Search

Long Pham

Examiner (ID: 2012, Phone: (571)272-1714 , Office: P/2814 )

Most Active Art Unit
2814
Art Unit(s)
2823, 1107, 2822, 2812, 2814, 2897, 1763, 2899
Total Applications
3736
Issued Applications
3294
Pending Applications
136
Abandoned Applications
335

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19873744 [patent_doc_number] => 12266615 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-01 [patent_title] => Selective EMI shielding using preformed mask with fang design [patent_app_type] => utility [patent_app_number] => 18/174790 [patent_app_country] => US [patent_app_date] => 2023-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 28 [patent_no_of_words] => 6246 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18174790 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/174790
Selective EMI shielding using preformed mask with fang design Feb 26, 2023 Issued
Array ( [id] => 19524020 [patent_doc_number] => 12125760 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-22 [patent_title] => Method for fabricating electronic package structure [patent_app_type] => utility [patent_app_number] => 18/113062 [patent_app_country] => US [patent_app_date] => 2023-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4225 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 235 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18113062 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/113062
Method for fabricating electronic package structure Feb 22, 2023 Issued
Array ( [id] => 19675754 [patent_doc_number] => 12187603 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-07 [patent_title] => Semiconductor package using a polymer substrate [patent_app_type] => utility [patent_app_number] => 18/106203 [patent_app_country] => US [patent_app_date] => 2023-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4512 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18106203 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/106203
Semiconductor package using a polymer substrate Feb 5, 2023 Issued
Array ( [id] => 18424035 [patent_doc_number] => 20230178499 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-08 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/162878 [patent_app_country] => US [patent_app_date] => 2023-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4198 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => 0 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18162878 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/162878
Semiconductor package Jan 31, 2023 Issued
Array ( [id] => 19539450 [patent_doc_number] => 12132007 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-29 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 18/103584 [patent_app_country] => US [patent_app_date] => 2023-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 7729 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18103584 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/103584
Semiconductor package Jan 30, 2023 Issued
Array ( [id] => 18617637 [patent_doc_number] => 20230284378 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-07 [patent_title] => STORAGE DEVICE INCLUDING CONFIGURABLE PRINTED CIRCUIT BOARD [patent_app_type] => utility [patent_app_number] => 18/103175 [patent_app_country] => US [patent_app_date] => 2023-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10619 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18103175 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/103175
Storage device including configurable printed circuit board Jan 29, 2023 Issued
Array ( [id] => 18570529 [patent_doc_number] => 20230260866 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/157159 [patent_app_country] => US [patent_app_date] => 2023-01-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5076 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18157159 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/157159
SEMICONDUCTOR PACKAGE STRUCTURE Jan 19, 2023 Pending
Array ( [id] => 18396782 [patent_doc_number] => 20230165003 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-25 [patent_title] => MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/099108 [patent_app_country] => US [patent_app_date] => 2023-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18658 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18099108 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/099108
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Jan 18, 2023 Pending
Array ( [id] => 18812689 [patent_doc_number] => 20230387026 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/098972 [patent_app_country] => US [patent_app_date] => 2023-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5884 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18098972 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/098972
SEMICONDUCTOR PACKAGE Jan 18, 2023 Pending
Array ( [id] => 18381934 [patent_doc_number] => 20230157025 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/099136 [patent_app_country] => US [patent_app_date] => 2023-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15992 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18099136 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/099136
Semiconductor device and manufacturing method of the semiconductor device Jan 18, 2023 Issued
Array ( [id] => 18379783 [patent_doc_number] => 20230154872 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/097847 [patent_app_country] => US [patent_app_date] => 2023-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4329 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18097847 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/097847
Electronic package and manufacturing method thereof Jan 16, 2023 Issued
Array ( [id] => 18379784 [patent_doc_number] => 20230154873 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/097965 [patent_app_country] => US [patent_app_date] => 2023-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4300 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18097965 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/097965
Electronic package and manufacturing method thereof Jan 16, 2023 Issued
Array ( [id] => 18898704 [patent_doc_number] => 20240014189 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-11 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 18/154739 [patent_app_country] => US [patent_app_date] => 2023-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9374 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 196 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18154739 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/154739
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD Jan 12, 2023 Pending
Array ( [id] => 18456480 [patent_doc_number] => 20230197762 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MAKING [patent_app_type] => utility [patent_app_number] => 18/151917 [patent_app_country] => US [patent_app_date] => 2023-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6479 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151917 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/151917
Complementary metal-oxide-semiconductor image sensor and method of making Jan 8, 2023 Issued
Array ( [id] => 19023185 [patent_doc_number] => 20240079356 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => Integrated Circuit Packages and Methods of Forming the Same [patent_app_type] => utility [patent_app_number] => 18/151623 [patent_app_country] => US [patent_app_date] => 2023-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15106 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151623 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/151623
Integrated Circuit Packages and Methods of Forming the Same Jan 8, 2023 Pending
Array ( [id] => 19255196 [patent_doc_number] => 20240206193 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-20 [patent_title] => STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS [patent_app_type] => utility [patent_app_number] => 18/151742 [patent_app_country] => US [patent_app_date] => 2023-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10555 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151742 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/151742
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS Jan 8, 2023 Pending
Array ( [id] => 18959182 [patent_doc_number] => 20240047509 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-08 [patent_title] => Packages with Chips Comprising Inductor-Vias and Methods Forming the Same [patent_app_type] => utility [patent_app_number] => 18/150624 [patent_app_country] => US [patent_app_date] => 2023-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7830 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18150624 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/150624
Packages with Chips Comprising Inductor-Vias and Methods Forming the Same Jan 4, 2023 Pending
Array ( [id] => 20598234 [patent_doc_number] => 12581974 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-17 [patent_title] => Semiconductor device and method of making a semiconductor package with graphene-coated interconnects [patent_app_type] => utility [patent_app_number] => 18/150634 [patent_app_country] => US [patent_app_date] => 2023-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 24 [patent_no_of_words] => 0 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18150634 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/150634
Semiconductor device and method of making a semiconductor package with graphene-coated interconnects Jan 4, 2023 Issued
Array ( [id] => 18362590 [patent_doc_number] => 20230144181 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => CERAMIC LAMINATED SUBSTRATE, MODULE, AND METHOD OF MANUFACTURING CERAMIC LAMINATED SUBSTRATE [patent_app_type] => utility [patent_app_number] => 18/149205 [patent_app_country] => US [patent_app_date] => 2023-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5869 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -3 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149205 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/149205
Ceramic laminated substrate, module, and method of manufacturing ceramic laminated substrate Jan 2, 2023 Issued
Array ( [id] => 18363472 [patent_doc_number] => 20230145063 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => Process Control for Package Formation [patent_app_type] => utility [patent_app_number] => 18/149472 [patent_app_country] => US [patent_app_date] => 2023-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7648 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149472 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/149472
Process control for package formation Jan 2, 2023 Issued
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