Lynne Ann Gurley
Supervisory Patent Examiner (ID: 16126, Phone: (571)272-1670 , Office: P/2811 )
Most Active Art Unit | 2812 |
Art Unit(s) | 2812, 2899, 2811, 1104, 1763, 2814 |
Total Applications | 970 |
Issued Applications | 787 |
Pending Applications | 29 |
Abandoned Applications | 154 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 14558157
[patent_doc_number] => 10347549
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-07-09
[patent_title] => Power semiconductor device module having mechanical corner press-fit anchors
[patent_app_type] => utility
[patent_app_number] => 15/376662
[patent_app_country] => US
[patent_app_date] => 2016-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 4351
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 161
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15376662
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/376662 | Power semiconductor device module having mechanical corner press-fit anchors | Dec 12, 2016 | Issued |
Array
(
[id] => 14843117
[patent_doc_number] => 20190279959
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2019-09-12
[patent_title] => MICROELECTRONIC DIE STACK HAVING AT LEAST ONE ROTATED MICROELECTRONIC DIE
[patent_app_type] => utility
[patent_app_number] => 16/347261
[patent_app_country] => US
[patent_app_date] => 2016-12-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4958
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -21
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16347261
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/347261 | Microelectronic die stack having at least one rotated microelectronic die | Dec 10, 2016 | Issued |
Array
(
[id] => 11811506
[patent_doc_number] => 09716080
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-07-25
[patent_title] => 'Thin fan-out multi-chip stacked package structure and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 15/361073
[patent_app_country] => US
[patent_app_date] => 2016-11-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 14
[patent_no_of_words] => 5204
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 287
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15361073
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/361073 | Thin fan-out multi-chip stacked package structure and manufacturing method thereof | Nov 24, 2016 | Issued |
Array
(
[id] => 12416883
[patent_doc_number] => 09972576
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2018-05-15
[patent_title] => Semiconductor chip package comprising side wall marking
[patent_app_type] => utility
[patent_app_number] => 15/361034
[patent_app_country] => US
[patent_app_date] => 2016-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 4217
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15361034
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/361034 | Semiconductor chip package comprising side wall marking | Nov 23, 2016 | Issued |
Array
(
[id] => 12759622
[patent_doc_number] => 20180145042
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-05-24
[patent_title] => INDUCTOR INTERCONNECT
[patent_app_type] => utility
[patent_app_number] => 15/359926
[patent_app_country] => US
[patent_app_date] => 2016-11-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5888
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15359926
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/359926 | Inductor interconnect | Nov 22, 2016 | Issued |
Array
(
[id] => 14205197
[patent_doc_number] => 10269720
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-04-23
[patent_title] => Integrated fan-out packaging
[patent_app_type] => utility
[patent_app_number] => 15/360739
[patent_app_country] => US
[patent_app_date] => 2016-11-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 28
[patent_no_of_words] => 8828
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 121
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15360739
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/360739 | Integrated fan-out packaging | Nov 22, 2016 | Issued |
Array
(
[id] => 12953761
[patent_doc_number] => 09837398
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-12-05
[patent_title] => Metal track cutting in standard cell layouts
[patent_app_type] => utility
[patent_app_number] => 15/360168
[patent_app_country] => US
[patent_app_date] => 2016-11-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 3619
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 140
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15360168
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/360168 | Metal track cutting in standard cell layouts | Nov 22, 2016 | Issued |
Array
(
[id] => 12759424
[patent_doc_number] => 20180144976
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-05-24
[patent_title] => POST SPACER SELF-ALIGNED CUTS
[patent_app_type] => utility
[patent_app_number] => 15/360255
[patent_app_country] => US
[patent_app_date] => 2016-11-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3156
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15360255
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/360255 | Post spacer self-aligned cuts | Nov 22, 2016 | Issued |
Array
(
[id] => 11824851
[patent_doc_number] => 20170213788
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-07-27
[patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 15/359611
[patent_app_country] => US
[patent_app_date] => 2016-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 11042
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15359611
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/359611 | Semiconductor device and manufacturing method thereof | Nov 21, 2016 | Issued |
Array
(
[id] => 12759676
[patent_doc_number] => 20180145060
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-05-24
[patent_title] => SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PROCESS
[patent_app_type] => utility
[patent_app_number] => 15/359403
[patent_app_country] => US
[patent_app_date] => 2016-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 20037
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -47
