Search

Lalrinfamkim Hmar Malsawma

Examiner (ID: 2370)

Most Active Art Unit
2892
Art Unit(s)
2823, 2892, 2825
Total Applications
1951
Issued Applications
1709
Pending Applications
105
Abandoned Applications
179

Applications

Application numberTitle of the applicationFiling DateStatus
10/920764 Integrated circuit with increased heat transfer Aug 17, 2004 Abandoned
Array ( [id] => 547891 [patent_doc_number] => 07166924 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-01-23 [patent_title] => 'Electronic packages with dice landed on wire bonds' [patent_app_type] => utility [patent_app_number] => 10/921014 [patent_app_country] => US [patent_app_date] => 2004-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 6323 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 173 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/166/07166924.pdf [firstpage_image] =>[orig_patent_app_number] => 10921014 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/921014
Electronic packages with dice landed on wire bonds Aug 16, 2004 Issued
Array ( [id] => 5588814 [patent_doc_number] => 20060038265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-02-23 [patent_title] => 'MULTI-PATH BAR BOND CONNECTOR FOR AN INTEGRATED CIRCUIT ASSEMBLY' [patent_app_type] => utility [patent_app_number] => 10/919864 [patent_app_country] => US [patent_app_date] => 2004-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2133 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20060038265.pdf [firstpage_image] =>[orig_patent_app_number] => 10919864 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/919864
Multi-path bar bond connector for an integrated circuit assembly Aug 16, 2004 Issued
Array ( [id] => 712329 [patent_doc_number] => 07057284 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-06-06 [patent_title] => 'Fine pitch low-cost flip chip substrate' [patent_app_type] => utility [patent_app_number] => 10/916743 [patent_app_country] => US [patent_app_date] => 2004-08-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2491 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/057/07057284.pdf [firstpage_image] =>[orig_patent_app_number] => 10916743 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/916743
Fine pitch low-cost flip chip substrate Aug 11, 2004 Issued
Array ( [id] => 6918306 [patent_doc_number] => 20050095867 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-05-05 [patent_title] => 'Method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/918114 [patent_app_country] => US [patent_app_date] => 2004-08-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6946 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0095/20050095867.pdf [firstpage_image] =>[orig_patent_app_number] => 10918114 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/918114
Method of manufacturing semiconductor device Aug 11, 2004 Abandoned
Array ( [id] => 7080647 [patent_doc_number] => 20050046027 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-03 [patent_title] => 'Semiconductor device having a capping layer including cobalt and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/916303 [patent_app_country] => US [patent_app_date] => 2004-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3335 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0046/20050046027.pdf [firstpage_image] =>[orig_patent_app_number] => 10916303 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/916303
Semiconductor device having a capping layer including cobalt and method of fabricating the same Aug 9, 2004 Issued
Array ( [id] => 5796542 [patent_doc_number] => 20060033219 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-02-16 [patent_title] => 'Low profile, chip-scale package and method of fabrication' [patent_app_type] => utility [patent_app_number] => 10/916194 [patent_app_country] => US [patent_app_date] => 2004-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4015 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0033/20060033219.pdf [firstpage_image] =>[orig_patent_app_number] => 10916194 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/916194
Low profile, chip-scale package and method of fabrication Aug 9, 2004 Issued
Array ( [id] => 526310 [patent_doc_number] => 07187076 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-03-06 [patent_title] => 'Interposer with integral heat sink' [patent_app_type] => utility [patent_app_number] => 10/913743 [patent_app_country] => US [patent_app_date] => 2004-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 12 [patent_no_of_words] => 4028 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/187/07187076.pdf [firstpage_image] =>[orig_patent_app_number] => 10913743 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/913743
Interposer with integral heat sink Aug 5, 2004 Issued
Array ( [id] => 5878126 [patent_doc_number] => 20060027906 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-02-09 [patent_title] => 'Exclusive memory structure applicable for multi media card and secure digital card' [patent_app_type] => utility [patent_app_number] => 10/911343 [patent_app_country] => US [patent_app_date] => 2004-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 603 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0027/20060027906.pdf [firstpage_image] =>[orig_patent_app_number] => 10911343 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/911343
Exclusive memory structure applicable for multi media card and secure digital card Aug 2, 2004 Abandoned
Array ( [id] => 7148005 [patent_doc_number] => 20050023679 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-03 [patent_title] => 'Substrate with reinforced contact pad structure' [patent_app_type] => utility [patent_app_number] => 10/902003 [patent_app_country] => US [patent_app_date] => 2004-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1952 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20050023679.pdf [firstpage_image] =>[orig_patent_app_number] => 10902003 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/902003
Substrate with reinforced contact pad structure Jul 29, 2004 Issued
Array ( [id] => 500292 [patent_doc_number] => 07205216 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-04-17 [patent_title] => 'Modification of electrical properties for semiconductor wafers' [patent_app_type] => utility [patent_app_number] => 10/710700 [patent_app_country] => US [patent_app_date] => 2004-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 10 [patent_no_of_words] => 3837 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/205/07205216.pdf [firstpage_image] =>[orig_patent_app_number] => 10710700 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/710700
