Leo B Tentoni

Array ( [id] => 17551844 [patent_doc_number] => 20220123186 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-21 [patent_title] => LIGHT EMITTING DEVICE [patent_app_type] => utility [patent_app_number] => 17/564943 [patent_app_country] => US [patent_app_date] => 2021-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6720 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17564943 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19168629 [patent_doc_number] => 11984545 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-14 [patent_title] => Method of manufacturing a light emitting device [patent_app_type] => utility [patent_app_number] => 17/565020 [patent_app_country] => US [patent_app_date] => 2021-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 6634 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17565020 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17536717 [patent_doc_number] => 20220115326 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-14 [patent_title] => SIZE AND EFFICIENCY OF DIES [patent_app_type] => utility [patent_app_number] => 17/555213 [patent_app_country] => US [patent_app_date] => 2021-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4449 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17555213 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17963691 [patent_doc_number] => 20220344272 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-27 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/644716 [patent_app_country] => US [patent_app_date] => 2021-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9388 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17644716 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18943558 [patent_doc_number] => 20240038697 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => DISPLAY PANEL, METHOD OF MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 17/622229 [patent_app_country] => US [patent_app_date] => 2021-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6147 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17622229 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17708708 [patent_doc_number] => 20220208716 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-30 [patent_title] => Semiconductor Device and Method of Forming Clip Bond Having Multiple Bond Line Thicknesses [patent_app_type] => utility [patent_app_number] => 17/644143 [patent_app_country] => US [patent_app_date] => 2021-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2618 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17644143 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17839822 [patent_doc_number] => 20220277127 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-01 [patent_title] => Bonded Semiconductor Device And Method For Forming The Same [patent_app_type] => utility [patent_app_number] => 17/536724 [patent_app_country] => US [patent_app_date] => 2021-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11890 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17536724 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18797002 [patent_doc_number] => 11830837 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-28 [patent_title] => Semiconductor package with air gap [patent_app_type] => utility [patent_app_number] => 17/524928 [patent_app_country] => US [patent_app_date] => 2021-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 7854 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17524928 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17448342 [patent_doc_number] => 20220068847 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-03 [patent_title] => CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR STRUCTURES [patent_app_type] => utility [patent_app_number] => 17/524375 [patent_app_country] => US [patent_app_date] => 2021-11-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7928 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17524375 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18097480 [patent_doc_number] => 20220415821 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS [patent_app_type] => utility [patent_app_number] => 17/522602 [patent_app_country] => US [patent_app_date] => 2021-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6635 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17522602 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19138073 [patent_doc_number] => 11973048 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Semiconductor package and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/521786 [patent_app_country] => US [patent_app_date] => 2021-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 58 [patent_no_of_words] => 7762 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17521786 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18481193 [patent_doc_number] => 11694948 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-04 [patent_title] => Semiconductor device and semiconductor module using same [patent_app_type] => utility [patent_app_number] => 17/506286 [patent_app_country] => US [patent_app_date] => 2021-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 10492 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17506286 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18321053 [patent_doc_number] => 20230119181 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => Semiconductor Device and Method of Forming RDL Hybrid Interposer Substrate [patent_app_type] => utility [patent_app_number] => 17/451166 [patent_app_country] => US [patent_app_date] => 2021-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5692 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17451166 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17509188 [patent_doc_number] => 20220102291 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-31 [patent_title] => POWER MODULE [patent_app_type] => utility [patent_app_number] => 17/489064 [patent_app_country] => US [patent_app_date] => 2021-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9038 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 228 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17489064 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17485996 [patent_doc_number] => 20220093500 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-24 [patent_title] => INTEGRATED STRUCTURE WITH BIFUNCTIONAL ROUTING AND ASSEMBLY COMPRISING SUCH A STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/479403 [patent_app_country] => US [patent_app_date] => 2021-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14449 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17479403 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18840226 [patent_doc_number] => 11848307 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-19 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/478247 [patent_app_country] => US [patent_app_date] => 2021-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 20 [patent_no_of_words] => 6368 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17478247 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18159344 [patent_doc_number] => 20230025936 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-26 [patent_title] => BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/477996 [patent_app_country] => US [patent_app_date] => 2021-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9419 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17477996 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17900871 [patent_doc_number] => 20220310533 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-29 [patent_title] => TRENCH STRUCTURE FOR REDUCED WAFER CRACKING [patent_app_type] => utility [patent_app_number] => 17/447997 [patent_app_country] => US [patent_app_date] => 2021-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13982 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17447997 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18623867 [patent_doc_number] => 11756923 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-12 [patent_title] => High density and durable semiconductor device interconnect [patent_app_type] => utility [patent_app_number] => 17/464113 [patent_app_country] => US [patent_app_date] => 2021-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6117 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17464113 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18222957 [patent_doc_number] => 20230061951 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => CONTACT PAD FABRICATION PROCESS FOR A SEMICONDUCTOR PRODUCT [patent_app_type] => utility [patent_app_number] => 17/459849 [patent_app_country] => US [patent_app_date] => 2021-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5934 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17459849 [rel_patent_id] =>[rel_patent_doc_number] =>)