
Lalrinfamkim Hmar Malsawma
Examiner (ID: 2370)
| Most Active Art Unit | 2892 |
| Art Unit(s) | 2823, 2892, 2825 |
| Total Applications | 1951 |
| Issued Applications | 1709 |
| Pending Applications | 105 |
| Abandoned Applications | 179 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6996798
[patent_doc_number] => 20050136576
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-23
[patent_title] => 'Plasma treatment method and plasma treatment apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/002903
[patent_app_country] => US
[patent_app_date] => 2004-12-03
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[pdf_file] => publications/A1/0136/20050136576.pdf
[firstpage_image] =>[orig_patent_app_number] => 11002903
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/002903 | Plasma treatment method and plasma treatment apparatus | Dec 2, 2004 | Abandoned |
Array
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[patent_doc_number] => 20050139982
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-30
[patent_title] => 'Method of manufacturing a semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/002804
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Array
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[patent_doc_number] => 20060118892
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[patent_issue_date] => 2006-06-08
[patent_title] => 'Methods and Structures to Produce a Strain-Inducing Layer in a Semiconductor Device'
[patent_app_type] => utility
[patent_app_number] => 10/904874
[patent_app_country] => US
[patent_app_date] => 2004-12-02
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/904874 | Methods and Structures to Produce a Strain-Inducing Layer in a Semiconductor Device | Dec 1, 2004 | Abandoned |
Array
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[patent_doc_number] => 07033870
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[patent_kind] => B1
[patent_issue_date] => 2006-04-25
[patent_title] => 'Semiconductor transistors with reduced gate-source/drain capacitances'
[patent_app_type] => utility
[patent_app_number] => 10/904783
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[patent_app_date] => 2004-11-29
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/904783 | Semiconductor transistors with reduced gate-source/drain capacitances | Nov 28, 2004 | Issued |
Array
(
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[patent_doc_number] => 07125737
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[patent_issue_date] => 2006-10-24
[patent_title] => 'Robust Group III light emitting diode for high reliability in standard packaging applications'
[patent_app_type] => utility
[patent_app_number] => 10/983983
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[patent_app_date] => 2004-11-08
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Array
(
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[patent_doc_number] => 07169687
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[patent_kind] => B2
[patent_issue_date] => 2007-01-30
[patent_title] => 'Laser micromachining method'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/980943 | Laser micromachining method | Nov 2, 2004 | Issued |
Array
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[patent_doc_number] => 07244629
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[patent_issue_date] => 2007-07-17
[patent_title] => 'Vertical cavity surface emitting laser diode and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/978346
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[patent_app_date] => 2004-11-02
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[pdf_file] => patents/07/244/07244629.pdf
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Array
(
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[patent_doc_number] => 20050101070
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-12
[patent_title] => 'Method of manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/978796
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Array
(
[id] => 6918197
[patent_doc_number] => 20050095758
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-05
[patent_title] => 'CMOS thin film transistor'
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Array
(
[id] => 535874
[patent_doc_number] => 07180157
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[patent_kind] => B2
[patent_issue_date] => 2007-02-20
[patent_title] => 'Bipolar transistor with a very narrow emitter feature'
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Array
(
[id] => 7154396
[patent_doc_number] => 20050082607
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[patent_kind] => A1
[patent_issue_date] => 2005-04-21
[patent_title] => 'Semiconductor device and manufacturing method therefor'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/976855 | Insulated gate transistor | Oct 31, 2004 | Issued |
Array
(
[id] => 6918256
[patent_doc_number] => 20050095817
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[patent_title] => 'Silicon wafer dividing method and apparatus'
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Array
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[patent_title] => 'Manufacturing method of thin film device substrate'
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Array
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[patent_title] => 'Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding'
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Array
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Array
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Array
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Array
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