'Method of manufacturing a semiconductor template'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/834996 | Method of manufacturing a semiconductor template | Mar 14, 2013 | Issued |
Array
(
[id] => 9174535
[patent_doc_number] => 20130316520
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-11-28
[patent_title] => 'METHODS OF FORMING CONTACT REGIONS USING SACRIFICIAL LAYERS'
[patent_app_type] => utility
[patent_app_number] => 13/839161
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/839161 | Methods of forming contact regions using sacrificial layers | Mar 14, 2013 | Issued |
Array
(
[id] => 9068788
[patent_doc_number] => 20130260544
[patent_country] => US
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[patent_title] => 'TECHNIQUE FOR PROCESSING A SUBSTRATE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/832578 | Technique for processing a substrate | Mar 14, 2013 | Issued |
Array
(
[id] => 9503435
[patent_doc_number] => 08741748
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[patent_title] => 'Method to grow group III-nitrides on copper using passivation layers'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/836594 | Method to grow group III-nitrides on copper using passivation layers | Mar 14, 2013 | Issued |
Array
(
[id] => 9831818
[patent_doc_number] => 08940631
[patent_country] => US
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[patent_issue_date] => 2015-01-27
[patent_title] => 'Methods of forming coaxial feedthroughs for 3D integrated circuits'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/843608 | Methods of forming coaxial feedthroughs for 3D integrated circuits | Mar 14, 2013 | Issued |
Array
(
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[patent_title] => 'METHOD OF FORMING A LAMINATED SEMICONDUCTOR FILM'
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/826163 | Semiconductor device having metal lines with slits | Mar 13, 2013 | Issued |