
Lalrinfamkim Hmar Malsawma
Examiner (ID: 15570)
| Most Active Art Unit | 2892 |
| Art Unit(s) | 2825, 2823, 2892 |
| Total Applications | 1945 |
| Issued Applications | 1698 |
| Pending Applications | 102 |
| Abandoned Applications | 180 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
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[patent_issue_date] => 2012-08-07
[patent_title] => 'Configuration and method to form MOSFET devices with low resistance silicide gate and mesa contact regions'
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[patent_app_number] => 13/361950
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Array
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[patent_issue_date] => 2012-10-30
[patent_title] => 'Wafer level package and fabrication method'
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Array
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[patent_issue_date] => 2012-10-02
[patent_title] => 'Stub minimization for multi-die wirebond assemblies with orthogonal windows'
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[patent_app_number] => 13/354772
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[patent_app_date] => 2012-01-20
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Array
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[patent_issue_date] => 2013-07-02
[patent_title] => 'Deep contacts of integrated electronic devices based on regions implanted through trenches'
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[patent_app_number] => 13/349416
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Array
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[patent_doc_number] => 08471332
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[patent_issue_date] => 2013-06-25
[patent_title] => 'Enhancing Schottky breakdown voltage (BV) without affecting an integrated MOSFET-Schottky device layout'
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Array
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Array
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[patent_issue_date] => 2012-07-31
[patent_title] => 'Wafer level package having a stress relief spacer and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 13/346191
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[patent_app_date] => 2012-01-09
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/346191 | Wafer level package having a stress relief spacer and manufacturing method thereof | Jan 8, 2012 | Issued |
Array
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[patent_doc_number] => 09263696
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[patent_issue_date] => 2016-02-16
[patent_title] => 'Organic semiconductor component comprising a doped hole conductor layer'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/982053 | Organic semiconductor component comprising a doped hole conductor layer | Jan 4, 2012 | Issued |
Array
(
[id] => 8317869
[patent_doc_number] => 08232651
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-07-31
[patent_title] => 'Bond pad for wafer and package for CMOS imager'
[patent_app_type] => utility
[patent_app_number] => 13/343422
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Array
(
[id] => 10501067
[patent_doc_number] => 09229466
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[patent_issue_date] => 2016-01-05
[patent_title] => 'Fully integrated voltage regulators for multi-stack integrated circuit architectures'
[patent_app_type] => utility
[patent_app_number] => 13/977460
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/977460 | Fully integrated voltage regulators for multi-stack integrated circuit architectures | Dec 30, 2011 | Issued |
Array
(
[id] => 9145290
[patent_doc_number] => 20130299813
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[patent_kind] => A1
[patent_issue_date] => 2013-11-14
[patent_title] => 'ORGANIC EL PANEL AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 13/982007
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/982007 | Organic EL panel and manufacturing method thereof | Dec 1, 2011 | Issued |
Array
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[id] => 8237306
[patent_doc_number] => 20120146035
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[patent_issue_date] => 2012-06-14
[patent_title] => 'DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME'
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Array
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[id] => 8730148
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[patent_title] => 'THIN FILM TRANSISTOR'
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Array
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Array
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[id] => 10831884
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[patent_issue_date] => 2014-10-14
[patent_title] => 'Structure and method for LED with phosphor coating'
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Array
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/308199 | Coated color-converting particles and associated devices, systems, and methods | Nov 29, 2011 | Issued |