
Linh V. Nguyen
Examiner (ID: 332, Phone: (571)272-1810 , Office: P/2845 )
| Most Active Art Unit | 2845 |
| Art Unit(s) | 3992, 2819, 2845 |
| Total Applications | 2309 |
| Issued Applications | 2062 |
| Pending Applications | 115 |
| Abandoned Applications | 167 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5188126
[patent_doc_number] => 20070166434
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[patent_kind] => A1
[patent_issue_date] => 2007-07-19
[patent_title] => 'Wafer'
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[patent_app_number] => 10/541302
[patent_app_country] => US
[patent_app_date] => 2004-01-07
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Array
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[patent_title] => 'Post high voltage gate dielectric pattern plasma surface treatment'
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Array
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[patent_title] => 'Surface defect elimination using directed beam method'
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Array
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[patent_issue_date] => 2007-11-13
[patent_title] => 'Chemical mechanical polishing process for forming shallow trench isolation structure'
[patent_app_type] => utility
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Array
(
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[patent_title] => 'System and method of pattern detection for semiconductor wafer map data'
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Array
(
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[patent_issue_date] => 2007-12-11
[patent_title] => 'Flash memory and fabrication method thereof'
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Array
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[patent_title] => 'Process for the preparation of instant soup mix from indian dill (anethum sowa)'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/584664 | Process for the preparation of instant soup mix from indian dill (anethum sowa) | Dec 26, 2003 | Abandoned |
Array
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[patent_title] => 'Method for patterning metal wire in semiconductor device'
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[patent_app_number] => 10/732528
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/732528 | Method for patterning metal wire in semiconductor device | Dec 10, 2003 | Abandoned |
Array
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[id] => 612749
[patent_doc_number] => 07148146
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[patent_issue_date] => 2006-12-12
[patent_title] => 'Method of fabricating an integral capacitor and gate transistor having nitride and oxide polish stop layers using chemical mechanical polishing elimination'
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Array
(
[id] => 411612
[patent_doc_number] => 07282450
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[patent_title] => 'Sidewall coverage for copper damascene filling'
[patent_app_type] => utility
[patent_app_number] => 10/733722
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Array
(
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[patent_title] => 'Etching solution for multiple layer of copper and molybdenum and etching method using the same'
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Array
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Array
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Array
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Array
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Array
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Array
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