Lynne Ann Gurley
Supervisory Patent Examiner (ID: 16126, Phone: (571)272-1670 , Office: P/2811 )
Most Active Art Unit | 2812 |
Art Unit(s) | 2812, 2899, 2811, 1104, 1763, 2814 |
Total Applications | 970 |
Issued Applications | 787 |
Pending Applications | 29 |
Abandoned Applications | 154 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 11898195
[patent_doc_number] => 09768136
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-09-19
[patent_title] => 'Interconnect structure and method of fabricating same'
[patent_app_type] => utility
[patent_app_number] => 15/180929
[patent_app_country] => US
[patent_app_date] => 2016-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 5781
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15180929
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/180929 | Interconnect structure and method of fabricating same | Jun 12, 2016 | Issued |
Array
(
[id] => 14801099
[patent_doc_number] => 10403559
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-09-03
[patent_title] => Power semiconductor device
[patent_app_type] => utility
[patent_app_number] => 16/078349
[patent_app_country] => US
[patent_app_date] => 2016-05-26
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16078349
[rel_patent_id] =>[rel_patent_doc_number] =>) 16/078349 | Power semiconductor device | May 25, 2016 | Issued |
Array
(
[id] => 11063735
[patent_doc_number] => 20160260697
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-09-08
[patent_title] => 'Stacked Half-Bridge Package'
[patent_app_type] => utility
[patent_app_number] => 15/157298
[patent_app_country] => US
[patent_app_date] => 2016-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4047
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15157298
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/157298 | Stacked half-bridge package | May 16, 2016 | Issued |
Array
(
[id] => 12026892
[patent_doc_number] => 20170316992
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-02
[patent_title] => 'Power Semiconductor Device Module Having Mechanical Corner Press-Fit Anchors'
[patent_app_type] => utility
[patent_app_number] => 15/143575
[patent_app_country] => US
[patent_app_date] => 2016-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4069
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15143575
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/143575 | Power semiconductor device module having mechanical corner press-fit anchors | Apr 29, 2016 | Issued |
Array
(
[id] => 14014283
[patent_doc_number] => 10225635
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-03-05
[patent_title] => Microelectromechanical microphone
[patent_app_type] => utility
[patent_app_number] => 15/143207
[patent_app_country] => US
[patent_app_date] => 2016-04-29
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15143207
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/143207 | Microelectromechanical microphone | Apr 28, 2016 | Issued |
Array
(
[id] => 11432069
[patent_doc_number] => 09570394
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-02-14
[patent_title] => 'Formation of IC structure with pair of unitary metal fins'
[patent_app_type] => utility
[patent_app_number] => 15/140808
[patent_app_country] => US
[patent_app_date] => 2016-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 6419
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15140808
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/140808 | Formation of IC structure with pair of unitary metal fins | Apr 27, 2016 | Issued |
Array
(
[id] => 12089056
[patent_doc_number] => 09842789
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-12-12
[patent_title] => 'Electronic component package and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 15/140775
[patent_app_country] => US
[patent_app_date] => 2016-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15140775
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/140775 | Electronic component package and method of manufacturing the same | Apr 27, 2016 | Issued |
Array
(
[id] => 11645155
[patent_doc_number] => 09666546
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-05-30
[patent_title] => 'Multi-layer metal pads'
[patent_app_type] => utility
[patent_app_number] => 15/141571
[patent_app_country] => US
[patent_app_date] => 2016-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 21
[patent_no_of_words] => 6954
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 114
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15141571
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/141571 | Multi-layer metal pads | Apr 27, 2016 | Issued |
Array
(
[id] => 11125341
[patent_doc_number] => 20160322315
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-11-03
[patent_title] => 'MOISTURE-RESISTANT ELECTRONIC COMPONENT, NOTABLY MICROWAVE, AND METHOD FOR PACKAGING SUCH A COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/141442
[patent_app_country] => US
[patent_app_date] => 2016-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3605
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15141442
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/141442 | Moisture-resistant electronic component, notably microwave, and method for packaging such a component | Apr 27, 2016 | Issued |
