Mamadou L. Diallo

Array ( [id] => 17063174 [patent_doc_number] => 11107784 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-08-31 [patent_title] => Semiconductor device having circuit board to which contact part is bonded [patent_app_type] => utility [patent_app_number] => 16/800764 [patent_app_country] => US [patent_app_date] => 2020-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 6603 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16800764 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16835224 [patent_doc_number] => 11011484 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-05-18 [patent_title] => Semiconductor device having first and second terminals [patent_app_type] => utility [patent_app_number] => 16/799024 [patent_app_country] => US [patent_app_date] => 2020-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 17 [patent_no_of_words] => 7263 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16799024 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16624938 [patent_doc_number] => 20210043591 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-02-11 [patent_title] => SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP [patent_app_type] => utility [patent_app_number] => 16/795658 [patent_app_country] => US [patent_app_date] => 2020-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8709 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16795658 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16586142 [patent_doc_number] => 20210020544 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-01-21 [patent_title] => SEMICONDUCTOR DEVICE INCLUDING THROUGH SUBSTRATE VIAS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 16/795686 [patent_app_country] => US [patent_app_date] => 2020-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13448 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16795686 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16819995 [patent_doc_number] => 11004833 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-05-11 [patent_title] => Multi-chip stacked devices [patent_app_type] => utility [patent_app_number] => 16/792560 [patent_app_country] => US [patent_app_date] => 2020-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 12413 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16792560 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16256805 [patent_doc_number] => 20200266180 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-08-20 [patent_title] => INTEGRATED DISPLAY DEVICES [patent_app_type] => utility [patent_app_number] => 16/787542 [patent_app_country] => US [patent_app_date] => 2020-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11059 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -31 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16787542 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17152475 [patent_doc_number] => 11145566 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-12 [patent_title] => Stacked silicon package assembly having thermal management [patent_app_type] => utility [patent_app_number] => 16/786447 [patent_app_country] => US [patent_app_date] => 2020-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 12782 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16786447 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17025549 [patent_doc_number] => 20210249421 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-12 [patent_title] => MEMORY DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 16/786099 [patent_app_country] => US [patent_app_date] => 2020-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8209 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16786099 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16210496 [patent_doc_number] => 20200243486 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-07-30 [patent_title] => DEVICE WITH EMBEDDED HIGH-BANDWIDTH, HIGH-CAPACITY MEMORY USING WAFER BONDING [patent_app_type] => utility [patent_app_number] => 16/776279 [patent_app_country] => US [patent_app_date] => 2020-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12039 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -67 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16776279 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16995460 [patent_doc_number] => 20210233880 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-07-29 [patent_title] => SEMICONDUCTOR DEVICES INCLUDING ARRAY POWER PADS, AND ASSOCIATED SEMICONDUCTOR DEVICE PACKAGES AND SYSTEMS [patent_app_type] => utility [patent_app_number] => 16/774911 [patent_app_country] => US [patent_app_date] => 2020-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7572 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16774911 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16226314 [patent_doc_number] => 20200251431 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-08-06 [patent_title] => METHOD OF PRODUCING A SUBSTRATE AND SYSTEM FOR PRODUCING A SUBSTRATE [patent_app_type] => utility [patent_app_number] => 16/751937 [patent_app_country] => US [patent_app_date] => 2020-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15646 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16751937 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17122077 [patent_doc_number] => 11133218 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-09-28 [patent_title] => Semiconductor apparatus having through silicon via structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 16/750909 [patent_app_country] => US [patent_app_date] => 2020-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 23 [patent_no_of_words] => 7037 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16750909 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 15906413 [patent_doc_number] => 20200152727 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-05-14 [patent_title] => DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 16/745638 [patent_app_country] => US [patent_app_date] => 2020-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7756 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16745638 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 15906413 [patent_doc_number] => 20200152727 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-05-14 [patent_title] => DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 16/745638 [patent_app_country] => US [patent_app_date] => 2020-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7756 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16745638 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 15906413 [patent_doc_number] => 20200152727 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-05-14 [patent_title] => DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 16/745638 [patent_app_country] => US [patent_app_date] => 2020-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7756 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16745638 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 15906413 [patent_doc_number] => 20200152727 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-05-14 [patent_title] => DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 16/745638 [patent_app_country] => US [patent_app_date] => 2020-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7756 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16745638 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19980253 [patent_doc_number] => 12347741 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-01 [patent_title] => Semiconductor device comprising a resin member having a rib including a lower end located below lower ends of a plurality of pin fins and semiconductor device manufacturing method [patent_app_type] => utility [patent_app_number] => 17/755916 [patent_app_country] => US [patent_app_date] => 2020-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 0 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17755916 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16873572 [patent_doc_number] => 20210167039 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-03 [patent_title] => CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 16/736741 [patent_app_country] => US [patent_app_date] => 2020-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9403 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16736741 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16493698 [patent_doc_number] => 10859732 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2020-12-08 [patent_title] => Long-range temperature forecasting [patent_app_type] => utility [patent_app_number] => 16/736060 [patent_app_country] => US [patent_app_date] => 2020-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 19341 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16736060 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17181302 [patent_doc_number] => 11158551 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-26 [patent_title] => Modular WLCSP die daisy chain design for multiple die sizes [patent_app_type] => utility [patent_app_number] => 16/736077 [patent_app_country] => US [patent_app_date] => 2020-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 2424 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16736077 [rel_patent_id] =>[rel_patent_doc_number] =>)