
Lan Vinh
Examiner (ID: 2362, Phone: (571)272-1471 , Office: P/1713 )
| Most Active Art Unit | 1713 |
| Art Unit(s) | 1765, 1792, 1713 |
| Total Applications | 1662 |
| Issued Applications | 1401 |
| Pending Applications | 46 |
| Abandoned Applications | 218 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7439751
[patent_doc_number] => 20040050496
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-03-18
[patent_title] => 'Plasma processing apparatus and plasma processing method'
[patent_app_type] => new
[patent_app_number] => 10/621497
[patent_app_country] => US
[patent_app_date] => 2003-07-17
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[pdf_file] => publications/A1/0050/20040050496.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/621497 | Plasma processing apparatus and plasma processing method | Jul 16, 2003 | Issued |
Array
(
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[patent_issue_date] => 2005-01-20
[patent_title] => 'Substrate patterning integration'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/621744 | Substrate patterning integration | Jul 15, 2003 | Abandoned |
Array
(
[id] => 515155
[patent_doc_number] => 07192874
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[patent_kind] => B2
[patent_issue_date] => 2007-03-20
[patent_title] => 'Method for reducing foreign material concentrations in etch chambers'
[patent_app_type] => utility
[patent_app_number] => 10/604367
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[patent_app_date] => 2003-07-15
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/604367 | Method for reducing foreign material concentrations in etch chambers | Jul 14, 2003 | Issued |
Array
(
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[patent_issue_date] => 2004-01-22
[patent_title] => 'Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten'
[patent_app_type] => new
[patent_app_number] => 10/620002
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/620002 | Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten | Jul 13, 2003 | Abandoned |
Array
(
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[patent_title] => 'Method for fabricating semiconductor device'
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Array
(
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[patent_title] => 'Method and structure for a self-aligned silicided word line and polysilicon plug during the formation of a semiconductor device'
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Array
(
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[patent_title] => 'Method for fabricating semiconductor device'
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Array
(
[id] => 7360052
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[patent_issue_date] => 2004-01-22
[patent_title] => 'Methods for manufacturing contact plugs for semiconductor devices'
[patent_app_type] => new
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/609505 | Methods for manufacturing contact plugs for semiconductor devices | Jun 29, 2003 | Abandoned |
Array
(
[id] => 7430187
[patent_doc_number] => 20040266195
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-30
[patent_title] => 'METHODS OF PLANARIZATION'
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Array
(
[id] => 7675064
[patent_doc_number] => 20040127054
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[patent_title] => 'Method for manufacturing magnetic random access memory'
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Array
(
[id] => 7430080
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Array
(
[id] => 724523
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[patent_title] => 'Method for determining endpoint of etch layer and etching process implementing said method in semiconductor element fabrication'
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Array
(
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Array
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Array
(
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Array
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Array
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Array
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