Array
(
[id] => 11453531
[patent_doc_number] => 09577185
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-02-21
[patent_title] => 'Fluxgate device with low fluxgate noise'
[patent_app_type] => utility
[patent_app_number] => 15/141003
[patent_app_country] => US
[patent_app_date] => 2016-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 11023
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15141003
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/141003 | Fluxgate device with low fluxgate noise | Apr 27, 2016 | Issued |
Array
(
[id] => 12250165
[patent_doc_number] => 09922947
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2018-03-20
[patent_title] => 'Bonding pad structure over active circuitry'
[patent_app_type] => utility
[patent_app_number] => 15/141621
[patent_app_country] => US
[patent_app_date] => 2016-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 4587
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15141621
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/141621 | Bonding pad structure over active circuitry | Apr 27, 2016 | Issued |
Array
(
[id] => 11578676
[patent_doc_number] => 09633946
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-04-25
[patent_title] => 'Seamless metallization contacts'
[patent_app_type] => utility
[patent_app_number] => 15/140121
[patent_app_country] => US
[patent_app_date] => 2016-04-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15140121
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/140121 | Seamless metallization contacts | Apr 26, 2016 | Issued |
Array
(
[id] => 11125315
[patent_doc_number] => 20160322289
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-11-03
[patent_title] => 'WIRING SUBSTRATE'
[patent_app_type] => utility
[patent_app_number] => 15/138503
[patent_app_country] => US
[patent_app_date] => 2016-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15138503
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/138503 | Wiring substrate | Apr 25, 2016 | Issued |
Array
(
[id] => 11043993
[patent_doc_number] => 20160240949
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-08-18
[patent_title] => 'LOW PROFILE ZERO/LOW INSERTION FORCE PACKAGE TOP SIDE FLEX CABLE CONNECTOR ARCHITECTURE'
[patent_app_type] => utility
[patent_app_number] => 15/135413
[patent_app_country] => US
[patent_app_date] => 2016-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15135413
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/135413 | Low profile zero/low insertion force package top side flex cable connector architecture | Apr 20, 2016 | Issued |
Array
(
[id] => 11028795
[patent_doc_number] => 20160225751
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-08-04
[patent_title] => 'Hollow Metal Pillar Packaging Scheme'
[patent_app_type] => utility
[patent_app_number] => 15/095765
[patent_app_country] => US
[patent_app_date] => 2016-04-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/095765 | Hollow metal pillar packaging scheme | Apr 10, 2016 | Issued |
Array
(
[id] => 11021115
[patent_doc_number] => 20160218070
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-07-28
[patent_title] => 'MULTILAYER STRUCTURE IN AN INTEGRATED CIRCUIT FOR DAMAGE PREVENTION AND DETECTION AND METHODS OF CREATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 15/090996
[patent_app_country] => US
[patent_app_date] => 2016-04-05
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15090996
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/090996 | Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same | Apr 4, 2016 | Issued |
Array
(
[id] => 13099063
[patent_doc_number] => 10068877
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2018-09-04
[patent_title] => Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure
[patent_app_type] => utility
[patent_app_number] => 15/088349
[patent_app_country] => US
[patent_app_date] => 2016-04-01
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/088349 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | Mar 31, 2016 | Issued |
Array
(
[id] => 14955275
[patent_doc_number] => 10438916
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-10-08
[patent_title] => Wire bond connection with intermediate contact structure
[patent_app_type] => utility
[patent_app_number] => 16/078579
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/078579 | Wire bond connection with intermediate contact structure | Mar 31, 2016 | Issued |
Array
(
[id] => 11876424
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[patent_issue_date] => 2017-08-29
[patent_title] => 'Molding type power module'
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[patent_app_number] => 15/081365
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/081365 | Molding type power module | Mar 24, 2016 | Issued |
Array
(
[id] => 11348023
[patent_doc_number] => 09532448
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[patent_kind] => B1
[patent_issue_date] => 2016-12-27
[patent_title] => 'Power electronics modules'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/059465 | Power electronics modules | Mar 2, 2016 | Issued |