Search

Long Pham

Examiner (ID: 14777, Phone: (571)272-1714 , Office: P/2814 )

Most Active Art Unit
2814
Art Unit(s)
1107, 2897, 2814, 2822, 2899, 2812, 1763, 2823
Total Applications
3722
Issued Applications
3282
Pending Applications
147
Abandoned Applications
335

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18357867 [patent_doc_number] => 11646273 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-09 [patent_title] => Module [patent_app_type] => utility [patent_app_number] => 17/205052 [patent_app_country] => US [patent_app_date] => 2021-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 25 [patent_no_of_words] => 5775 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17205052 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/205052
Module Mar 17, 2021 Issued
Array ( [id] => 18219550 [patent_doc_number] => 11594499 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-28 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/203007 [patent_app_country] => US [patent_app_date] => 2021-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4182 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17203007 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/203007
Semiconductor package Mar 15, 2021 Issued
Array ( [id] => 18723324 [patent_doc_number] => 11800702 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-24 [patent_title] => Method of forming a memory device [patent_app_type] => utility [patent_app_number] => 17/202359 [patent_app_country] => US [patent_app_date] => 2021-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5642 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17202359 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/202359
Method of forming a memory device Mar 15, 2021 Issued
Array ( [id] => 17389434 [patent_doc_number] => 20220037286 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-03 [patent_title] => SEMICONDUCTOR PACKAGES INCLUDING DAM PATTERNS AND METHODS FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/203555 [patent_app_country] => US [patent_app_date] => 2021-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6808 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -29 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17203555 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/203555
Semiconductor packages including dam patterns and methods for manufacturing the same Mar 15, 2021 Issued
Array ( [id] => 19314443 [patent_doc_number] => 12040269 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-16 [patent_title] => Preparation method for leads of semiconductor structure, and semiconductor structure [patent_app_type] => utility [patent_app_number] => 17/433348 [patent_app_country] => US [patent_app_date] => 2021-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 23 [patent_no_of_words] => 4721 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 218 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17433348 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/433348
Preparation method for leads of semiconductor structure, and semiconductor structure Mar 14, 2021 Issued
Array ( [id] => 18804390 [patent_doc_number] => 11837554 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-05 [patent_title] => Semiconductor package and semiconductor device [patent_app_type] => utility [patent_app_number] => 17/200411 [patent_app_country] => US [patent_app_date] => 2021-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 7401 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17200411 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/200411
Semiconductor package and semiconductor device Mar 11, 2021 Issued
Array ( [id] => 17389371 [patent_doc_number] => 20220037223 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-03 [patent_title] => ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/199371 [patent_app_country] => US [patent_app_date] => 2021-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4194 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17199371 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/199371
Electronic package structure and fabrication method thereof Mar 10, 2021 Issued
Array ( [id] => 18236007 [patent_doc_number] => 11600572 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-03-07 [patent_title] => Routing structure between dies and method for arranging routing between dies [patent_app_type] => utility [patent_app_number] => 17/198262 [patent_app_country] => US [patent_app_date] => 2021-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4322 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 274 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17198262 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/198262
Routing structure between dies and method for arranging routing between dies Mar 10, 2021 Issued
Array ( [id] => 17100248 [patent_doc_number] => 20210288039 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => RF CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 17/196965 [patent_app_country] => US [patent_app_date] => 2021-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10739 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17196965 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/196965
RF circuit module and manufacturing method therefor Mar 8, 2021 Issued
Array ( [id] => 17262813 [patent_doc_number] => 20210375798 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-02 [patent_title] => Package Interface with Improved Impedance Continuity [patent_app_type] => utility [patent_app_number] => 17/194390 [patent_app_country] => US [patent_app_date] => 2021-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2732 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17194390 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/194390
Package interface with improved impedance continuity Mar 7, 2021 Issued
Array ( [id] => 16920576 [patent_doc_number] => 20210193668 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-24 [patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/194324 [patent_app_country] => US [patent_app_date] => 2021-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3247 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17194324 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/194324
Semiconductor device and manufacturing method thereof Mar 7, 2021 Issued
Array ( [id] => 17855224 [patent_doc_number] => 20220285267 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-08 [patent_title] => FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/249436 [patent_app_country] => US [patent_app_date] => 2021-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6789 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17249436 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/249436
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES Mar 1, 2021 Abandoned
Array ( [id] => 16873644 [patent_doc_number] => 20210167111 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-03 [patent_title] => SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/175135 [patent_app_country] => US [patent_app_date] => 2021-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5277 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17175135 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/175135
Solid-state imaging device, method of manufacturing the same, and electronic device Feb 11, 2021 Issued
Array ( [id] => 18304459 [patent_doc_number] => 11626373 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-04-11 [patent_title] => Semiconductor packages including antenna pattern [patent_app_type] => utility [patent_app_number] => 17/172427 [patent_app_country] => US [patent_app_date] => 2021-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 13358 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17172427 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/172427
Semiconductor packages including antenna pattern Feb 9, 2021 Issued
Array ( [id] => 18481214 [patent_doc_number] => 11694969 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-04 [patent_title] => Semiconductor package and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 17/171708 [patent_app_country] => US [patent_app_date] => 2021-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 20 [patent_no_of_words] => 6358 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17171708 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/171708
Semiconductor package and method of fabricating the same Feb 8, 2021 Issued
Array ( [id] => 18205487 [patent_doc_number] => 11587892 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-21 [patent_title] => Electronic package and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/159527 [patent_app_country] => US [patent_app_date] => 2021-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 4301 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17159527 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/159527
Electronic package and manufacturing method thereof Jan 26, 2021 Issued
Array ( [id] => 18357853 [patent_doc_number] => 11646259 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-09 [patent_title] => Redistribution structure and forming method thereof [patent_app_type] => utility [patent_app_number] => 17/159012 [patent_app_country] => US [patent_app_date] => 2021-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 30 [patent_no_of_words] => 7172 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17159012 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/159012
Redistribution structure and forming method thereof Jan 25, 2021 Issued
Array ( [id] => 17700249 [patent_doc_number] => 11373983 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2022-06-28 [patent_title] => 3D package configuration [patent_app_type] => utility [patent_app_number] => 17/158080 [patent_app_country] => US [patent_app_date] => 2021-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 69 [patent_figures_cnt] => 69 [patent_no_of_words] => 22479 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 401 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17158080 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/158080
3D package configuration Jan 25, 2021 Issued
Array ( [id] => 16827799 [patent_doc_number] => 20210143092 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-05-13 [patent_title] => CERAMIC LAMINATED SUBSTRATE, MODULE, AND METHOD OF MANUFACTURING CERAMIC LAMINATED SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/156026 [patent_app_country] => US [patent_app_date] => 2021-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5854 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 213 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17156026 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/156026
Ceramic laminated substrate, module, and method of manufacturing ceramic laminated substrate Jan 21, 2021 Issued
Array ( [id] => 17303053 [patent_doc_number] => 20210398892 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-23 [patent_title] => ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/155450 [patent_app_country] => US [patent_app_date] => 2021-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9799 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17155450 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/155450
Adapter board and method for forming same, packaging method, and package structure Jan 21, 2021 Issued
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