
Lisa A. Kilday
Examiner (ID: 6965)
| Most Active Art Unit | 2829 |
| Art Unit(s) | 2813, 2829 |
| Total Applications | 329 |
| Issued Applications | 312 |
| Pending Applications | 7 |
| Abandoned Applications | 10 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1119929
[patent_doc_number] => 06797652
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-09-28
[patent_title] => 'Copper damascene with low-k capping layer and improved electromigration reliability'
[patent_app_type] => B1
[patent_app_number] => 10/097965
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/797/06797652.pdf
[firstpage_image] =>[orig_patent_app_number] => 10097965
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/097965 | Copper damascene with low-k capping layer and improved electromigration reliability | Mar 14, 2002 | Issued |
Array
(
[id] => 1116994
[patent_doc_number] => 06800940
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-10-05
[patent_title] => 'Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning'
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[patent_app_number] => 10/099641
[patent_app_country] => US
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[pdf_file] => patents/06/800/06800940.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/099641 | Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning | Mar 14, 2002 | Issued |
Array
(
[id] => 6716052
[patent_doc_number] => 20030027400
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[patent_kind] => A1
[patent_issue_date] => 2003-02-06
[patent_title] => 'SOI structure and method of producing same'
[patent_app_type] => new
[patent_app_number] => 10/096185
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[patent_app_date] => 2002-03-11
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/096185 | SOI structure and method of producing same | Mar 10, 2002 | Issued |
Array
(
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[patent_issue_date] => 2004-02-17
[patent_title] => 'High-pressure anneal process for integrated circuits'
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[patent_app_number] => 10/091936
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/091936 | High-pressure anneal process for integrated circuits | Mar 4, 2002 | Issued |
Array
(
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[patent_doc_number] => 06790786
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[patent_issue_date] => 2004-09-14
[patent_title] => 'Etching processes for integrated circuit manufacturing including methods of forming capacitors'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/092875 | Etching processes for integrated circuit manufacturing including methods of forming capacitors | Mar 4, 2002 | Issued |
Array
(
[id] => 5981993
[patent_doc_number] => 20020096733
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[patent_issue_date] => 2002-07-25
[patent_title] => 'Pixel cell with high storage capacitance for a CMOS imager'
[patent_app_type] => new
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/086535 | Pixel cell with high storage capacitance for a CMOS imager | Mar 3, 2002 | Issued |
Array
(
[id] => 6379222
[patent_doc_number] => 20020119663
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[patent_issue_date] => 2002-08-29
[patent_title] => 'Method for forming a fine structure on a surface of a semiconductor material, semiconductor materials provided with such a fine structure, and devices made of such semiconductor materials'
[patent_app_type] => new
[patent_app_number] => 10/083615
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/083615 | Method for forming a fine structure on a surface of a semiconductor material, semiconductor materials provided with such a fine structure, and devices made of such semiconductor materials | Feb 25, 2002 | Abandoned |
Array
(
[id] => 1386708
[patent_doc_number] => 06548409
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-04-15
[patent_title] => 'Method of reducing micro-scratches during tungsten CMP'
[patent_app_type] => B1
[patent_app_number] => 10/076395
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[patent_app_date] => 2002-02-19
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/076395 | Method of reducing micro-scratches during tungsten CMP | Feb 18, 2002 | Issued |
Array
(
[id] => 6706368
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[patent_title] => 'Method of controlling plasma etch process'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/076665 | Method of controlling plasma etch process | Feb 13, 2002 | Issued |
Array
(
[id] => 5787479
[patent_doc_number] => 20020160606
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-31
[patent_title] => 'Method for material removal from an in-process microelectronic substrate'
[patent_app_type] => new
[patent_app_number] => 10/076115
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Array
(
[id] => 6706439
[patent_doc_number] => 20030153173
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[patent_issue_date] => 2003-08-14
[patent_title] => 'Method of forming a novel top-metal fuse structure'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/075806 | Method of forming a novel top-metal fuse structure | Feb 12, 2002 | Issued |
Array
(
[id] => 1347618
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[patent_title] => 'Method of fabricating a semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/067955 | Method of fabricating a semiconductor device | Feb 4, 2002 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/061646 | Method of forming contact plugs | Jan 31, 2002 | Issued |
Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/060486 | Methods of forming spin on glass layers by curing remaining portions thereof | Jan 29, 2002 | Issued |
Array
(
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[patent_title] => 'Process for etching an organic dielectric using a silyated photoresist mask'
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Array
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Array
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Array
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Array
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