
Lisa S. Park
Examiner (ID: 4161)
| Most Active Art Unit | 1729 |
| Art Unit(s) | 1729 |
| Total Applications | 793 |
| Issued Applications | 550 |
| Pending Applications | 105 |
| Abandoned Applications | 172 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18857519
[patent_doc_number] => 11855116
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-12-26
[patent_title] => Semiconductor apparatus and device
[patent_app_type] => utility
[patent_app_number] => 17/520199
[patent_app_country] => US
[patent_app_date] => 2021-11-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 13
[patent_no_of_words] => 15509
[patent_no_of_claims] => 37
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 391
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17520199
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/520199 | Semiconductor apparatus and device | Nov 4, 2021 | Issued |
Array
(
[id] => 17709074
[patent_doc_number] => 20220209082
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-06-30
[patent_title] => METHOD FOR TRANSFERRING CHIPS AND METHOD FOR MANUFACTURING LED DISPLAY
[patent_app_type] => utility
[patent_app_number] => 17/516717
[patent_app_country] => US
[patent_app_date] => 2021-11-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 2992
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -7
[patent_words_short_claim] => 54
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17516717
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/516717 | METHOD FOR TRANSFERRING CHIPS AND METHOD FOR MANUFACTURING LED DISPLAY | Nov 1, 2021 | Abandoned |
Array
(
[id] => 18349741
[patent_doc_number] => 20230137852
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-05-04
[patent_title] => FLIP CHIP PACKAGE ASSEMBLY
[patent_app_type] => utility
[patent_app_number] => 17/515369
[patent_app_country] => US
[patent_app_date] => 2021-10-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9539
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -24
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17515369
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/515369 | Flip chip package assembly | Oct 28, 2021 | Issued |
Array
(
[id] => 18688402
[patent_doc_number] => 11784147
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-10-10
[patent_title] => Semiconductor device and manufacturing method of semiconductor device
[patent_app_type] => utility
[patent_app_number] => 17/499166
[patent_app_country] => US
[patent_app_date] => 2021-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 39
[patent_no_of_words] => 13033
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17499166
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/499166 | Semiconductor device and manufacturing method of semiconductor device | Oct 11, 2021 | Issued |
Array
(
[id] => 17402899
[patent_doc_number] => 20220044990
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-02-10
[patent_title] => WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
[patent_app_type] => utility
[patent_app_number] => 17/497158
[patent_app_country] => US
[patent_app_date] => 2021-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7222
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -6
[patent_words_short_claim] => 283
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17497158
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/497158 | Wiring substrate, semiconductor package and method of manufacturing wiring substrate | Oct 7, 2021 | Issued |
Array
(
[id] => 18282344
[patent_doc_number] => 20230097816
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-30
[patent_title] => ELECTRIC FIELD CONTROL FOR BOND PADS IN SEMICONDUCTOR DEVICE PACKAGE
[patent_app_type] => utility
[patent_app_number] => 17/491522
[patent_app_country] => US
[patent_app_date] => 2021-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7549
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17491522
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/491522 | Electric field control for bond pads in semiconductor device package | Sep 29, 2021 | Issued |
Array
(
[id] => 18294470
[patent_doc_number] => 20230104156
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-04-06
[patent_title] => FLIP CHIP PACKAGE ASSEMBLY
[patent_app_type] => utility
[patent_app_number] => 17/491496
[patent_app_country] => US
[patent_app_date] => 2021-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6964
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17491496
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/491496 | Flip chip package assembly | Sep 29, 2021 | Issued |
Array
(
[id] => 18645666
[patent_doc_number] => 11769745
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-09-26
[patent_title] => Chip structure, packaging structure and manufacturing method for chip structure
[patent_app_type] => utility
[patent_app_number] => 17/489759
[patent_app_country] => US
[patent_app_date] => 2021-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 12
[patent_no_of_words] => 5685
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 286
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17489759
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/489759 | Chip structure, packaging structure and manufacturing method for chip structure | Sep 28, 2021 | Issued |
Array
(
[id] => 17359893
[patent_doc_number] => 20220020689
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-01-20
[patent_title] => INDUCTOR DEVICE WIRING ARCHITECTURE, INTEGRATED CIRCUIT, AND COMMUNICATIONS DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/489649
[patent_app_country] => US
[patent_app_date] => 2021-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 14889
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -13
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17489649
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/489649 | Inductor device wiring architecture, integrated circuit, and communications device | Sep 28, 2021 | Issued |
Array
(
[id] => 17509197
[patent_doc_number] => 20220102300
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-03-31
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/488053
[patent_app_country] => US
[patent_app_date] => 2021-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7522
