Search

Leo B Tentoni

Examiner (ID: 106, Phone: (571)272-1209 , Office: P/1742 )

Most Active Art Unit
1742
Art Unit(s)
1742, 1732, 1307, 1791
Total Applications
4174
Issued Applications
3256
Pending Applications
267
Abandoned Applications
650

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18363440 [patent_doc_number] => 20230145031 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND WAFER STACKING METHOD [patent_app_type] => utility [patent_app_number] => 17/732324 [patent_app_country] => US [patent_app_date] => 2022-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6284 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17732324 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/732324
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND WAFER STACKING METHOD Apr 27, 2022 Pending
Array ( [id] => 18729376 [patent_doc_number] => 20230343672 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-26 [patent_title] => METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICONDUCTOR DEVICES USING W2W FUSION BONDING [patent_app_type] => utility [patent_app_number] => 17/728586 [patent_app_country] => US [patent_app_date] => 2022-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4624 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17728586 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/728586
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICONDUCTOR DEVICES USING W2W FUSION BONDING Apr 24, 2022
Array ( [id] => 17780136 [patent_doc_number] => 20220246486 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS [patent_app_type] => utility [patent_app_number] => 17/660319 [patent_app_country] => US [patent_app_date] => 2022-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2443 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17660319 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/660319
SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS Apr 21, 2022 Pending
Array ( [id] => 17780310 [patent_doc_number] => 20220246660 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => SEMICONDUCTOR PACKAGE AND RELATED METHODS [patent_app_type] => utility [patent_app_number] => 17/659885 [patent_app_country] => US [patent_app_date] => 2022-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5617 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17659885 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/659885
SEMICONDUCTOR PACKAGE AND RELATED METHODS Apr 19, 2022 Pending
Array ( [id] => 17753060 [patent_doc_number] => 20220231265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-21 [patent_title] => Display Assembly Apparatus And Methods For Information Handling Systems [patent_app_type] => utility [patent_app_number] => 17/714978 [patent_app_country] => US [patent_app_date] => 2022-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8878 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17714978 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/714978
Display Assembly Apparatus And Methods For Information Handling Systems Apr 5, 2022 Pending
Array ( [id] => 18967514 [patent_doc_number] => 11901295 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Dielectric film for semiconductor fabrication [patent_app_type] => utility [patent_app_number] => 17/712306 [patent_app_country] => US [patent_app_date] => 2022-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 8 [patent_no_of_words] => 5519 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17712306 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/712306
Dielectric film for semiconductor fabrication Apr 3, 2022 Issued
Array ( [id] => 18024311 [patent_doc_number] => 20220375810 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-24 [patent_title] => SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 17/700532 [patent_app_country] => US [patent_app_date] => 2022-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10118 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17700532 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/700532
SEMICONDUCTOR MODULE Mar 21, 2022 Pending
Array ( [id] => 18653183 [patent_doc_number] => 20230299023 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/698545 [patent_app_country] => US [patent_app_date] => 2022-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11448 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17698545 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/698545
Semiconductor device with composite conductive features and method for fabricating the same Mar 17, 2022 Issued
Array ( [id] => 18113081 [patent_doc_number] => 20230005961 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME [patent_app_type] => utility [patent_app_number] => 17/692371 [patent_app_country] => US [patent_app_date] => 2022-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12865 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17692371 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/692371
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME Mar 10, 2022 Pending
Array ( [id] => 18967488 [patent_doc_number] => 11901269 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/687072 [patent_app_country] => US [patent_app_date] => 2022-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 19 [patent_no_of_words] => 10472 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17687072 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/687072
Semiconductor package Mar 3, 2022 Issued
Array ( [id] => 17949282 [patent_doc_number] => 20220336301 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-20 [patent_title] => POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS [patent_app_type] => utility [patent_app_number] => 17/683002 [patent_app_country] => US [patent_app_date] => 2022-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10567 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17683002 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/683002
Power semiconductor device, method for manufacturing power semiconductor device, and power conversion apparatus Feb 27, 2022 Issued
Array ( [id] => 18142342 [patent_doc_number] => 20230016186 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-19 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/678392 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9269 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678392 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/678392
Semiconductor device and method for manufacturing the same Feb 22, 2022 Issued
Array ( [id] => 18840158 [patent_doc_number] => 11848237 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-19 [patent_title] => Composite wafer, semiconductor device and electronic component [patent_app_type] => utility [patent_app_number] => 17/678619 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 57 [patent_no_of_words] => 16808 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678619 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/678619
Composite wafer, semiconductor device and electronic component Feb 22, 2022 Issued
Array ( [id] => 19138070 [patent_doc_number] => 11973045 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Semiconductor structure and method for forming same [patent_app_type] => utility [patent_app_number] => 17/650796 [patent_app_country] => US [patent_app_date] => 2022-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 5093 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17650796 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/650796
Semiconductor structure and method for forming same Feb 10, 2022 Issued
Array ( [id] => 18284384 [patent_doc_number] => 20230099856 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM [patent_app_type] => utility [patent_app_number] => 17/665749 [patent_app_country] => US [patent_app_date] => 2022-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9877 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17665749 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/665749
Integrated circuit package module including a bonding system Feb 6, 2022 Issued
Array ( [id] => 18024314 [patent_doc_number] => 20220375813 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-24 [patent_title] => ELECTRONIC PACKAGE, HEAT DISSIPATION STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/583946 [patent_app_country] => US [patent_app_date] => 2022-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8102 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -26 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17583946 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/583946
ELECTRONIC PACKAGE, HEAT DISSIPATION STRUCTURE AND MANUFACTURING METHOD THEREOF Jan 24, 2022 Pending
Array ( [id] => 18112969 [patent_doc_number] => 20230005849 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/648309 [patent_app_country] => US [patent_app_date] => 2022-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7204 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 288 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17648309 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/648309
Semiconductor structure and manufacturing method thereof Jan 18, 2022 Issued
Array ( [id] => 17917566 [patent_doc_number] => 20220319962 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-06 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/577091 [patent_app_country] => US [patent_app_date] => 2022-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9793 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 245 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17577091 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/577091
Semiconductor device Jan 16, 2022 Issued
Array ( [id] => 17583041 [patent_doc_number] => 20220139896 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-05 [patent_title] => DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE [patent_app_type] => utility [patent_app_number] => 17/574485 [patent_app_country] => US [patent_app_date] => 2022-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15663 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17574485 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/574485
Distributed semiconductor die and package architecture Jan 11, 2022 Issued
Array ( [id] => 18211297 [patent_doc_number] => 20230057560 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-23 [patent_title] => SEMICONDUCTOR DEVICE INCLUDING RE-DISTRIBUTION PADS DISPOSED AT DIFFERENT LEVELS AND A METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/572033 [patent_app_country] => US [patent_app_date] => 2022-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4836 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17572033 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/572033
SEMICONDUCTOR DEVICE INCLUDING RE-DISTRIBUTION PADS DISPOSED AT DIFFERENT LEVELS AND A METHOD OF MANUFACTURING THE SAME Jan 9, 2022 Pending
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