Lawrence C. Tynes Jr.

Array ( [id] => 18975315 [patent_doc_number] => 20240055407 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR DEBUGGING INTEGRATED CIRCUITS USING SAME [patent_app_type] => utility [patent_app_number] => 18/366569 [patent_app_country] => US [patent_app_date] => 2023-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9580 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18366569 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18902503 [patent_doc_number] => 20240017988 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => ARCHED MEMBRANE STRUCTURE FOR MEMS DEVICE [patent_app_type] => utility [patent_app_number] => 18/365997 [patent_app_country] => US [patent_app_date] => 2023-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7744 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18365997 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20553294 [patent_doc_number] => 12564109 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-02-24 [patent_title] => Package component, electronic device and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 18/365232 [patent_app_country] => US [patent_app_date] => 2023-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 34 [patent_no_of_words] => 10764 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18365232 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19621500 [patent_doc_number] => 20240407180 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => SINGLE PACKAGE DATA STORAGE DEVICE [patent_app_type] => utility [patent_app_number] => 18/361081 [patent_app_country] => US [patent_app_date] => 2023-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5001 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18361081 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19356953 [patent_doc_number] => 12057410 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-06 [patent_title] => Semiconductor device and method of manufacture [patent_app_type] => utility [patent_app_number] => 18/359684 [patent_app_country] => US [patent_app_date] => 2023-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 34 [patent_no_of_words] => 13866 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18359684 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19341452 [patent_doc_number] => 12051649 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-30 [patent_title] => Architecture for computing system package [patent_app_type] => utility [patent_app_number] => 18/355824 [patent_app_country] => US [patent_app_date] => 2023-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 45 [patent_figures_cnt] => 45 [patent_no_of_words] => 8064 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18355824 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20748217 [patent_doc_number] => 12648156 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-06-02 [patent_title] => Semiconductor chip stack structure, semiconductor package, and methods of manufacturing them [patent_app_type] => utility [patent_app_number] => 18/355004 [patent_app_country] => US [patent_app_date] => 2023-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 3288 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18355004 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19727202 [patent_doc_number] => 20250029953 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-23 [patent_title] => Inter-Terminal Die-to-Die Attachment [patent_app_type] => utility [patent_app_number] => 18/353671 [patent_app_country] => US [patent_app_date] => 2023-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6726 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353671 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19321521 [patent_doc_number] => 20240243068 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-18 [patent_title] => SEMICONDUCTOR PACKAGES, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/353769 [patent_app_country] => US [patent_app_date] => 2023-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4181 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353769 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19524093 [patent_doc_number] => 12125833 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-22 [patent_title] => Integrated circuit package and method forming same [patent_app_type] => utility [patent_app_number] => 18/346319 [patent_app_country] => US [patent_app_date] => 2023-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 6202 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18346319 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18975324 [patent_doc_number] => 20240055416 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME [patent_app_type] => utility [patent_app_number] => 18/344218 [patent_app_country] => US [patent_app_date] => 2023-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3732 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 24 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18344218 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20612873 [patent_doc_number] => 12588494 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-24 [patent_title] => Die stitching and harvesting of arrayed structures [patent_app_type] => utility [patent_app_number] => 18/339132 [patent_app_country] => US [patent_app_date] => 2023-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 48 [patent_no_of_words] => 9018 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18339132 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18712873 [patent_doc_number] => 20230335506 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-19 [patent_title] => ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/338273 [patent_app_country] => US [patent_app_date] => 2023-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8112 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18338273 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18696580 [patent_doc_number] => 20230327021 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-12 [patent_title] => Methods Of Forming Air Spacers In Semicondutor Devices [patent_app_type] => utility [patent_app_number] => 18/336561 [patent_app_country] => US [patent_app_date] => 2023-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8101 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18336561 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20720253 [patent_doc_number] => 12635526 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-05-19 [patent_title] => Semiconductor device and method of making an EMI shield using intensive pulsed light irradiation [patent_app_type] => utility [patent_app_number] => 18/329871 [patent_app_country] => US [patent_app_date] => 2023-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 16 [patent_no_of_words] => 0 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18329871 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19199118 [patent_doc_number] => 11996367 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-28 [patent_title] => Semiconductor device and semiconductor package including the same [patent_app_type] => utility [patent_app_number] => 18/328322 [patent_app_country] => US [patent_app_date] => 2023-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 19 [patent_no_of_words] => 8819 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18328322 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19619198 [patent_doc_number] => 20240404878 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 18/326304 [patent_app_country] => US [patent_app_date] => 2023-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11387 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18326304 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18631806 [patent_doc_number] => 20230290711 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-14 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/318864 [patent_app_country] => US [patent_app_date] => 2023-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5705 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18318864 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20900370 [patent_doc_number] => 12707650 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-08-11 [patent_title] => Package structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 18/318202 [patent_app_country] => US [patent_app_date] => 2023-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 7229 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18318202 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19038279 [patent_doc_number] => 20240088094 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/314287 [patent_app_country] => US [patent_app_date] => 2023-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5477 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18314287 [rel_patent_id] =>[rel_patent_doc_number] =>)