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -5
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17488053
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/488053 | Semiconductor device and method for manufacturing semiconductor device | Sep 27, 2021 | Issued |
Array
(
[id] => 17348912
[patent_doc_number] => 20220015244
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-01-13
[patent_title] => PRINTED WIRING-BOARD ISLANDS FOR CONNECTING CHIP PACKAGES AND METHODS OF ASSEMBLING SAME
[patent_app_type] => utility
[patent_app_number] => 17/486462
[patent_app_country] => US
[patent_app_date] => 2021-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7543
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -12
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17486462
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/486462 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Sep 26, 2021 | Issued |
Array
(
[id] => 18331825
[patent_doc_number] => 11637081
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-04-25
[patent_title] => Semiconductor package and method of manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 17/474614
[patent_app_country] => US
[patent_app_date] => 2021-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 22
[patent_no_of_words] => 10833
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17474614
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/474614 | Semiconductor package and method of manufacturing the same | Sep 13, 2021 | Issued |
Array
(
[id] => 17963709
[patent_doc_number] => 20220344290
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-10-27
[patent_title] => POLYIMIDE PROFILE CONTROL
[patent_app_type] => utility
[patent_app_number] => 17/468871
[patent_app_country] => US
[patent_app_date] => 2021-09-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7786
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17468871
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/468871 | Polyimide profile control | Sep 7, 2021 | Issued |
Array
(
[id] => 17780213
[patent_doc_number] => 20220246563
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-08-04
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 17/468008
[patent_app_country] => US
[patent_app_date] => 2021-09-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12557
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17468008
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/468008 | Semiconductor package | Sep 6, 2021 | Issued |
Array
(
[id] => 19654608
[patent_doc_number] => 12176409
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-12-24
[patent_title] => Semiconductor devices and methods of manufacturing thereof
[patent_app_type] => utility
[patent_app_number] => 17/461536
[patent_app_country] => US
[patent_app_date] => 2021-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 9044
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 64
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17461536
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/461536 | Semiconductor devices and methods of manufacturing thereof | Aug 29, 2021 | Issued |
Array
(
[id] => 18221463
[patent_doc_number] => 20230060457
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-02
[patent_title] => CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 17/460908
[patent_app_country] => US
[patent_app_date] => 2021-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9255
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 79
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17460908
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/460908 | Chip package structure, chip structure and method for forming chip structure | Aug 29, 2021 | Issued |
Array
(
[id] => 17295620
[patent_doc_number] => 20210391459
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-12-16
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
[patent_app_type] => utility
[patent_app_number] => 17/459884
[patent_app_country] => US
[patent_app_date] => 2021-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5498
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => 0
[patent_words_short_claim] => 443
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17459884
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/459884 | Semiconductor device and method of manufacturing same | Aug 26, 2021 | Issued |
Array
(
[id] => 19681324
[patent_doc_number] => 12193213
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-01-07
[patent_title] => Semiconductor structure and method of manufacturing same
[patent_app_type] => utility
[patent_app_number] => 17/411103
[patent_app_country] => US
[patent_app_date] => 2021-08-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 21
[patent_no_of_words] => 6190
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 204
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17411103
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/411103 | Semiconductor structure and method of manufacturing same | Aug 24, 2021 | Issued |
Array
(
[id] => 19539454
[patent_doc_number] => 12132011
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-10-29
[patent_title] => Integrated circuit device and fabrication method thereof
[patent_app_type] => utility
[patent_app_number] => 17/408505
[patent_app_country] => US
[patent_app_date] => 2021-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3535
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17408505
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/408505 | Integrated circuit device and fabrication method thereof | Aug 22, 2021 | Issued |
Array
(
[id] => 18935514
[patent_doc_number] => 11887958
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-01-30
[patent_title] => Coplanar bump contacts of differing sizes
[patent_app_type] => utility
[patent_app_number] => 17/403752
[patent_app_country] => US
[patent_app_date] => 2021-08-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 18
[patent_no_of_words] => 10096
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17403752
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/403752 | Coplanar bump contacts of differing sizes | Aug 15, 2021 | Issued |