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Long Pham

Examiner (ID: 14777, Phone: (571)272-1714 , Office: P/2814 )

Most Active Art Unit
2814
Art Unit(s)
1107, 2897, 2814, 2822, 2899, 2812, 1763, 2823
Total Applications
3722
Issued Applications
3282
Pending Applications
147
Abandoned Applications
335

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17708703 [patent_doc_number] => 20220208711 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-30 [patent_title] => DIE AND PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/699192 [patent_app_country] => US [patent_app_date] => 2022-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7929 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17699192 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/699192
Die and package structure Mar 20, 2022 Issued
Array ( [id] => 18150186 [patent_doc_number] => 20230024043 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-26 [patent_title] => Semiconductor Packages with Thermal Lid and Methods of Forming the Same [patent_app_type] => utility [patent_app_number] => 17/698611 [patent_app_country] => US [patent_app_date] => 2022-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7145 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17698611 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/698611
Semiconductor packages with thermal lid and methods of forming the same Mar 17, 2022 Issued
Array ( [id] => 18653130 [patent_doc_number] => 20230298970 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/697932 [patent_app_country] => US [patent_app_date] => 2022-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8990 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17697932 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/697932
Semiconductor package structure and method for forming the same Mar 17, 2022 Issued
Array ( [id] => 19741220 [patent_doc_number] => 12218065 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-04 [patent_title] => Semiconductor package including adhesive layer and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/697243 [patent_app_country] => US [patent_app_date] => 2022-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5519 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17697243 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/697243
Semiconductor package including adhesive layer and method for manufacturing the same Mar 16, 2022 Issued
Array ( [id] => 19796300 [patent_doc_number] => 12237269 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-25 [patent_title] => Scalable large system based on organic interconnect [patent_app_type] => utility [patent_app_number] => 17/655157 [patent_app_country] => US [patent_app_date] => 2022-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 5791 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17655157 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/655157
Scalable large system based on organic interconnect Mar 15, 2022 Issued
Array ( [id] => 19926371 [patent_doc_number] => 12300667 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-13 [patent_title] => Semiconductor package and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 17/692693 [patent_app_country] => US [patent_app_date] => 2022-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 6559 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17692693 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/692693
Semiconductor package and method of fabricating the same Mar 10, 2022 Issued
Array ( [id] => 17692192 [patent_doc_number] => 20220199485 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-23 [patent_title] => MODULE [patent_app_type] => utility [patent_app_number] => 17/654271 [patent_app_country] => US [patent_app_date] => 2022-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4406 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17654271 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/654271
Module Mar 9, 2022 Issued
Array ( [id] => 18874925 [patent_doc_number] => 11862750 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-02 [patent_title] => Optoelectronic device [patent_app_type] => utility [patent_app_number] => 17/653188 [patent_app_country] => US [patent_app_date] => 2022-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 43 [patent_figures_cnt] => 54 [patent_no_of_words] => 23429 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 173 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17653188 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/653188
Optoelectronic device Mar 1, 2022 Issued
Array ( [id] => 18935499 [patent_doc_number] => 11887943 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-30 [patent_title] => Semiconductor devices, semiconductor device packages and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/684375 [patent_app_country] => US [patent_app_date] => 2022-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 5902 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17684375 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/684375
Semiconductor devices, semiconductor device packages and method for manufacturing the same Feb 28, 2022 Issued
Array ( [id] => 18149815 [patent_doc_number] => 20230023672 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-26 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/680410 [patent_app_country] => US [patent_app_date] => 2022-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11309 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17680410 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/680410
Semiconductor package Feb 24, 2022 Issued
Array ( [id] => 18193826 [patent_doc_number] => 20230047345 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-16 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/680617 [patent_app_country] => US [patent_app_date] => 2022-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8954 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17680617 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/680617
Semiconductor package Feb 24, 2022 Issued
Array ( [id] => 19328854 [patent_doc_number] => 12046543 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-23 [patent_title] => Package substrate and chip package structure using the same [patent_app_type] => utility [patent_app_number] => 17/679862 [patent_app_country] => US [patent_app_date] => 2022-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6342 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 324 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17679862 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/679862
Package substrate and chip package structure using the same Feb 23, 2022 Issued
Array ( [id] => 19610943 [patent_doc_number] => 12159824 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-03 [patent_title] => 3D package configuration [patent_app_type] => utility [patent_app_number] => 17/678193 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2391 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 312 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678193 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/678193
3D package configuration Feb 22, 2022 Issued
Array ( [id] => 18999215 [patent_doc_number] => 11916071 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-27 [patent_title] => Semiconductor device having epitaxy source/drain regions [patent_app_type] => utility [patent_app_number] => 17/678856 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 6969 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678856 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/678856
Semiconductor device having epitaxy source/drain regions Feb 22, 2022 Issued
Array ( [id] => 17692290 [patent_doc_number] => 20220199583 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-23 [patent_title] => 3D PACKAGE CONFIGURATION [patent_app_type] => utility [patent_app_number] => 17/678204 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3343 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678204 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/678204
3D package configuration Feb 22, 2022 Issued
Array ( [id] => 20080865 [patent_doc_number] => 12354942 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-08 [patent_title] => 3D package configuration [patent_app_type] => utility [patent_app_number] => 17/678197 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 0 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 271 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678197 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/678197
3D package configuration Feb 22, 2022 Issued
Array ( [id] => 18608113 [patent_doc_number] => 11749591 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2023-09-05 [patent_title] => Power converter package with thermally enhanced interposers to cooling fins [patent_app_type] => utility [patent_app_number] => 17/676960 [patent_app_country] => US [patent_app_date] => 2022-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 5049 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 373 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17676960 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/676960
Power converter package with thermally enhanced interposers to cooling fins Feb 21, 2022 Issued
Array ( [id] => 18585998 [patent_doc_number] => 20230268263 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-24 [patent_title] => SILICON SPACERS WITH IMPROVED ADHESION AND SEMICONDUCTOR DEVICE ASSEMBLIES INCORPORATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/676037 [patent_app_country] => US [patent_app_date] => 2022-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5895 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17676037 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/676037
Silicon spacers with improved adhesion and semiconductor device assemblies incorporating the same Feb 17, 2022 Issued
Array ( [id] => 18126050 [patent_doc_number] => 20230011669 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-12 [patent_title] => ELECTRONIC DEVICE INCLUDING COLOR FILTERS [patent_app_type] => utility [patent_app_number] => 17/651133 [patent_app_country] => US [patent_app_date] => 2022-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18102 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 228 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17651133 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/651133
Electronic device including color filters Feb 14, 2022 Issued
Array ( [id] => 17615449 [patent_doc_number] => 20220157729 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-19 [patent_title] => SEMICONDUCTOR DEVICE HAVING METAL INTERCONNECTS WITH DIFFERENT THICKNESSES [patent_app_type] => utility [patent_app_number] => 17/649637 [patent_app_country] => US [patent_app_date] => 2022-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5303 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17649637 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/649637
Semiconductor device having metal interconnects with different thicknesses Jan 31, 2022 Issued
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