
Mamadou L. Diallo
Examiner (ID: 18306)
| Most Active Art Unit | 2895 |
| Art Unit(s) | 3648, 2897, 2819, 2895, 2811, 4174 |
| Total Applications | 1724 |
| Issued Applications | 1539 |
| Pending Applications | 108 |
| Abandoned Applications | 112 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19582646
[patent_doc_number] => 12148775
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-11-19
[patent_title] => Hyperspectral element, hyperspectral sensor including the same, and hyperspectral image generating apparatus
[patent_app_type] => utility
[patent_app_number] => 17/497420
[patent_app_country] => US
[patent_app_date] => 2021-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 33
[patent_figures_cnt] => 34
[patent_no_of_words] => 16496
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 132
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17497420
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/497420 | Hyperspectral element, hyperspectral sensor including the same, and hyperspectral image generating apparatus | Oct 7, 2021 | Issued |
Array
(
[id] => 18306202
[patent_doc_number] => 20230110102
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-04-13
[patent_title] => SOLID-STATE IMAGE SENSOR
[patent_app_type] => utility
[patent_app_number] => 17/496472
[patent_app_country] => US
[patent_app_date] => 2021-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7571
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17496472
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/496472 | Solid-state image sensor | Oct 6, 2021 | Issued |
Array
(
[id] => 19401229
[patent_doc_number] => 12075641
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-08-27
[patent_title] => Organic electroluminescent device and method for preparing the same
[patent_app_type] => utility
[patent_app_number] => 17/488518
[patent_app_country] => US
[patent_app_date] => 2021-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 12
[patent_no_of_words] => 7025
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17488518
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/488518 | Organic electroluminescent device and method for preparing the same | Sep 28, 2021 | Issued |
Array
(
[id] => 17509198
[patent_doc_number] => 20220102301
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-03-31
[patent_title] => DEVICE FOR CONTROLLING TRAPPED IONS AND METHOD OF MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/488388
[patent_app_country] => US
[patent_app_date] => 2021-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6943
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -13
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17488388
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/488388 | Device for controlling trapped ions and method of manufacturing the same | Sep 28, 2021 | Issued |
Array
(
[id] => 18431645
[patent_doc_number] => 11676875
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-06-13
[patent_title] => Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon
[patent_app_type] => utility
[patent_app_number] => 17/488662
[patent_app_country] => US
[patent_app_date] => 2021-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 7300
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17488662
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/488662 | Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon | Sep 28, 2021 | Issued |
Array
(
[id] => 19244555
[patent_doc_number] => 12015010
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-18
[patent_title] => Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the same
[patent_app_type] => utility
[patent_app_number] => 17/477643
[patent_app_country] => US
[patent_app_date] => 2021-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
[patent_figures_cnt] => 31
[patent_no_of_words] => 11344
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17477643
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/477643 | Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the same | Sep 16, 2021 | Issued |
Array
(
[id] => 17318841
[patent_doc_number] => 20210407891
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-12-30
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 17/473290
[patent_app_country] => US
[patent_app_date] => 2021-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9133
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 161
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17473290
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/473290 | Semiconductor package including a pad pattern | Sep 12, 2021 | Issued |
Array
(
[id] => 18546505
[patent_doc_number] => 11719853
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-08-08
[patent_title] => Underground infrastructure sensing using unmanned aerial vehicle (UAV)
[patent_app_type] => utility
[patent_app_number] => 17/473949
[patent_app_country] => US
[patent_app_date] => 2021-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 4799
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17473949
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/473949 | Underground infrastructure sensing using unmanned aerial vehicle (UAV) | Sep 12, 2021 | Issued |
Array
(
[id] => 17303110
[patent_doc_number] => 20210398949
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-12-23
[patent_title] => MEMORY DEVICE INCLUDING MODULAR MEMORY UNITS AND MODULAR CIRCUIT UNITS FOR CONCURRENT MEMORY OPERATIONS
[patent_app_type] => utility
[patent_app_number] => 17/467011
[patent_app_country] => US
[patent_app_date] => 2021-09-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12068
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -10
[patent_words_short_claim] => 26
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17467011
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/467011 | Memory device including modular memory units and modular circuit units for concurrent memory operations | Sep 2, 2021 | Issued |
Array
(
[id] => 19079522
[patent_doc_number] => 11948900
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-02
[patent_title] => Bonded body, circuit board, and semiconductor device
[patent_app_type] => utility
[patent_app_number] => 17/446765
[patent_app_country] => US
[patent_app_date] => 2021-09-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 11
