
Lynette T. Umez Eronini
Examiner (ID: 14831)
| Most Active Art Unit | 1765 |
| Art Unit(s) | 1792, 1763, 1765 |
| Total Applications | 437 |
| Issued Applications | 331 |
| Pending Applications | 29 |
| Abandoned Applications | 77 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6838939
[patent_doc_number] => 20030036279
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-02-20
[patent_title] => 'Thermal inkjet printhead processing with silicon etching'
[patent_app_type] => new
[patent_app_number] => 09/932055
[patent_app_country] => US
[patent_app_date] => 2001-08-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4426
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0036/20030036279.pdf
[firstpage_image] =>[orig_patent_app_number] => 09932055
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/932055 | Thermal inkjet printhead processing with silicon etching | Aug 15, 2001 | Issued |
Array
(
[id] => 1177556
[patent_doc_number] => 06743725
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-06-01
[patent_title] => 'High selectivity SiC etch in integrated circuit fabrication'
[patent_app_type] => B1
[patent_app_number] => 09/928570
[patent_app_country] => US
[patent_app_date] => 2001-08-13
[patent_effective_date] => 0000-00-00
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[patent_words_short_claim] => 173
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/743/06743725.pdf
[firstpage_image] =>[orig_patent_app_number] => 09928570
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/928570 | High selectivity SiC etch in integrated circuit fabrication | Aug 12, 2001 | Issued |
Array
(
[id] => 1312368
[patent_doc_number] => 06610602
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-08-26
[patent_title] => 'Magnetic field sensor and method of manufacturing same using a self-organizing polymer mask'
[patent_app_type] => B2
[patent_app_number] => 09/927860
[patent_app_country] => US
[patent_app_date] => 2001-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 4314
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/610/06610602.pdf
[firstpage_image] =>[orig_patent_app_number] => 09927860
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/927860 | Magnetic field sensor and method of manufacturing same using a self-organizing polymer mask | Aug 9, 2001 | Issued |
Array
(
[id] => 1017965
[patent_doc_number] => 06890859
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2005-05-10
[patent_title] => 'Methods of forming semiconductor structures having reduced defects, and articles and devices formed thereby'
[patent_app_type] => utility
[patent_app_number] => 09/927863
[patent_app_country] => US
[patent_app_date] => 2001-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 5582
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/890/06890859.pdf
[firstpage_image] =>[orig_patent_app_number] => 09927863
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/927863 | Methods of forming semiconductor structures having reduced defects, and articles and devices formed thereby | Aug 9, 2001 | Issued |
Array
(
[id] => 1592386
[patent_doc_number] => 06383410
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-07
[patent_title] => 'Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent'
[patent_app_type] => B1
[patent_app_number] => 09/925874
[patent_app_country] => US
[patent_app_date] => 2001-08-08
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 1745
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/383/06383410.pdf
[firstpage_image] =>[orig_patent_app_number] => 09925874
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/925874 | Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent | Aug 7, 2001 | Issued |
Array
(
[id] => 6565906
[patent_doc_number] => 20020084248
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-07-04
[patent_title] => 'Wet etch process and composition for forming openings in a polymer substrate'
[patent_app_type] => new
[patent_app_number] => 09/920499
[patent_app_country] => US
[patent_app_date] => 2001-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0084/20020084248.pdf
[firstpage_image] =>[orig_patent_app_number] => 09920499
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/920499 | Wet etch process and composition for forming openings in a polymer substrate | Jul 31, 2001 | Pending |
Array
(
[id] => 6209429
[patent_doc_number] => 20020072235
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-13
[patent_title] => 'Mixed acid solution in etching process, process for producing the same, etching process using the same and process for producing semiconductor device'
[patent_app_type] => new
[patent_app_number] => 09/916381
[patent_app_country] => US
[patent_app_date] => 2001-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 7962
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[pdf_file] => publications/A1/0072/20020072235.pdf
[firstpage_image] =>[orig_patent_app_number] => 09916381
