Search

Lisa S. Park

Examiner (ID: 4161)

Most Active Art Unit
1729
Art Unit(s)
1729
Total Applications
793
Issued Applications
550
Pending Applications
105
Abandoned Applications
172

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18857519 [patent_doc_number] => 11855116 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Semiconductor apparatus and device [patent_app_type] => utility [patent_app_number] => 17/520199 [patent_app_country] => US [patent_app_date] => 2021-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 15509 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 391 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17520199 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/520199
Semiconductor apparatus and device Nov 4, 2021 Issued
Array ( [id] => 17709074 [patent_doc_number] => 20220209082 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-30 [patent_title] => METHOD FOR TRANSFERRING CHIPS AND METHOD FOR MANUFACTURING LED DISPLAY [patent_app_type] => utility [patent_app_number] => 17/516717 [patent_app_country] => US [patent_app_date] => 2021-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2992 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17516717 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/516717
METHOD FOR TRANSFERRING CHIPS AND METHOD FOR MANUFACTURING LED DISPLAY Nov 1, 2021 Abandoned
Array ( [id] => 18349741 [patent_doc_number] => 20230137852 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-04 [patent_title] => FLIP CHIP PACKAGE ASSEMBLY [patent_app_type] => utility [patent_app_number] => 17/515369 [patent_app_country] => US [patent_app_date] => 2021-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9539 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -24 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17515369 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/515369
Flip chip package assembly Oct 28, 2021 Issued
Array ( [id] => 18688402 [patent_doc_number] => 11784147 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-10 [patent_title] => Semiconductor device and manufacturing method of semiconductor device [patent_app_type] => utility [patent_app_number] => 17/499166 [patent_app_country] => US [patent_app_date] => 2021-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 39 [patent_no_of_words] => 13033 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17499166 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/499166
Semiconductor device and manufacturing method of semiconductor device Oct 11, 2021 Issued
Array ( [id] => 17402899 [patent_doc_number] => 20220044990 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-10 [patent_title] => WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING WIRING SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/497158 [patent_app_country] => US [patent_app_date] => 2021-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7222 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 283 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17497158 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/497158
Wiring substrate, semiconductor package and method of manufacturing wiring substrate Oct 7, 2021 Issued
Array ( [id] => 18282344 [patent_doc_number] => 20230097816 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => ELECTRIC FIELD CONTROL FOR BOND PADS IN SEMICONDUCTOR DEVICE PACKAGE [patent_app_type] => utility [patent_app_number] => 17/491522 [patent_app_country] => US [patent_app_date] => 2021-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7549 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17491522 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/491522
Electric field control for bond pads in semiconductor device package Sep 29, 2021 Issued
Array ( [id] => 18294470 [patent_doc_number] => 20230104156 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-06 [patent_title] => FLIP CHIP PACKAGE ASSEMBLY [patent_app_type] => utility [patent_app_number] => 17/491496 [patent_app_country] => US [patent_app_date] => 2021-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6964 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17491496 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/491496
Flip chip package assembly Sep 29, 2021 Issued
Array ( [id] => 18645666 [patent_doc_number] => 11769745 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-26 [patent_title] => Chip structure, packaging structure and manufacturing method for chip structure [patent_app_type] => utility [patent_app_number] => 17/489759 [patent_app_country] => US [patent_app_date] => 2021-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 5685 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 286 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17489759 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/489759
Chip structure, packaging structure and manufacturing method for chip structure Sep 28, 2021 Issued
Array ( [id] => 17359893 [patent_doc_number] => 20220020689 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-20 [patent_title] => INDUCTOR DEVICE WIRING ARCHITECTURE, INTEGRATED CIRCUIT, AND COMMUNICATIONS DEVICE [patent_app_type] => utility [patent_app_number] => 17/489649 [patent_app_country] => US [patent_app_date] => 2021-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14889 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17489649 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/489649
Inductor device wiring architecture, integrated circuit, and communications device Sep 28, 2021 Issued
