Lynne Ann Gurley
Supervisory Patent Examiner (ID: 16126, Phone: (571)272-1670 , Office: P/2811 )
Most Active Art Unit | 2812 |
Art Unit(s) | 2812, 2899, 2811, 1104, 1763, 2814 |
Total Applications | 970 |
Issued Applications | 787 |
Pending Applications | 29 |
Abandoned Applications | 154 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 11265890
[patent_doc_number] => 09490192
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2016-11-08
[patent_title] => 'Semiconductor structure and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 14/984395
[patent_app_country] => US
[patent_app_date] => 2015-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 19
[patent_no_of_words] => 9590
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 38
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14984395
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/984395 | Semiconductor structure and manufacturing method thereof | Dec 29, 2015 | Issued |
Array
(
[id] => 11360176
[patent_doc_number] => 09536832
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-01-03
[patent_title] => 'Junctionless back end of the line via contact'
[patent_app_type] => utility
[patent_app_number] => 14/983643
[patent_app_country] => US
[patent_app_date] => 2015-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 3685
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14983643
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/983643 | Junctionless back end of the line via contact | Dec 29, 2015 | Issued |
Array
(
[id] => 10993164
[patent_doc_number] => 20160190109
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-06-30
[patent_title] => 'STACK SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/983510
[patent_app_country] => US
[patent_app_date] => 2015-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
[patent_figures_cnt] => 24
[patent_no_of_words] => 13222
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14983510
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/983510 | Stack semiconductor package | Dec 28, 2015 | Issued |
Array
(
[id] => 11807189
[patent_doc_number] => 09548272
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-01-17
[patent_title] => 'Semiconductor device, circuit substrate, and electronic device'
[patent_app_type] => utility
[patent_app_number] => 14/981535
[patent_app_country] => US
[patent_app_date] => 2015-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 18
[patent_no_of_words] => 5933
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14981535
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/981535 | Semiconductor device, circuit substrate, and electronic device | Dec 27, 2015 | Issued |
Array
(
[id] => 10765207
[patent_doc_number] => 20160111363
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-04-21
[patent_title] => 'Electrical Connections for Chip Scale Packaging'
[patent_app_type] => utility
[patent_app_number] => 14/981569
[patent_app_country] => US
[patent_app_date] => 2015-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 7213
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14981569
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/981569 | Electrical connections for chip scale packaging | Dec 27, 2015 | Issued |
Array
(
[id] => 11328261
[patent_doc_number] => 20160358873
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-12-08
[patent_title] => 'SUBSTRATE STRUCTURE, FABRICATION METHOD THEREOF AND CONDUCTIVE STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 14/981549
[patent_app_country] => US
[patent_app_date] => 2015-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2105
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14981549
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/981549 | Substrate structure, fabrication method thereof and conductive structure | Dec 27, 2015 | Issued |
Array
(
[id] => 13145839
[patent_doc_number] => 10090259
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2018-10-02
[patent_title] => Non-rectangular electronic device components
[patent_app_type] => utility
[patent_app_number] => 14/757835
[patent_app_country] => US
[patent_app_date] => 2015-12-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 23
[patent_no_of_words] => 7043
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14757835
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/757835 | Non-rectangular electronic device components | Dec 25, 2015 | Issued |
Array
(
[id] => 14063851
[patent_doc_number] => 10236227
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-03-19
[patent_title] => Electronic package and fabrication method thereof
[patent_app_type] => utility
[patent_app_number] => 14/998324
[patent_app_country] => US
[patent_app_date] => 2015-12-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 15
[patent_no_of_words] => 2468
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 169
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14998324
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/998324 | Electronic package and fabrication method thereof | Dec 23, 2015 | Issued |
Array
(
[id] => 10984193
[patent_doc_number] => 20160181138
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-06-23
[patent_title] => 'Method of manufacturing a semiconductor component and semiconductor component'
[patent_app_type] => utility
[patent_app_number] => 14/757589
[patent_app_country] => US
[patent_app_date] => 2015-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3333
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14757589
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/757589 | Method of manufacturing a semiconductor component and semiconductor component | Dec 22, 2015 | Issued |
Array
(
[id] => 10765235
[patent_doc_number] => 20160111391
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-04-21
[patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 14/976491
[patent_app_country] => US
[patent_app_date] => 2015-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 12476
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14976491