[patent_words_short_claim] => 108
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15359403
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/359403 | Semiconductor package and semiconductor process | Nov 21, 2016 | Issued |
Array
(
[id] => 12759535
[patent_doc_number] => 20180145013
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-05-24
[patent_title] => METHODS OF FORMING LEADLESS SEMICONDUCTOR PACKAGES WITH PLATED LEADFRAMES AND WETTABLE FLANKS
[patent_app_type] => utility
[patent_app_number] => 15/357680
[patent_app_country] => US
[patent_app_date] => 2016-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4726
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15357680
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/357680 | Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks | Nov 20, 2016 | Issued |
Array
(
[id] => 11967113
[patent_doc_number] => 20170271267
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-09-21
[patent_title] => 'SEMICONDUCTOR PACKAGING STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 15/357252
[patent_app_country] => US
[patent_app_date] => 2016-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2237
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15357252
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/357252 | SEMICONDUCTOR PACKAGING STRUCTURE | Nov 20, 2016 | Abandoned |
Array
(
[id] => 11652792
[patent_doc_number] => 20170148694
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-05-25
[patent_title] => 'CHIP PACKAGE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 15/358098
[patent_app_country] => US
[patent_app_date] => 2016-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3479
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15358098
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/358098 | Chip package and manufacturing method thereof | Nov 20, 2016 | Issued |
Array
(
[id] => 11952316
[patent_doc_number] => 20170256467
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-09-07
[patent_title] => 'REMOVABLE SACRIFICIAL CONNECTIONS FOR SEMICONDUCTOR DEVICES'
[patent_app_type] => utility
[patent_app_number] => 15/357465
[patent_app_country] => US
[patent_app_date] => 2016-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3065
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15357465
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/357465 | Removable sacrificial connections for semiconductor devices | Nov 20, 2016 | Issued |
Array
(
[id] => 15260153
[patent_doc_number] => 20190378810
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2019-12-12
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 16/347368
[patent_app_country] => US
[patent_app_date] => 2016-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7527
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -9
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16347368
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/347368 | Semiconductor device | Nov 20, 2016 | Issued |
Array
(
[id] => 11883720
[patent_doc_number] => 09754901
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-09-05
[patent_title] => 'Bulk thinning detector'
[patent_app_type] => utility
[patent_app_number] => 15/356691
[patent_app_country] => US
[patent_app_date] => 2016-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 24
[patent_no_of_words] => 14899
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 165
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15356691
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/356691 | Bulk thinning detector | Nov 20, 2016 | Issued |
Array
(
[id] => 11898238
[patent_doc_number] => 09768179
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-09-19
[patent_title] => 'Connection structures for routing misaligned metal lines between TCAM cells and periphery circuits'
[patent_app_type] => utility
[patent_app_number] => 15/355771
[patent_app_country] => US
[patent_app_date] => 2016-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 25
[patent_no_of_words] => 11664
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15355771
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/355771 | Connection structures for routing misaligned metal lines between TCAM cells and periphery circuits | Nov 17, 2016 | Issued |
Array
(
[id] => 11876393
[patent_doc_number] => 09748175
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-08-29
[patent_title] => 'Conductive structure in semiconductor structure and method for forming the same'
[patent_app_type] => utility
[patent_app_number] => 15/355349
[patent_app_country] => US
[patent_app_date] => 2016-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 4740
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 70
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15355349
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/355349 | Conductive structure in semiconductor structure and method for forming the same | Nov 17, 2016 | Issued |
Array
(
[id] => 12122398
[patent_doc_number] => 20180005985
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-01-04
[patent_title] => 'SEMICONDUCTOR PACKAGING DEVICE WITH HEAT SINK'
[patent_app_type] => utility
[patent_app_number] => 15/356440
[patent_app_country] => US
[patent_app_date] => 2016-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 6311
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15356440
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/356440 | Semiconductor packaging device with heat sink | Nov 17, 2016 | Issued |
Array
(
[id] => 14267811
[patent_doc_number] => 10283477
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-05-07
[patent_title] => Method of fabricating 3-dimensional fan-out structure
[patent_app_type] => utility
[patent_app_number] => 15/355069
[patent_app_country] => US
[patent_app_date] => 2016-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 18
[patent_no_of_words] => 2896
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15355069
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/355069 | Method of fabricating 3-dimensional fan-out structure | Nov 17, 2016 | Issued |