
Leslie Pilar Cruz
Examiner (ID: 15251, Phone: (571)272-8599 , Office: P/2826 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2826 |
| Total Applications | 538 |
| Issued Applications | 372 |
| Pending Applications | 2 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6028628
[patent_doc_number] => 20020017642
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-14
[patent_title] => 'Semiconductor substrate, field effect transistor, method of forming SiGe layer and method of forming strained Si layer using same, and method of manufacturing field effect transistor'
[patent_app_type] => new
[patent_app_number] => 09/917923
[patent_app_country] => US
[patent_app_date] => 2001-07-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 6203
[patent_no_of_claims] => 15
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[patent_words_short_claim] => 85
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0017/20020017642.pdf
[firstpage_image] =>[orig_patent_app_number] => 09917923
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/917923 | Semiconductor substrate, field effect transistor, method of forming SiGe layer and method of forming strained Si layer using same, and method of manufacturing field effect transistor | Jul 30, 2001 | Issued |
Array
(
[id] => 6476707
[patent_doc_number] => 20020024125
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-28
[patent_title] => 'Semiconductor device and method for assembling the same'
[patent_app_type] => new
[patent_app_number] => 09/812584
[patent_app_country] => US
[patent_app_date] => 2001-07-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2091
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[pdf_file] => publications/A1/0024/20020024125.pdf
[firstpage_image] =>[orig_patent_app_number] => 09812584
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/812584 | Semiconductor device and method for assembling the same | Jul 25, 2001 | Abandoned |
Array
(
[id] => 5798616
[patent_doc_number] => 20020008312
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-24
[patent_title] => 'Semiconductor device'
[patent_app_type] => new
[patent_app_number] => 09/908564
[patent_app_country] => US
[patent_app_date] => 2001-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 4676
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[pdf_file] => publications/A1/0008/20020008312.pdf
[firstpage_image] =>[orig_patent_app_number] => 09908564
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/908564 | Lead frame for a semiconductor device | Jul 19, 2001 | Issued |
Array
(
[id] => 5968457
[patent_doc_number] => 20020090752
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-07-11
[patent_title] => 'Semiconductor device, and apparatus and method for die bonding the same'
[patent_app_type] => new
[patent_app_number] => 09/908894
[patent_app_country] => US
[patent_app_date] => 2001-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 6274
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/908894 | Semiconductor device, and apparatus and method for die bonding the same | Jul 19, 2001 | Abandoned |
Array
(
[id] => 1590826
[patent_doc_number] => 06483160
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-11-19
[patent_title] => 'Micromechanical enclosure'
[patent_app_type] => B2
[patent_app_number] => 09/909030
[patent_app_country] => US
[patent_app_date] => 2001-07-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2549
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[pdf_file] => patents/06/483/06483160.pdf
[firstpage_image] =>[orig_patent_app_number] => 09909030
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/909030 | Micromechanical enclosure | Jul 18, 2001 | Issued |
Array
(
[id] => 6060390
[patent_doc_number] => 20020030265
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-03-14
[patent_title] => 'Integrated-circuit case'
[patent_app_type] => new
[patent_app_number] => 09/907453
[patent_app_country] => US
[patent_app_date] => 2001-07-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0030/20020030265.pdf
[firstpage_image] =>[orig_patent_app_number] => 09907453
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/907453 | Integrated-circuit case | Jul 17, 2001 | Issued |
Array
(
[id] => 1404073
[patent_doc_number] => 06531740
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-03-11
[patent_title] => 'Integrated impedance matching and stability network'
[patent_app_type] => B2
[patent_app_number] => 09/905903
[patent_app_country] => US
[patent_app_date] => 2001-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 36
[patent_no_of_words] => 14653
[patent_no_of_claims] => 18
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/531/06531740.pdf
[firstpage_image] =>[orig_patent_app_number] => 09905903
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/905903 | Integrated impedance matching and stability network | Jul 16, 2001 | Issued |
Array
(
[id] => 5870553
[patent_doc_number] => 20020047133
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-04-25
[patent_title] => 'Chip carrier film, method of manufacturing the chip carrier film and liquid crystal dispaly using the chip carrier film'
[patent_app_type] => new
[patent_app_number] => 09/902154
[patent_app_country] => US
[patent_app_date] => 2001-07-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4781
[patent_no_of_claims] => 24
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0047/20020047133.pdf
[firstpage_image] =>[orig_patent_app_number] => 09902154
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/902154 | Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film | Jul 10, 2001 | Issued |
Array
(
[id] => 1316236
[patent_doc_number] => 06611049
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-08-26
[patent_title] => 'Semiconductor device with chamfered substrate and method of making the same'
[patent_app_type] => B2
