Search

Long Pham

Examiner (ID: 14777, Phone: (571)272-1714 , Office: P/2814 )

Most Active Art Unit
2814
Art Unit(s)
1107, 2897, 2814, 2822, 2899, 2812, 1763, 2823
Total Applications
3722
Issued Applications
3282
Pending Applications
147
Abandoned Applications
335

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19038266 [patent_doc_number] => 20240088081 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => DIE PACKAGE WITH SEALED DIE ENCLOSURES [patent_app_type] => utility [patent_app_number] => 17/932209 [patent_app_country] => US [patent_app_date] => 2022-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9550 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -38 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17932209 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/932209
DIE PACKAGE WITH SEALED DIE ENCLOSURES Sep 13, 2022 Pending
Array ( [id] => 19407195 [patent_doc_number] => 20240290706 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-29 [patent_title] => CHIP STRUCTURE, METHOD FOR MANUFACTURING CHIP STRUCTURE, AND ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 18/024109 [patent_app_country] => US [patent_app_date] => 2022-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7628 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18024109 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/024109
CHIP STRUCTURE, METHOD FOR MANUFACTURING CHIP STRUCTURE, AND ELECTRONIC DEVICE Sep 8, 2022 Pending
Array ( [id] => 20346075 [patent_doc_number] => 12469810 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-11 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/939127 [patent_app_country] => US [patent_app_date] => 2022-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 18 [patent_no_of_words] => 9792 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17939127 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/939127
Semiconductor package Sep 6, 2022 Issued
Array ( [id] => 18097734 [patent_doc_number] => 20220416075 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => VERTICAL SEMICONDUCTOR DEVICE WITH IMPROVED RUGGEDNESS [patent_app_type] => utility [patent_app_number] => 17/929858 [patent_app_country] => US [patent_app_date] => 2022-09-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9301 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -26 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17929858 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/929858
Vertical semiconductor device with improved ruggedness Sep 5, 2022 Issued
Array ( [id] => 18351140 [patent_doc_number] => 20230139251 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-04 [patent_title] => DUAL SIDED MOLDED PACKAGE WITH VARYING INTERCONNECT PAD SIZES AND VARYING EXPOSED SOLDERABLE AREA [patent_app_type] => utility [patent_app_number] => 17/929499 [patent_app_country] => US [patent_app_date] => 2022-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9552 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17929499 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/929499
DUAL SIDED MOLDED PACKAGE WITH VARYING INTERCONNECT PAD SIZES AND VARYING EXPOSED SOLDERABLE AREA Sep 1, 2022 Issued
Array ( [id] => 19007874 [patent_doc_number] => 20240071945 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/900814 [patent_app_country] => US [patent_app_date] => 2022-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9438 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17900814 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/900814
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME Aug 30, 2022 Pending
Array ( [id] => 20389350 [patent_doc_number] => 12489085 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-02 [patent_title] => C2C yield and performance optimization in a die stacking platform [patent_app_type] => utility [patent_app_number] => 17/895353 [patent_app_country] => US [patent_app_date] => 2022-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4886 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17895353 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/895353
C2C yield and performance optimization in a die stacking platform Aug 24, 2022 Issued
Array ( [id] => 19007961 [patent_doc_number] => 20240072032 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE AND A METALLIZATION PORTION [patent_app_type] => utility [patent_app_number] => 17/894043 [patent_app_country] => US [patent_app_date] => 2022-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24950 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -27 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17894043 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/894043
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE AND A METALLIZATION PORTION Aug 22, 2022 Pending
Array ( [id] => 18991102 [patent_doc_number] => 20240063071 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMPOSITE STRUCTURES [patent_app_type] => utility [patent_app_number] => 17/891880 [patent_app_country] => US [patent_app_date] => 2022-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10289 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17891880 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/891880
INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMPOSITE STRUCTURES Aug 18, 2022 Pending
Array ( [id] => 18540967 [patent_doc_number] => 20230246079 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/820996 [patent_app_country] => US [patent_app_date] => 2022-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8441 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 250 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17820996 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/820996
SEMICONDUCTOR DEVICE Aug 18, 2022 Pending
Array ( [id] => 18585991 [patent_doc_number] => 20230268256 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-24 [patent_title] => ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/890279 [patent_app_country] => US [patent_app_date] => 2022-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7249 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17890279 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/890279
Electronic package structure and manufacturing method thereof Aug 17, 2022 Issued
Array ( [id] => 18040144 [patent_doc_number] => 20220384361 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => Semiconductor Device and Method of Compartment Shielding Using Bond Wires [patent_app_type] => utility [patent_app_number] => 17/819271 [patent_app_country] => US [patent_app_date] => 2022-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4882 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17819271 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/819271
Semiconductor device and method of compartment shielding using bond wires Aug 10, 2022 Issued
Array ( [id] => 19943704 [patent_doc_number] => 12315840 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-27 [patent_title] => Microelectronic assemblies [patent_app_type] => utility [patent_app_number] => 17/885048 [patent_app_country] => US [patent_app_date] => 2022-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 51 [patent_figures_cnt] => 57 [patent_no_of_words] => 20685 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17885048 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/885048
Microelectronic assemblies Aug 9, 2022 Issued
Array ( [id] => 18040072 [patent_doc_number] => 20220384289 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/884515 [patent_app_country] => US [patent_app_date] => 2022-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6208 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 35 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17884515 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/884515
Semiconductor package device and method of manufacturing the same Aug 8, 2022 Issued
Array ( [id] => 18617706 [patent_doc_number] => 20230284447 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-07 [patent_title] => SEMICONDUCTOR MEMORY DEVICE [patent_app_type] => utility [patent_app_number] => 17/883410 [patent_app_country] => US [patent_app_date] => 2022-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 20283 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17883410 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/883410
SEMICONDUCTOR MEMORY DEVICE Aug 7, 2022 Pending
Array ( [id] => 18039981 [patent_doc_number] => 20220384198 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => METHOD FOR POLISHING SEMICONDUCTOR SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/818135 [patent_app_country] => US [patent_app_date] => 2022-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5445 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17818135 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/818135
Method for polishing semiconductor substrate Aug 7, 2022 Issued
Array ( [id] => 19705021 [patent_doc_number] => 12199068 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-14 [patent_title] => Methods of forming microelectronic device assemblies and packages [patent_app_type] => utility [patent_app_number] => 17/817690 [patent_app_country] => US [patent_app_date] => 2022-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 37 [patent_no_of_words] => 23341 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17817690 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/817690
Methods of forming microelectronic device assemblies and packages Aug 4, 2022 Issued
Array ( [id] => 18008497 [patent_doc_number] => 20220367264 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SELECTIVE TUNGSTEN DEPOSITION AT LOW TEMPERATURES [patent_app_type] => utility [patent_app_number] => 17/878599 [patent_app_country] => US [patent_app_date] => 2022-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5706 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17878599 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/878599
Selective tungsten deposition at low temperatures Jul 31, 2022 Issued
Array ( [id] => 18008568 [patent_doc_number] => 20220367335 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/816376 [patent_app_country] => US [patent_app_date] => 2022-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5826 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17816376 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/816376
Semiconductor device and method for manufacturing the same Jul 28, 2022 Issued
Array ( [id] => 18008565 [patent_doc_number] => 20220367332 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/816264 [patent_app_country] => US [patent_app_date] => 2022-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6987 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17816264 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/816264
Semiconductor package device with integrated inductor and manufacturing method thereof Jul 28, 2022 Issued
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