Search

Lavone D. Tabor

Examiner (ID: 3533)

Most Active Art Unit
2911
Art Unit(s)
2911, 2899, 2912, 2901
Total Applications
4598
Issued Applications
4499
Pending Applications
0
Abandoned Applications
99

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19206183 [patent_doc_number] => 20240178082 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/071797 [patent_app_country] => US [patent_app_date] => 2022-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12024 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18071797 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/071797
Package structure and method for manufacturing the same Nov 29, 2022 Issued
Array ( [id] => 19206255 [patent_doc_number] => 20240178154 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT [patent_app_type] => utility [patent_app_number] => 18/070708 [patent_app_country] => US [patent_app_date] => 2022-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7086 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18070708 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/070708
ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT Nov 28, 2022 Pending
Array ( [id] => 18266790 [patent_doc_number] => 20230088032 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-23 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/059747 [patent_app_country] => US [patent_app_date] => 2022-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8010 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18059747 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/059747
Semiconductor package and method of fabricating the same Nov 28, 2022 Issued
Array ( [id] => 19191524 [patent_doc_number] => 20240170437 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-23 [patent_title] => PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/993798 [patent_app_country] => US [patent_app_date] => 2022-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9405 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17993798 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/993798
PACKAGE STRUCTURE Nov 22, 2022 Pending
Array ( [id] => 18394882 [patent_doc_number] => 20230163103 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-25 [patent_title] => STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/989396 [patent_app_country] => US [patent_app_date] => 2022-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7220 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 288 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17989396 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/989396
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME Nov 16, 2022 Issued
Array ( [id] => 20705960 [patent_doc_number] => 12628692 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-05-12 [patent_title] => Semiconductor package, semiconductor bonding structure, and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 17/989635 [patent_app_country] => US [patent_app_date] => 2022-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 0 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17989635 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/989635
Semiconductor package, semiconductor bonding structure, and method of fabricating the same Nov 16, 2022 Issued
Array ( [id] => 18226082 [patent_doc_number] => 20230065076 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/054295 [patent_app_country] => US [patent_app_date] => 2022-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6571 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18054295 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/054295
Semiconductor package and method of fabricating the same Nov 9, 2022 Issued
Array ( [id] => 18500559 [patent_doc_number] => 20230223353 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-13 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/976775 [patent_app_country] => US [patent_app_date] => 2022-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9188 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17976775 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/976775
SEMICONDUCTOR PACKAGE Oct 28, 2022 Pending
Array ( [id] => 18241752 [patent_doc_number] => 20230074063 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-09 [patent_title] => DEVICES COMPRISING CRYSTALLINE MATERIALS [patent_app_type] => utility [patent_app_number] => 18/050772 [patent_app_country] => US [patent_app_date] => 2022-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5109 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18050772 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/050772
Devices comprising crystalline materials Oct 27, 2022 Issued
Array ( [id] => 18195316 [patent_doc_number] => 20230048835 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-16 [patent_title] => COMPOSITE BRIDGE DIE-TO-DIE INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES [patent_app_type] => utility [patent_app_number] => 17/975223 [patent_app_country] => US [patent_app_date] => 2022-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9761 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17975223 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/975223
Composite bridge die-to-die interconnects for integrated-circuit packages Oct 26, 2022 Issued
Array ( [id] => 19648551 [patent_doc_number] => 20240423071 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-19 [patent_title] => DISPLAY DEVICE AND ELECTRONIC APPARATUS [patent_app_type] => utility [patent_app_number] => 18/701385 [patent_app_country] => US [patent_app_date] => 2022-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13339 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18701385 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/701385
DISPLAY DEVICE AND ELECTRONIC APPARATUS Oct 16, 2022 Pending
Array ( [id] => 20675495 [patent_doc_number] => 12616030 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-28 [patent_title] => Electronic device and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/962354 [patent_app_country] => US [patent_app_date] => 2022-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 53 [patent_figures_cnt] => 53 [patent_no_of_words] => 8582 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17962354 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/962354
Electronic device and method for manufacturing the same Oct 6, 2022 Issued
Array ( [id] => 19460224 [patent_doc_number] => 12100734 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-24 [patent_title] => Low leakage FET [patent_app_type] => utility [patent_app_number] => 17/961372 [patent_app_country] => US [patent_app_date] => 2022-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 8845 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17961372 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/961372
Low leakage FET Oct 5, 2022 Issued
Array ( [id] => 19704935 [patent_doc_number] => 12198982 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-14 [patent_title] => Laser dicing for singulation [patent_app_type] => utility [patent_app_number] => 17/960568 [patent_app_country] => US [patent_app_date] => 2022-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 4628 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17960568 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/960568
Laser dicing for singulation Oct 4, 2022 Issued
Array ( [id] => 19071144 [patent_doc_number] => 20240105570 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => TRANSISTOR PACKAGE AND PROCESS OF IMPLEMENTING THE TRANSISTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/951527 [patent_app_country] => US [patent_app_date] => 2022-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14629 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17951527 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/951527
TRANSISTOR PACKAGE AND PROCESS OF IMPLEMENTING THE TRANSISTOR PACKAGE Sep 22, 2022 Pending
Array ( [id] => 18333291 [patent_doc_number] => 20230125239 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/934233 [patent_app_country] => US [patent_app_date] => 2022-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6217 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17934233 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/934233
Semiconductor package structure Sep 21, 2022 Issued
Array ( [id] => 18271712 [patent_doc_number] => 20230092954 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-23 [patent_title] => Electronic Package with Components Mounted at Two Sides of a Layer Stack [patent_app_type] => utility [patent_app_number] => 17/933069 [patent_app_country] => US [patent_app_date] => 2022-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12170 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17933069 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/933069
Electronic Package with Components Mounted at Two Sides of a Layer Stack Sep 15, 2022 Pending
Array ( [id] => 19038266 [patent_doc_number] => 20240088081 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => DIE PACKAGE WITH SEALED DIE ENCLOSURES [patent_app_type] => utility [patent_app_number] => 17/932209 [patent_app_country] => US [patent_app_date] => 2022-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9550 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -38 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17932209 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/932209
DIE PACKAGE WITH SEALED DIE ENCLOSURES Sep 13, 2022 Pending
Array ( [id] => 19407195 [patent_doc_number] => 20240290706 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-29 [patent_title] => CHIP STRUCTURE, METHOD FOR MANUFACTURING CHIP STRUCTURE, AND ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 18/024109 [patent_app_country] => US [patent_app_date] => 2022-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7628 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18024109 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/024109
CHIP STRUCTURE, METHOD FOR MANUFACTURING CHIP STRUCTURE, AND ELECTRONIC DEVICE Sep 8, 2022 Pending
Array ( [id] => 20346075 [patent_doc_number] => 12469810 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-11 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/939127 [patent_app_country] => US [patent_app_date] => 2022-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 18 [patent_no_of_words] => 9792 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17939127 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/939127
Semiconductor package Sep 6, 2022 Issued
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