
Lan Vinh
Examiner (ID: 2362, Phone: (571)272-1471 , Office: P/1713 )
| Most Active Art Unit | 1713 |
| Art Unit(s) | 1765, 1792, 1713 |
| Total Applications | 1662 |
| Issued Applications | 1401 |
| Pending Applications | 46 |
| Abandoned Applications | 218 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7039641
[patent_doc_number] => 20050159002
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-07-21
[patent_title] => 'Sputtered spring films with low stress anisotropy'
[patent_app_type] => utility
[patent_app_number] => 11/029618
[patent_app_country] => US
[patent_app_date] => 2005-01-05
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[pdf_file] => publications/A1/0159/20050159002.pdf
[firstpage_image] =>[orig_patent_app_number] => 11029618
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/029618 | Sputtered spring films with low stress anisotropy | Jan 4, 2005 | Issued |
Array
(
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[patent_doc_number] => 20080035609
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-14
[patent_title] => 'System And Method for Selective Etching Of Silicon Nitride During Substrate Processing'
[patent_app_type] => utility
[patent_app_number] => 10/585229
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[pdf_file] => publications/A1/0035/20080035609.pdf
[firstpage_image] =>[orig_patent_app_number] => 10585229
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/585229 | System and method for selective etching of silicon nitride during substrate processing | Dec 29, 2004 | Issued |
Array
(
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[patent_doc_number] => 07700494
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-20
[patent_title] => 'Low-pressure removal of photoresist and etch residue'
[patent_app_type] => utility
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[pdf_file] => patents/07/700/07700494.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/024747 | Low-pressure removal of photoresist and etch residue | Dec 29, 2004 | Issued |
Array
(
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[patent_issue_date] => 2007-07-05
[patent_title] => 'Method for setting plasma chamber having an adaptive plasma source, plasma etching method using the same and manufacturing method for adaptive plasma source'
[patent_app_type] => utility
[patent_app_number] => 10/583976
[patent_app_country] => US
[patent_app_date] => 2004-12-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0151/20070151947.pdf
[firstpage_image] =>[orig_patent_app_number] => 10583976
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/583976 | Method for setting plasma chamber having an adaptive plasma source, plasma etching method using the same and manufacturing method for adaptive plasma source | Dec 21, 2004 | Abandoned |
Array
(
[id] => 5645536
[patent_doc_number] => 20060131268
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[patent_title] => 'Non-contact discrete removal of substrate surface contaminants/coatings, and method, apparatus, and system for implementing the same'
[patent_app_type] => utility
[patent_app_number] => 11/020431
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/020431 | Non-contact discrete removal of substrate surface contaminants/coatings, and method, apparatus, and system for implementing the same | Dec 20, 2004 | Abandoned |
Array
(
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[patent_issue_date] => 2006-10-24
[patent_title] => 'Large area electronic device with high and low resolution patterned film features'
[patent_app_type] => utility
[patent_app_number] => 11/019037
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/019037 | Large area electronic device with high and low resolution patterned film features | Dec 19, 2004 | Issued |
Array
(
[id] => 453051
[patent_doc_number] => 07247573
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-07-24
[patent_title] => 'Process for forming tapered trenches in a dielectric material'
[patent_app_type] => utility
[patent_app_number] => 11/018213
[patent_app_country] => US
[patent_app_date] => 2004-12-20
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/247/07247573.pdf
[firstpage_image] =>[orig_patent_app_number] => 11018213
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/018213 | Process for forming tapered trenches in a dielectric material | Dec 19, 2004 | Issued |
| 11/016155 | Method and apparatus for plasma diagnostics and the measurement of thin films | Dec 16, 2004 | Abandoned |
Array
(
[id] => 5216997
[patent_doc_number] => 20070158308
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Method for manufacturing single-side mirror surface wafer'
[patent_app_type] => utility
[patent_app_number] => 10/596177
[patent_app_country] => US
[patent_app_date] => 2004-12-03
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/596177 | Method for manufacturing single-side mirror surface wafer | Dec 2, 2004 | Issued |
Array
(
[id] => 7066573
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[patent_kind] => A1
[patent_issue_date] => 2005-11-03
[patent_title] => 'Plasma processing method'
[patent_app_type] => utility
[patent_app_number] => 11/002265
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/002265 | Plasma processing method | Dec 2, 2004 | Issued |
Array
(
[id] => 5745400
[patent_doc_number] => 20060108324
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[patent_kind] => A1
[patent_issue_date] => 2006-05-25
[patent_title] => 'Process for removing a residue from a metal structure on a semiconductor substrate'
[patent_app_type] => utility
[patent_app_number] => 10/995025
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/995025 | Process for removing a residue from a metal structure on a semiconductor substrate | Nov 21, 2004 | Issued |
Array
(
[id] => 534660
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[patent_issue_date] => 2007-02-06
[patent_title] => 'Method for non-destructive removal of cured epoxy from wafer backside'
[patent_app_type] => utility
[patent_app_number] => 10/989753
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/989753 | Method for non-destructive removal of cured epoxy from wafer backside | Nov 14, 2004 | Issued |
Array
(
[id] => 482794
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[patent_title] => 'Method for etching of a silicon substrate and etching apparatus'
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Array
(
[id] => 4982619
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[patent_title] => 'Stacked pad and method of use'
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Array
(
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Array
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Array
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Array
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Array
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