
Lissi Mojica Marquis
Examiner (ID: 14253)
| Most Active Art Unit | 3104 |
| Art Unit(s) | 3613, 3107, 3614, 3661, 3104, 3105 |
| Total Applications | 667 |
| Issued Applications | 565 |
| Pending Applications | 34 |
| Abandoned Applications | 68 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 16692288
[patent_doc_number] => 20210074767
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-03-11
[patent_title] => MEMORY DEVICE INCLUDING MULTIPLE DECKS
[patent_app_type] => utility
[patent_app_number] => 16/853386
[patent_app_country] => US
[patent_app_date] => 2020-04-20
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/853386 | Memory device including multiple decks | Apr 19, 2020 | Issued |
Array
(
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[patent_doc_number] => 20210327829
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-10-21
[patent_title] => INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
[patent_app_type] => utility
[patent_app_number] => 16/850620
[patent_app_country] => US
[patent_app_date] => 2020-04-16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/850620 | Integrated system-in-package with radiation shielding | Apr 15, 2020 | Issued |
Array
(
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[patent_doc_number] => 11264390
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[patent_kind] => B2
[patent_issue_date] => 2022-03-01
[patent_title] => Semiconductor memory device with air gaps between conductive features and method for preparing the same
[patent_app_type] => utility
[patent_app_number] => 16/850427
[patent_app_country] => US
[patent_app_date] => 2020-04-16
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Array
(
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[patent_doc_number] => 11335638
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[patent_issue_date] => 2022-05-17
[patent_title] => Reducing RC delay in semiconductor devices
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[patent_app_number] => 16/849709
[patent_app_country] => US
[patent_app_date] => 2020-04-15
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/849709 | Reducing RC delay in semiconductor devices | Apr 14, 2020 | Issued |
Array
(
[id] => 18639504
[patent_doc_number] => 11764125
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[patent_kind] => B2
[patent_issue_date] => 2023-09-19
[patent_title] => Heatsink assembly, method of manufacturing a heatsink assembly, and an electrical device
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Array
(
[id] => 17159008
[patent_doc_number] => 20210320059
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[patent_kind] => A1
[patent_issue_date] => 2021-10-14
[patent_title] => HYBRID BACK-END-OF-LINE (BEOL) DIELECTRIC FOR HIGH CAPACITANCE DENSITY METAL-OXIDE-METAL (MOM) CAPACITOR
[patent_app_type] => utility
[patent_app_number] => 16/846591
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/846591 | HYBRID BACK-END-OF-LINE (BEOL) DIELECTRIC FOR HIGH CAPACITANCE DENSITY METAL-OXIDE-METAL (MOM) CAPACITOR | Apr 12, 2020 | Abandoned |
Array
(
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[patent_doc_number] => 11239103
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[patent_issue_date] => 2022-02-01
[patent_title] => Package-on-package structure
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/846921 | Package-on-package structure | Apr 12, 2020 | Issued |
Array
(
[id] => 17145251
[patent_doc_number] => 20210313264
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[patent_kind] => A1
[patent_issue_date] => 2021-10-07
[patent_title] => BACK END OF LINE METALLIZATION
[patent_app_type] => utility
[patent_app_number] => 16/840506
[patent_app_country] => US
[patent_app_date] => 2020-04-06
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/840506 | Back end of line metallization | Apr 5, 2020 | Issued |
Array
(
[id] => 18232636
[patent_doc_number] => 11597181
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[patent_issue_date] => 2023-03-07
[patent_title] => Wavelength conversion device and method of manufacturing wavelength conversion device
[patent_app_type] => utility
[patent_app_number] => 16/839574
[patent_app_country] => US
[patent_app_date] => 2020-04-03
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/839574 | Wavelength conversion device and method of manufacturing wavelength conversion device | Apr 2, 2020 | Issued |
Array
(
[id] => 17438962
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[patent_issue_date] => 2022-03-01
[patent_title] => Power semiconductor device and method of manufacturing the same
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Array
(
[id] => 17181512
[patent_doc_number] => 11158763
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[patent_issue_date] => 2021-10-26
[patent_title] => Integration of III-nitride nanowire on transparent conductive substrates for optoelectronic and electronic devices
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Array
(
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Array
(
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Array
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Array
(
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Array
(
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Array
(
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Array
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Array
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Array
(
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[patent_title] => Electronic Chip Reliably Mounted with Compressive Strain
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