
Lalrinfamkim Hmar Malsawma
Examiner (ID: 2370)
| Most Active Art Unit | 2892 |
| Art Unit(s) | 2823, 2892, 2825 |
| Total Applications | 1951 |
| Issued Applications | 1709 |
| Pending Applications | 105 |
| Abandoned Applications | 179 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
| 10/920764 | Integrated circuit with increased heat transfer | Aug 17, 2004 | Abandoned |
Array
(
[id] => 547891
[patent_doc_number] => 07166924
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-01-23
[patent_title] => 'Electronic packages with dice landed on wire bonds'
[patent_app_type] => utility
[patent_app_number] => 10/921014
[patent_app_country] => US
[patent_app_date] => 2004-08-17
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 6323
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[pdf_file] => patents/07/166/07166924.pdf
[firstpage_image] =>[orig_patent_app_number] => 10921014
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/921014 | Electronic packages with dice landed on wire bonds | Aug 16, 2004 | Issued |
Array
(
[id] => 5588814
[patent_doc_number] => 20060038265
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-02-23
[patent_title] => 'MULTI-PATH BAR BOND CONNECTOR FOR AN INTEGRATED CIRCUIT ASSEMBLY'
[patent_app_type] => utility
[patent_app_number] => 10/919864
[patent_app_country] => US
[patent_app_date] => 2004-08-17
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[firstpage_image] =>[orig_patent_app_number] => 10919864
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/919864 | Multi-path bar bond connector for an integrated circuit assembly | Aug 16, 2004 | Issued |
Array
(
[id] => 712329
[patent_doc_number] => 07057284
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-06-06
[patent_title] => 'Fine pitch low-cost flip chip substrate'
[patent_app_type] => utility
[patent_app_number] => 10/916743
[patent_app_country] => US
[patent_app_date] => 2004-08-12
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[firstpage_image] =>[orig_patent_app_number] => 10916743
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/916743 | Fine pitch low-cost flip chip substrate | Aug 11, 2004 | Issued |
Array
(
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[patent_doc_number] => 20050095867
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-05
[patent_title] => 'Method of manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/918114
[patent_app_country] => US
[patent_app_date] => 2004-08-12
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 10918114
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/918114 | Method of manufacturing semiconductor device | Aug 11, 2004 | Abandoned |
Array
(
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[patent_doc_number] => 20050046027
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-03
[patent_title] => 'Semiconductor device having a capping layer including cobalt and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 10/916303
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[patent_app_date] => 2004-08-10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/916303 | Semiconductor device having a capping layer including cobalt and method of fabricating the same | Aug 9, 2004 | Issued |
Array
(
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[patent_doc_number] => 20060033219
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[patent_kind] => A1
[patent_issue_date] => 2006-02-16
[patent_title] => 'Low profile, chip-scale package and method of fabrication'
[patent_app_type] => utility
[patent_app_number] => 10/916194
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Array
(
[id] => 526310
[patent_doc_number] => 07187076
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[patent_kind] => B2
[patent_issue_date] => 2007-03-06
[patent_title] => 'Interposer with integral heat sink'
[patent_app_type] => utility
[patent_app_number] => 10/913743
[patent_app_country] => US
[patent_app_date] => 2004-08-06
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/913743 | Interposer with integral heat sink | Aug 5, 2004 | Issued |
Array
(
[id] => 5878126
[patent_doc_number] => 20060027906
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-02-09
[patent_title] => 'Exclusive memory structure applicable for multi media card and secure digital card'
[patent_app_type] => utility
[patent_app_number] => 10/911343
[patent_app_country] => US
[patent_app_date] => 2004-08-03
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0027/20060027906.pdf
[firstpage_image] =>[orig_patent_app_number] => 10911343
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/911343 | Exclusive memory structure applicable for multi media card and secure digital card | Aug 2, 2004 | Abandoned |
Array
(
[id] => 7148005
[patent_doc_number] => 20050023679
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-03
[patent_title] => 'Substrate with reinforced contact pad structure'
[patent_app_type] => utility
[patent_app_number] => 10/902003
[patent_app_country] => US
[patent_app_date] => 2004-07-30
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[pdf_file] => publications/A1/0023/20050023679.pdf
[firstpage_image] =>[orig_patent_app_number] => 10902003
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/902003 | Substrate with reinforced contact pad structure | Jul 29, 2004 | Issued |
Array
(
[id] => 500292
[patent_doc_number] => 07205216
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-04-17
[patent_title] => 'Modification of electrical properties for semiconductor wafers'
[patent_app_type] => utility
[patent_app_number] => 10/710700
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[pdf_file] => patents/07/205/07205216.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/710700 | Modification of electrical properties for semiconductor wafers | Jul 28, 2004 | Issued |
Array
(
[id] => 491540
[patent_doc_number] => 07215014
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[patent_issue_date] => 2007-05-08
[patent_title] => 'Solderable metal finish for integrated circuit package leads and method for forming'
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Array
(
[id] => 7022918
[patent_doc_number] => 20050017312
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[patent_title] => 'Barrier in gate stack for improved gate dielectric integrity'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/901552 | Barrier in gate stack for improved gate dielectric integrity | Jul 26, 2004 | Issued |
Array
(
[id] => 7429054
[patent_doc_number] => 20040266048
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[patent_title] => 'Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices'
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Array
(
[id] => 7022980
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[patent_title] => 'Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same'
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[patent_app_number] => 10/896993
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Array
(
[id] => 751814
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Array
(
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Array
(
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Array
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Array
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