[patent_app_number] => 09/903104
[patent_app_country] => US
[patent_app_date] => 2001-07-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[patent_no_of_words] => 3891
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[pdf_file] => patents/06/611/06611049.pdf
[firstpage_image] =>[orig_patent_app_number] => 09903104
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/903104 | Semiconductor device with chamfered substrate and method of making the same | Jul 10, 2001 | Issued |
Array
(
[id] => 5951450
[patent_doc_number] => 20020006688
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-17
[patent_title] => 'Support matrix for integrated semiconductors, and method for producing it'
[patent_app_type] => new
[patent_app_number] => 09/901524
[patent_app_country] => US
[patent_app_date] => 2001-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0006/20020006688.pdf
[firstpage_image] =>[orig_patent_app_number] => 09901524
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/901524 | Support matrix for integrated semiconductors, and method for producing it | Jul 8, 2001 | Issued |
Array
(
[id] => 1390947
[patent_doc_number] => 06552384
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-04-22
[patent_title] => 'Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed'
[patent_app_type] => B2
[patent_app_number] => 09/898670
[patent_app_country] => US
[patent_app_date] => 2001-07-02
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/552/06552384.pdf
[firstpage_image] =>[orig_patent_app_number] => 09898670
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/898670 | Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed | Jul 1, 2001 | Issued |
Array
(
[id] => 1387060
[patent_doc_number] => 06555902
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-04-29
[patent_title] => 'Multiple stacked-chip packaging structure'
[patent_app_type] => B2
[patent_app_number] => 09/895553
[patent_app_country] => US
[patent_app_date] => 2001-06-28
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[pdf_file] => patents/06/555/06555902.pdf
[firstpage_image] =>[orig_patent_app_number] => 09895553
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/895553 | Multiple stacked-chip packaging structure | Jun 27, 2001 | Issued |
Array
(
[id] => 6317153
[patent_doc_number] => 20020195700
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-26
[patent_title] => 'Electronic assembly with vertically connected capacitors and manufacturing method'
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[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 09892273
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/892273 | Electronic assembly and system with vertically connected capacitors | Jun 25, 2001 | Issued |
Array
(
[id] => 6933415
[patent_doc_number] => 20010054759
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[patent_title] => 'Semiconductor device'
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[patent_app_number] => 09/871870
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[firstpage_image] =>[orig_patent_app_number] => 09871870
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/871870 | Semiconductor device | May 31, 2001 | Abandoned |
Array
(
[id] => 1180433
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[patent_kind] => B1
[patent_issue_date] => 2004-06-01
[patent_title] => 'Semiconductor device, method of manufacture thereof, circuit board, and electronic device'
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[pdf_file] => patents/06/744/06744122.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/856924 | Semiconductor device, method of manufacture thereof, circuit board, and electronic device | May 29, 2001 | Issued |
Array
(
[id] => 1246607
[patent_doc_number] => 06677620
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-01-13
[patent_title] => 'Organic EL element and method of manufacturing the same'
[patent_app_type] => B2
[patent_app_number] => 09/864263
[patent_app_country] => US
[patent_app_date] => 2001-05-25
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[pdf_file] => patents/06/677/06677620.pdf
[firstpage_image] =>[orig_patent_app_number] => 09864263
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/864263 | Organic EL element and method of manufacturing the same | May 24, 2001 | Issued |
Array
(
[id] => 6523027
[patent_doc_number] => 20020109227
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-15
[patent_title] => 'Metal bump'
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[firstpage_image] =>[orig_patent_app_number] => 09859573
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/859573 | Metal bump | May 16, 2001 | Issued |
Array
(
[id] => 7076961
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[patent_title] => 'Multiple line grid for use in a packaging of a testing application'
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Array
(
[id] => 1207086
[patent_doc_number] => 06717228
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[patent_kind] => B2
[patent_issue_date] => 2004-04-06
[patent_title] => 'Infrared image sensor with temperature compensation element'
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[firstpage_image] =>[orig_patent_app_number] => 09838173
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/838173 | Infrared image sensor with temperature compensation element | Apr 19, 2001 | Issued |
Array
(
[id] => 6888537
[patent_doc_number] => 20010023992
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[patent_title] => 'Highly integrated system-on-chip system with non-volatile memory unit'
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0023/20010023992.pdf
[firstpage_image] =>[orig_patent_app_number] => 09817964
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/817964 | Highly integrated system-on-chip system with non-volatile memory unit | Mar 26, 2001 | Abandoned |