Lynne Ann Gurley
Supervisory Patent Examiner (ID: 16126, Phone: (571)272-1670 , Office: P/2811 )
Most Active Art Unit | 2812 |
Art Unit(s) | 2812, 2899, 2811, 1104, 1763, 2814 |
Total Applications | 970 |
Issued Applications | 787 |
Pending Applications | 29 |
Abandoned Applications | 154 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 14955203
[patent_doc_number] => 10438880
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[patent_issue_date] => 2019-10-08
[patent_title] => Interposer with a nanostructure energy storage device
[patent_app_type] => utility
[patent_app_number] => 16/078331
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/078331 | Interposer with a nanostructure energy storage device | Feb 23, 2017 | Issued |
Array
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[patent_kind] => B1
[patent_issue_date] => 2017-10-17
[patent_title] => 'Wireless apparatus'
[patent_app_type] => utility
[patent_app_number] => 15/438895
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/438895 | Wireless apparatus | Feb 21, 2017 | Issued |
Array
(
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[patent_issue_date] => 2018-11-20
[patent_title] => Semiconductor device
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[patent_app_number] => 15/438457
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/438457 | Semiconductor device | Feb 20, 2017 | Issued |
Array
(
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[patent_issue_date] => 2018-12-18
[patent_title] => Fan-out semiconductor package
[patent_app_type] => utility
[patent_app_number] => 15/437766
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Array
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Array
(
[id] => 11925625
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[patent_title] => 'Heterostructure interconnects for high frequency applications'
[patent_app_type] => utility
[patent_app_number] => 15/438174
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Array
(
[id] => 12436506
[patent_doc_number] => 09978686
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[patent_issue_date] => 2018-05-22
[patent_title] => Interconnection of semiconductor devices in extreme environment microelectronic integrated circuit chips
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[patent_app_number] => 15/438130
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/438130 | Interconnection of semiconductor devices in extreme environment microelectronic integrated circuit chips | Feb 20, 2017 | Issued |
Array
(
[id] => 13271237
[patent_doc_number] => 10147705
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[patent_kind] => B2
[patent_issue_date] => 2018-12-04
[patent_title] => Stacked semiconductor die assemblies with die substrate extensions
[patent_app_type] => utility
[patent_app_number] => 15/438691
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/438691 | Stacked semiconductor die assemblies with die substrate extensions | Feb 20, 2017 | Issued |
Array
(
[id] => 12168376
[patent_doc_number] => 09887148
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[patent_issue_date] => 2018-02-06
[patent_title] => 'Fan-out semiconductor package structure and fabricating method'
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Array
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Array
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Array
(
[id] => 13006033
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[patent_title] => Metal interconnects for super (skip) via integration
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Array
(
[id] => 12019753
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Array
(
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Array
(
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Array
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Array
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Array
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Array
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Array
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