
Leslie Pilar Cruz
Examiner (ID: 7194, Phone: (571)272-8599 , Office: P/2826 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2826 |
| Total Applications | 538 |
| Issued Applications | 372 |
| Pending Applications | 2 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4462462
[patent_doc_number] => 07880308
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-02-01
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/602323
[patent_app_country] => US
[patent_app_date] => 2006-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_words] => 10942
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/880/07880308.pdf
[firstpage_image] =>[orig_patent_app_number] => 11602323
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/602323 | Semiconductor device | Nov 20, 2006 | Issued |
Array
(
[id] => 4896973
[patent_doc_number] => 20080116586
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-22
[patent_title] => 'Methods for manufacturing thermally enhanced flip-chip ball grid arrays'
[patent_app_type] => utility
[patent_app_number] => 11/601103
[patent_app_country] => US
[patent_app_date] => 2006-11-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0116/20080116586.pdf
[firstpage_image] =>[orig_patent_app_number] => 11601103
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/601103 | Methods for manufacturing thermally enhanced flip-chip ball grid arrays | Nov 16, 2006 | Issued |
Array
(
[id] => 5093053
[patent_doc_number] => 20070114662
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-24
[patent_title] => 'Interconnecting element between semiconductor chip and circuit support and method'
[patent_app_type] => utility
[patent_app_number] => 11/600694
[patent_app_country] => US
[patent_app_date] => 2006-11-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 7323
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[pdf_file] => publications/A1/0114/20070114662.pdf
[firstpage_image] =>[orig_patent_app_number] => 11600694
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/600694 | Interconnecting element between semiconductor chip and circuit support and method | Nov 15, 2006 | Abandoned |
Array
(
[id] => 4446050
[patent_doc_number] => 07863745
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-01-04
[patent_title] => 'Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/595854
[patent_app_country] => US
[patent_app_date] => 2006-11-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[patent_no_of_words] => 7938
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/863/07863745.pdf
[firstpage_image] =>[orig_patent_app_number] => 11595854
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/595854 | Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device | Nov 12, 2006 | Issued |
Array
(
[id] => 4820868
[patent_doc_number] => 20080122122
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-29
[patent_title] => 'Semiconductor package with encapsulant delamination-reducing structure and method of making the package'
[patent_app_type] => utility
[patent_app_number] => 11/594603
[patent_app_country] => US
[patent_app_date] => 2006-11-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 2725
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[pdf_file] => publications/A1/0122/20080122122.pdf
[firstpage_image] =>[orig_patent_app_number] => 11594603
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/594603 | Semiconductor package with encapsulant delamination-reducing structure and method of making the package | Nov 7, 2006 | Abandoned |
Array
(
[id] => 7703390
[patent_doc_number] => 08089147
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-01-03
[patent_title] => 'IMS formed as can for semiconductor housing'
[patent_app_type] => utility
[patent_app_number] => 11/591834
[patent_app_country] => US
[patent_app_date] => 2006-11-02
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/08/089/08089147.pdf
[firstpage_image] =>[orig_patent_app_number] => 11591834
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/591834 | IMS formed as can for semiconductor housing | Nov 1, 2006 | Issued |
Array
(
[id] => 4913124
[patent_doc_number] => 20080093723
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-24
[patent_title] => 'Passive placement in wire-bonded microelectronics'
[patent_app_type] => utility
[patent_app_number] => 11/584383
[patent_app_country] => US
[patent_app_date] => 2006-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3083
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[pdf_file] => publications/A1/0093/20080093723.pdf
[firstpage_image] =>[orig_patent_app_number] => 11584383
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/584383 | Passive placement in wire-bonded microelectronics | Oct 18, 2006 | Abandoned |
Array
(
[id] => 4915710
[patent_doc_number] => 20080096310
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-24
[patent_title] => 'Embedded capacitors for reducing package cracking'
[patent_app_type] => utility
[patent_app_number] => 11/541233
[patent_app_country] => US
[patent_app_date] => 2006-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 3538
[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0096/20080096310.pdf
[firstpage_image] =>[orig_patent_app_number] => 11541233
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/541233 | Embedded capacitors for reducing package cracking | Sep 28, 2006 | Issued |
Array
(
[id] => 5073088
[patent_doc_number] => 20070013063
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-01-18
[patent_title] => 'SELF ALIGNMENT FEATURES FOR AN ELECTRONIC ASSEMBLY'
[patent_app_type] => utility
[patent_app_number] => 11/533485
[patent_app_country] => US
[patent_app_date] => 2006-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0013/20070013063.pdf
[firstpage_image] =>[orig_patent_app_number] => 11533485
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/533485 | Self alignment features for an electronic assembly | Sep 19, 2006 | Issued |
Array
(
[id] => 4685665
[patent_doc_number] => 20080029846
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-07
[patent_title] => 'Semiconductor Device'
[patent_app_type] => utility
[patent_app_number] => 11/791683
[patent_app_country] => US
[patent_app_date] => 2006-09-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0029/20080029846.pdf
[firstpage_image] =>[orig_patent_app_number] => 11791683
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/791683 | Semiconductor device | Sep 10, 2006 | Issued |
Array
(
[id] => 5557352
[patent_doc_number] => 20090268929
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-10-29
[patent_title] => 'VOICE OUTPUT DEVICE AND METHOD, PROGRAM, AND ROOM'
[patent_app_type] => utility
[patent_app_number] => 12/064964
[patent_app_country] => US
[patent_app_date] => 2006-08-23
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[pdf_file] => publications/A1/0268/20090268929.pdf
[firstpage_image] =>[orig_patent_app_number] => 12064964
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/064964 | VOICE OUTPUT DEVICE AND METHOD, PROGRAM, AND ROOM | Aug 22, 2006 | Abandoned |
Array
(
[id] => 4777780
[patent_doc_number] => 20080285778
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[patent_issue_date] => 2008-11-20
[patent_title] => 'Screen-Integrated Speaker'
[patent_app_type] => utility
[patent_app_number] => 11/989926
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/989926 | Screen-Integrated Speaker | Aug 1, 2006 | Abandoned |
Array
(
[id] => 5584538
[patent_doc_number] => 20090103740
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-23
[patent_title] => 'AUDIO SIGNAL PROCESSING DEVICE AND AUDIO SIGNAL PROCESSING METHOD FOR SPECIFYING SOUND GENERATING PERIOD'
[patent_app_type] => utility
[patent_app_number] => 11/916993
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[firstpage_image] =>[orig_patent_app_number] => 11916993
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/916993 | Audio signal processing device and audio signal processing method for specifying sound generating period | Jun 27, 2006 | Issued |
Array
(
[id] => 5461516
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[patent_title] => 'Semiconductor Nanowire Transistor'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/922243 | Semiconductor nanowire transistor | Jun 15, 2006 | Issued |
Array
(
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Array
(
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[patent_title] => 'Three-dimensional multichip stack electronic package structure'
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Array
(
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[patent_title] => 'SINGLE POLY NON-VOLATILE MEMORY DEVICE WITH INVERSION DIFFUSION REGIONS AND METHODS FOR OPERATING THE SAME'
[patent_app_type] => utility
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Array
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Array
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Array
(
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[patent_title] => 'LED PACKAGE WITH WEDGE-SHAPED OPTICAL ELEMENT'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/381293 | LED PACKAGE WITH WEDGE-SHAPED OPTICAL ELEMENT | May 1, 2006 | Abandoned |