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[patent_title] => 'Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures'
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[patent_app_number] => 14/176526
[patent_app_country] => US
[patent_app_date] => 2014-02-10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/176526 | Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures | Feb 9, 2014 | Issued |