Leo B Tentoni

Array ( [id] => 18570601 [patent_doc_number] => 20230260938 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/141621 [patent_app_country] => US [patent_app_date] => 2023-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8215 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18141621 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18555352 [patent_doc_number] => 20230253369 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => Packages with Stacked Dies and Methods of Forming the Same [patent_app_type] => utility [patent_app_number] => 18/302496 [patent_app_country] => US [patent_app_date] => 2023-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3689 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18302496 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18555346 [patent_doc_number] => 20230253363 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/133959 [patent_app_country] => US [patent_app_date] => 2023-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11227 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18133959 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18533251 [patent_doc_number] => 20230238327 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-27 [patent_title] => THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS [patent_app_type] => utility [patent_app_number] => 18/193977 [patent_app_country] => US [patent_app_date] => 2023-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5088 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18193977 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18514695 [patent_doc_number] => 20230230956 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-20 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/189647 [patent_app_country] => US [patent_app_date] => 2023-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7074 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18189647 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18440116 [patent_doc_number] => 20230187411 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/165339 [patent_app_country] => US [patent_app_date] => 2023-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10271 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18165339 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18408951 [patent_doc_number] => 20230170304 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-01 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/095900 [patent_app_country] => US [patent_app_date] => 2023-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10234 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18095900 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18379791 [patent_doc_number] => 20230154880 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => Redistribution Lines Having Nano Columns and Method Forming Same [patent_app_type] => utility [patent_app_number] => 18/151014 [patent_app_country] => US [patent_app_date] => 2023-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7782 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151014 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19168483 [patent_doc_number] => 11984396 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-14 [patent_title] => Localized high density substrate routing [patent_app_type] => utility [patent_app_number] => 18/089213 [patent_app_country] => US [patent_app_date] => 2022-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4994 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18089213 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18310533 [patent_doc_number] => 20230114433 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-13 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME [patent_app_type] => utility [patent_app_number] => 18/079054 [patent_app_country] => US [patent_app_date] => 2022-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10603 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => 0 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18079054 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18286813 [patent_doc_number] => 20230102285 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/074134 [patent_app_country] => US [patent_app_date] => 2022-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9779 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18074134 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19093981 [patent_doc_number] => 11955446 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-09 [patent_title] => Method for forming semiconductor device structure with conductive polymer liner [patent_app_type] => utility [patent_app_number] => 17/993235 [patent_app_country] => US [patent_app_date] => 2022-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 7246 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 230 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17993235 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18221393 [patent_doc_number] => 20230060387 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME [patent_app_type] => utility [patent_app_number] => 18/053012 [patent_app_country] => US [patent_app_date] => 2022-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24681 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18053012 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18180121 [patent_doc_number] => 20230040850 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-09 [patent_title] => LOCALIZED HIGH DENSITY SUBSTRATE ROUTING [patent_app_type] => utility [patent_app_number] => 17/972340 [patent_app_country] => US [patent_app_date] => 2022-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4970 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17972340 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18163861 [patent_doc_number] => 20230030455 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-02 [patent_title] => SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/964010 [patent_app_country] => US [patent_app_date] => 2022-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9894 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17964010 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18161082 [patent_doc_number] => 20230027674 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-26 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/958237 [patent_app_country] => US [patent_app_date] => 2022-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5643 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17958237 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18061783 [patent_doc_number] => 20220392870 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-08 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/890835 [patent_app_country] => US [patent_app_date] => 2022-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3628 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17890835 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17870976 [patent_doc_number] => 20220293713 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-15 [patent_title] => DISPLAY APPARATUS [patent_app_type] => utility [patent_app_number] => 17/664603 [patent_app_country] => US [patent_app_date] => 2022-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9702 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => 0 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17664603 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18024319 [patent_doc_number] => 20220375818 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-24 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/746069 [patent_app_country] => US [patent_app_date] => 2022-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10941 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17746069 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18061775 [patent_doc_number] => 20220392862 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-08 [patent_title] => PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METHOD THEREOF, AND VERTICAL PACKAGE MODULE [patent_app_type] => utility [patent_app_number] => 17/663208 [patent_app_country] => US [patent_app_date] => 2022-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9780 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17663208 [rel_patent_id] =>[rel_patent_doc_number] =>)