Modification of electrical properties for semiconductor wafers Jul 28, 2004 Issued
Array ( [id] => 491540 [patent_doc_number] => 07215014 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-08 [patent_title] => 'Solderable metal finish for integrated circuit package leads and method for forming' [patent_app_type] => utility [patent_app_number] => 10/901844 [patent_app_country] => US [patent_app_date] => 2004-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 3075 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/215/07215014.pdf [firstpage_image] =>[orig_patent_app_number] => 10901844 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/901844
Solderable metal finish for integrated circuit package leads and method for forming Jul 28, 2004 Issued
Array ( [id] => 7022918 [patent_doc_number] => 20050017312 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-27 [patent_title] => 'Barrier in gate stack for improved gate dielectric integrity' [patent_app_type] => utility [patent_app_number] => 10/901552 [patent_app_country] => US [patent_app_date] => 2004-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3667 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0017/20050017312.pdf [firstpage_image] =>[orig_patent_app_number] => 10901552 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/901552
Barrier in gate stack for improved gate dielectric integrity Jul 26, 2004 Issued
Array ( [id] => 7429054 [patent_doc_number] => 20040266048 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-30 [patent_title] => 'Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices' [patent_app_type] => new [patent_app_number] => 10/899474 [patent_app_country] => US [patent_app_date] => 2004-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 9368 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0266/20040266048.pdf [firstpage_image] =>[orig_patent_app_number] => 10899474 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/899474
Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices Jul 25, 2004 Issued
Array ( [id] => 7022980 [patent_doc_number] => 20050017374 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-27 [patent_title] => 'Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same' [patent_app_type] => utility [patent_app_number] => 10/896993 [patent_app_country] => US [patent_app_date] => 2004-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5716 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0017/20050017374.pdf [firstpage_image] =>[orig_patent_app_number] => 10896993 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/896993
Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same Jul 22, 2004 Issued
Array ( [id] => 751814 [patent_doc_number] => 07023044 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-04-04 [patent_title] => 'Stacked capacitor-type semiconductor storage device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 10/893914 [patent_app_country] => US [patent_app_date] => 2004-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 49 [patent_no_of_words] => 5227 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/023/07023044.pdf [firstpage_image] =>[orig_patent_app_number] => 10893914 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/893914
Stacked capacitor-type semiconductor storage device and manufacturing method thereof Jul 19, 2004 Issued
Array ( [id] => 7235551 [patent_doc_number] => 20040256739 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-23 [patent_title] => 'Semiconductor device and method of manufacture thereof, circuit board and electronic instrument' [patent_app_type] => new [patent_app_number] => 10/893993 [patent_app_country] => US [patent_app_date] => 2004-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5760 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 3 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0256/20040256739.pdf [firstpage_image] =>[orig_patent_app_number] => 10893993 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/893993
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument Jul 19, 2004 Abandoned
Array ( [id] => 457729 [patent_doc_number] => 07245023 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-07-17 [patent_title] => 'Semiconductor chip assembly with solder-attached ground plane' [patent_app_type] => utility [patent_app_number] => 10/894593 [patent_app_country] => US [patent_app_date] => 2004-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 48 [patent_figures_cnt] => 182 [patent_no_of_words] => 32713 [patent_no_of_claims] => 230 [patent_no_of_ind_claims] => 37 [patent_words_short_claim] => 35 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/245/07245023.pdf [firstpage_image] =>[orig_patent_app_number] => 10894593 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/894593
Semiconductor chip assembly with solder-attached ground plane Jul 19, 2004 Issued
Array ( [id] => 642814 [patent_doc_number] => 07122889 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-10-17 [patent_title] => 'Semiconductor module' [patent_app_type] => utility [patent_app_number] => 10/894693 [patent_app_country] => US [patent_app_date] => 2004-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 13 [patent_no_of_words] => 4477 [patent_no_of_claims] => 53 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/122/07122889.pdf [firstpage_image] =>[orig_patent_app_number] => 10894693 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/894693
Semiconductor module Jul 18, 2004 Issued
Array ( [id] => 7338563 [patent_doc_number] => 20040245606 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-09 [patent_title] => 'In-plane on-chip decoupling capacitors and method for making same' [patent_app_type] => new [patent_app_number] => 10/890716 [patent_app_country] => US [patent_app_date] => 2004-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4972 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 3 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0245/20040245606.pdf [firstpage_image] =>[orig_patent_app_number] => 10890716 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/890716
In-plane on-chip decoupling capacitors and method for making same Jul 12, 2004 Issued
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