
Long K. Tran
Examiner (ID: 7591, Phone: (571)272-1797 , Office: P/2829 )
| Most Active Art Unit | 2818 |
| Art Unit(s) | 2818, 2829 |
| Total Applications | 1616 |
| Issued Applications | 1396 |
| Pending Applications | 78 |
| Abandoned Applications | 146 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6383690
[patent_doc_number] => 20100176497
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-07-15
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 12/730171
[patent_app_country] => US
[patent_app_date] => 2010-03-23
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[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0176/20100176497.pdf
[firstpage_image] =>[orig_patent_app_number] => 12730171
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/730171 | Integrated circuit package-on-package stacking system | Mar 22, 2010 | Issued |
Array
(
[id] => 8458395
[patent_doc_number] => 08294064
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[patent_kind] => B1
[patent_issue_date] => 2012-10-23
[patent_title] => 'Floating electrode assembly and automated system and method for welding projection weld nuts'
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[patent_app_date] => 2010-03-18
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Array
(
[id] => 8422099
[patent_doc_number] => 08278587
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[patent_kind] => B2
[patent_issue_date] => 2012-10-02
[patent_title] => 'Systems and methods to modify gas metal arc welding and its variants'
[patent_app_type] => utility
[patent_app_number] => 12/661433
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[patent_app_date] => 2010-03-17
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/661433 | Systems and methods to modify gas metal arc welding and its variants | Mar 16, 2010 | Issued |
Array
(
[id] => 6042427
[patent_doc_number] => 20110204504
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-08-25
[patent_title] => 'Reducing Susceptibility to Electrostatic Discharge Damage during Die-To-Die Bonding for 3-D Packaged Integrated Circuits'
[patent_app_type] => utility
[patent_app_number] => 12/710586
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[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12710586
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/710586 | Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits | Feb 22, 2010 | Issued |
Array
(
[id] => 42587
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[patent_issue_date] => 2010-08-24
[patent_title] => 'Semiconductor device and method of manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/706527 | Semiconductor device and method of manufacturing the same | Feb 15, 2010 | Issued |
Array
(
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[patent_issue_date] => 2012-10-02
[patent_title] => 'Nonvolatile memory device and method of forming the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/703066 | Nonvolatile memory device and method of forming the same | Feb 8, 2010 | Issued |
Array
(
[id] => 6271754
[patent_doc_number] => 20100117088
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[patent_title] => 'THIN FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/691881
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[pdf_file] => publications/A1/0117/20100117088.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/691881 | THIN FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | Jan 21, 2010 | Abandoned |
Array
(
[id] => 6304357
[patent_doc_number] => 20100109117
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-05-06
[patent_title] => 'IMAGE SENSOR PHOTODIODES USING A MULTI-LAYER SUBSTRATE AND CONTACT METHOD AND STRUCTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/686977
[patent_app_country] => US
[patent_app_date] => 2010-01-13
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0109/20100109117.pdf
[firstpage_image] =>[orig_patent_app_number] => 12686977
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/686977 | Image sensor photodiodes using a multi-layer substrate and contact method and structure thereof | Jan 12, 2010 | Issued |
Array
(
[id] => 6422937
[patent_doc_number] => 20100102423
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-29
[patent_title] => 'SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD'
[patent_app_type] => utility
[patent_app_number] => 12/648238
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[pdf_file] => publications/A1/0102/20100102423.pdf
[firstpage_image] =>[orig_patent_app_number] => 12648238
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/648238 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD | Dec 27, 2009 | Abandoned |
Array
(
[id] => 6075303
[patent_doc_number] => 20110140228
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-06-16
[patent_title] => 'Method of Filling Large Deep Trench with High Quality Oxide for Semiconductor Devices'
[patent_app_type] => utility
[patent_app_number] => 12/637988
[patent_app_country] => US
[patent_app_date] => 2009-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/637988 | Method of filling large deep trench with high quality oxide for semiconductor devices | Dec 14, 2009 | Issued |
Array
(
[id] => 8410221
[patent_doc_number] => 08273618
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-09-25
[patent_title] => 'Formation of high-K gate stacks in semiconductor devices'
[patent_app_type] => utility
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Array
(
[id] => 6075355
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[patent_title] => 'DAP GROUND BOND ENHANCEMENT'
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Array
(
[id] => 8527767
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[patent_issue_date] => 2012-11-06
[patent_title] => 'Integrated circuit packaging system with bond wire pads and method of manufacture thereof'
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Array
(
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[patent_title] => 'RESISTANCE SWITCHING MEMORY'
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Array
(
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Array
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Array
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Array
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Array
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Array
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