Array ( [id] => 17509197 [patent_doc_number] => 20220102300 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-31 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/488053 [patent_app_country] => US [patent_app_date] => 2021-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7522 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17488053 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/488053
Semiconductor device and method for manufacturing semiconductor device Sep 27, 2021 Issued
Array ( [id] => 17348912 [patent_doc_number] => 20220015244 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-13 [patent_title] => PRINTED WIRING-BOARD ISLANDS FOR CONNECTING CHIP PACKAGES AND METHODS OF ASSEMBLING SAME [patent_app_type] => utility [patent_app_number] => 17/486462 [patent_app_country] => US [patent_app_date] => 2021-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7543 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17486462 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/486462
Printed wiring-board islands for connecting chip packages and methods of assembling same Sep 26, 2021 Issued
Array ( [id] => 18331825 [patent_doc_number] => 11637081 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-04-25 [patent_title] => Semiconductor package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/474614 [patent_app_country] => US [patent_app_date] => 2021-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 10833 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17474614 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/474614
Semiconductor package and method of manufacturing the same Sep 13, 2021 Issued
Array ( [id] => 17963709 [patent_doc_number] => 20220344290 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-27 [patent_title] => POLYIMIDE PROFILE CONTROL [patent_app_type] => utility [patent_app_number] => 17/468871 [patent_app_country] => US [patent_app_date] => 2021-09-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7786 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17468871 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/468871
Polyimide profile control Sep 7, 2021 Issued
Array ( [id] => 17780213 [patent_doc_number] => 20220246563 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/468008 [patent_app_country] => US [patent_app_date] => 2021-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12557 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17468008 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/468008
Semiconductor package Sep 6, 2021 Issued
Array ( [id] => 19654608 [patent_doc_number] => 12176409 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-24 [patent_title] => Semiconductor devices and methods of manufacturing thereof [patent_app_type] => utility [patent_app_number] => 17/461536 [patent_app_country] => US [patent_app_date] => 2021-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9044 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17461536 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/461536
Semiconductor devices and methods of manufacturing thereof Aug 29, 2021 Issued
Array ( [id] => 18221463 [patent_doc_number] => 20230060457 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/460908 [patent_app_country] => US [patent_app_date] => 2021-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9255 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17460908 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/460908
Chip package structure, chip structure and method for forming chip structure Aug 29, 2021 Issued
Array ( [id] => 17295620 [patent_doc_number] => 20210391459 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-16 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME [patent_app_type] => utility [patent_app_number] => 17/459884 [patent_app_country] => US [patent_app_date] => 2021-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5498 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => 0 [patent_words_short_claim] => 443 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17459884 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/459884
Semiconductor device and method of manufacturing same Aug 26, 2021 Issued
Array ( [id] => 19681324 [patent_doc_number] => 12193213 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-07 [patent_title] => Semiconductor structure and method of manufacturing same [patent_app_type] => utility [patent_app_number] => 17/411103 [patent_app_country] => US [patent_app_date] => 2021-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 6190 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17411103 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/411103
Semiconductor structure and method of manufacturing same Aug 24, 2021 Issued
Array ( [id] => 19539454 [patent_doc_number] => 12132011 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-29 [patent_title] => Integrated circuit device and fabrication method thereof [patent_app_type] => utility [patent_app_number] => 17/408505 [patent_app_country] => US [patent_app_date] => 2021-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3535 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17408505 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/408505
Integrated circuit device and fabrication method thereof Aug 22, 2021 Issued
Array ( [id] => 18935514 [patent_doc_number] => 11887958 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-30 [patent_title] => Coplanar bump contacts of differing sizes [patent_app_type] => utility [patent_app_number] => 17/403752 [patent_app_country] => US [patent_app_date] => 2021-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 18 [patent_no_of_words] => 10096 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17403752 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/403752
Coplanar bump contacts of differing sizes Aug 15, 2021 Issued
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