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/976491 | Semiconductor device and manufacturing method thereof | Dec 20, 2015 | Issued |
Array
(
[id] => 11510257
[patent_doc_number] => 09601423
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-03-21
[patent_title] => 'Under die surface mounted electrical elements'
[patent_app_type] => utility
[patent_app_number] => 14/974484
[patent_app_country] => US
[patent_app_date] => 2015-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 8
[patent_no_of_words] => 2876
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14974484
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/974484 | Under die surface mounted electrical elements | Dec 17, 2015 | Issued |
Array
(
[id] => 12018420
[patent_doc_number] => 09811122
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-11-07
[patent_title] => 'Package on packages and mobile computing devices having the same'
[patent_app_type] => utility
[patent_app_number] => 14/955281
[patent_app_country] => US
[patent_app_date] => 2015-12-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 8971
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14955281
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/955281 | Package on packages and mobile computing devices having the same | Nov 30, 2015 | Issued |
Array
(
[id] => 10725595
[patent_doc_number] => 20160071743
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-03-10
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE FABRICATION WITH DIE ATTACH PADDLE HAVING MIDDLE CHANNELS'
[patent_app_type] => utility
[patent_app_number] => 14/941865
[patent_app_country] => US
[patent_app_date] => 2015-11-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2107
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14941865
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/941865 | Integrated circuit package fabrication with die attach paddle having middle channels | Nov 15, 2015 | Issued |
Array
(
[id] => 11180668
[patent_doc_number] => 09412663
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2016-08-09
[patent_title] => 'Dies for RFID devices and sensor applications'
[patent_app_type] => utility
[patent_app_number] => 14/935403
[patent_app_country] => US
[patent_app_date] => 2015-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 14
[patent_no_of_words] => 7576
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 162
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14935403
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/935403 | Dies for RFID devices and sensor applications | Nov 6, 2015 | Issued |
Array
(
[id] => 12005435
[patent_doc_number] => 20170309590
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-10-26
[patent_title] => 'ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 15/517781
[patent_app_country] => US
[patent_app_date] => 2015-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 9385
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15517781
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/517781 | Anisotropic conductive film and connection structure | Oct 27, 2015 | Issued |
Array
(
[id] => 12005387
[patent_doc_number] => 20170309542
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-10-26
[patent_title] => 'Heat Conduction Sheet, Heat Conduction Sheet Manufacture Method, Heat Radiation Member, and Semiconductor Device'
[patent_app_type] => utility
[patent_app_number] => 15/521426
[patent_app_country] => US
[patent_app_date] => 2015-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 12152
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15521426
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/521426 | Heat conduction sheet, heat conduction sheet manufacture method, heat radiation member, and semiconductor device | Oct 26, 2015 | Issued |
Array
(
[id] => 10703168
[patent_doc_number] => 20160049315
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-02-18
[patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 14/924113
[patent_app_country] => US
[patent_app_date] => 2015-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
[patent_figures_cnt] => 24
[patent_no_of_words] => 9874
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14924113
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/924113 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Oct 26, 2015 | Abandoned |
Array
(
[id] => 10733046
[patent_doc_number] => 20160079196
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-03-17
[patent_title] => 'HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/922425
[patent_app_country] => US
[patent_app_date] => 2015-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 5170
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14922425
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/922425 | High density substrate routing in BBUL package | Oct 25, 2015 | Issued |
Array
(
[id] => 10689486
[patent_doc_number] => 20160035632
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-02-04
[patent_title] => 'SEMICONDUCTOR TSV DEVICE PACKAGE TO WHICH OTHER SEMICONDUCTOR DEVICE PACKAGE CAN BE LATER ATTACHED'
[patent_app_type] => utility
[patent_app_number] => 14/883360
[patent_app_country] => US
[patent_app_date] => 2015-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2791
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14883360
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/883360 | Semiconductor TSV device package to which other semiconductor device package can be later attached | Oct 13, 2015 | Issued |
Array
(
[id] => 11265920
[patent_doc_number] => 09490222
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2016-11-08
[patent_title] => 'Wire bond wires for interference shielding'
[patent_app_type] => utility
[patent_app_number] => 14/880967
[patent_app_country] => US
[patent_app_date] => 2015-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 23
[patent_no_of_words] => 8655
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14880967
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/880967 | Wire bond wires for interference shielding | Oct 11, 2015 | Issued |