[patent_no_of_words] => 8931
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17446765
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/446765 | Bonded body, circuit board, and semiconductor device | Sep 1, 2021 | Issued |
Array
(
[id] => 18221361
[patent_doc_number] => 20230060355
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-02
[patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/462330
[patent_app_country] => US
[patent_app_date] => 2021-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8169
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17462330
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/462330 | Semiconductor package structure and method for preparing the same | Aug 30, 2021 | Issued |
Array
(
[id] => 19213705
[patent_doc_number] => 12002777
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-04
[patent_title] => Semiconductor device with bonded substrates
[patent_app_type] => utility
[patent_app_number] => 17/461550
[patent_app_country] => US
[patent_app_date] => 2021-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 18
[patent_no_of_words] => 6916
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17461550
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/461550 | Semiconductor device with bonded substrates | Aug 29, 2021 | Issued |
Array
(
[id] => 20390810
[patent_doc_number] => 12490560
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-02
[patent_title] => Display panel and manufacturing method thereof, and display device
[patent_app_type] => utility
[patent_app_number] => 17/796091
[patent_app_country] => US
[patent_app_date] => 2021-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 22
[patent_no_of_words] => 4600
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 235
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17796091
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/796091 | Display panel and manufacturing method thereof, and display device | Aug 26, 2021 | Issued |
Array
(
[id] => 17277968
[patent_doc_number] => 20210384166
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-12-09
[patent_title] => CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 17/408849
[patent_app_country] => US
[patent_app_date] => 2021-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9382
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17408849
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/408849 | Chip package structure and manufacturing method thereof | Aug 22, 2021 | Issued |
Array
(
[id] => 18935505
[patent_doc_number] => 11887949
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-01-30
[patent_title] => Bond pad layout including floating conductive sections
[patent_app_type] => utility
[patent_app_number] => 17/405812
[patent_app_country] => US
[patent_app_date] => 2021-08-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 7356
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17405812
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/405812 | Bond pad layout including floating conductive sections | Aug 17, 2021 | Issued |
Array
(
[id] => 18207843
[patent_doc_number] => 20230054100
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-02-23
[patent_title] => CHIP AND SEMICONDUCTOR STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 17/403925
[patent_app_country] => US
[patent_app_date] => 2021-08-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3862
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 27
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17403925
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/403925 | Chip having multiple functional units and semiconductor structure using the same | Aug 16, 2021 | Issued |
Array
(
[id] => 18373327
[patent_doc_number] => 11653519
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-05-16
[patent_title] => Display device and electronic apparatus with contact electrode electrically connected to cathode electrode at concave area locations
[patent_app_type] => utility
[patent_app_number] => 17/399787
[patent_app_country] => US
[patent_app_date] => 2021-08-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 18
[patent_no_of_words] => 11206
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 131
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17399787
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/399787 | Display device and electronic apparatus with contact electrode electrically connected to cathode electrode at concave area locations | Aug 10, 2021 | Issued |
Array
(
[id] => 18144363
[patent_doc_number] => 20230018214
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-01-19
[patent_title] => Semiconductor bonding structure
[patent_app_type] => utility
[patent_app_number] => 17/398017
[patent_app_country] => US
[patent_app_date] => 2021-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3767
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -11
[patent_words_short_claim] => 132
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17398017
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/398017 | Semiconductor bonding structure | Aug 9, 2021 | Issued |
Array
(
[id] => 18277070
[patent_doc_number] => 11616018
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-03-28
[patent_title] => Semiconductor devices including a thick metal layer
[patent_app_type] => utility
[patent_app_number] => 17/398043
[patent_app_country] => US
[patent_app_date] => 2021-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 21
[patent_no_of_words] => 10224
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 301
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17398043
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/398043 | Semiconductor devices including a thick metal layer | Aug 9, 2021 | Issued |
Array
(
[id] => 17247170
[patent_doc_number] => 20210366915
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-11-25
[patent_title] => 4CPP SRAM CELL AND ARRAY
[patent_app_type] => utility
[patent_app_number] => 17/397371
[patent_app_country] => US
[patent_app_date] => 2021-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8994
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17397371
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/397371 | 4CPP SRAM cell and array | Aug 8, 2021 | Issued |