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/916381 | Mixed acid solution in etching process, process for producing the same, etching process using the same and process for producing semiconductor device | Jul 26, 2001 | Abandoned |
Array
(
[id] => 1172802
[patent_doc_number] => 06746621
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-06-08
[patent_title] => 'Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board'
[patent_app_type] => B2
[patent_app_number] => 09/912318
[patent_app_country] => US
[patent_app_date] => 2001-07-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3951
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[pdf_file] => patents/06/746/06746621.pdf
[firstpage_image] =>[orig_patent_app_number] => 09912318
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/912318 | Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board | Jul 25, 2001 | Issued |
Array
(
[id] => 1264568
[patent_doc_number] => 06660642
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-12-09
[patent_title] => 'Toxic residual gas removal by non-reactive ion sputtering'
[patent_app_type] => B2
[patent_app_number] => 09/912623
[patent_app_country] => US
[patent_app_date] => 2001-07-25
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/660/06660642.pdf
[firstpage_image] =>[orig_patent_app_number] => 09912623
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/912623 | Toxic residual gas removal by non-reactive ion sputtering | Jul 24, 2001 | Issued |
Array
(
[id] => 1141638
[patent_doc_number] => 06777337
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-08-17
[patent_title] => 'Planarizing method of semiconductor wafer and apparatus thereof'
[patent_app_type] => B2
[patent_app_number] => 09/910904
[patent_app_country] => US
[patent_app_date] => 2001-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 6509
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[pdf_file] => patents/06/777/06777337.pdf
[firstpage_image] =>[orig_patent_app_number] => 09910904
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/910904 | Planarizing method of semiconductor wafer and apparatus thereof | Jul 23, 2001 | Issued |
Array
(
[id] => 5811838
[patent_doc_number] => 20020038681
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-04-04
[patent_title] => 'Masking material for dry etching'
[patent_app_type] => new
[patent_app_number] => 09/910854
[patent_app_country] => US
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[pdf_file] => publications/A1/0038/20020038681.pdf
[firstpage_image] =>[orig_patent_app_number] => 09910854
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/910854 | Masking material for dry etching | Jul 23, 2001 | Abandoned |
Array
(
[id] => 1155283
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[patent_kind] => B1
[patent_issue_date] => 2004-07-20
[patent_title] => 'Use of slurry waste composition to determine the amount of metal removed during chemical mechanical polishing, and system for accomplishing same'
[patent_app_type] => B1
[patent_app_number] => 09/909112
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/909112 | Use of slurry waste composition to determine the amount of metal removed during chemical mechanical polishing, and system for accomplishing same | Jul 18, 2001 | Issued |
Array
(
[id] => 5814901
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[patent_issue_date] => 2002-04-04
[patent_title] => 'Method of manufacturing a semiconductor device'
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Array
(
[id] => 1299868
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[patent_issue_date] => 2003-09-23
[patent_title] => 'Method of fabricating nickel etching mask'
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[patent_app_number] => 09/906884
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/906884 | Method of fabricating nickel etching mask | Jul 16, 2001 | Issued |
Array
(
[id] => 6733116
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[patent_issue_date] => 2003-01-16
[patent_title] => 'Extrusion-free wet cleaning process for copper-dual damascene structures'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/682054 | Extrusion-free wet cleaning process for copper-dual damascene structures | Jul 15, 2001 | Issued |
Array
(
[id] => 6060235
[patent_doc_number] => 20020030178
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[patent_issue_date] => 2002-03-14
[patent_title] => 'Etching solutions and processes for manufacturing flexible wiring boards'
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Array
(
[id] => 1172853
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[patent_title] => 'Method of manufacturing wireless suspension blank'
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Array
(
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Array
(
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Array
(
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[firstpage_image] =>[orig_patent_app_number] => 09891730
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/891730 | Cleaning method and solution for cleaning a wafer in a single wafer process | Jun 24, 2001 | Issued |