
Mamadou L. Diallo
Examiner (ID: 18306)
| Most Active Art Unit | 2895 |
| Art Unit(s) | 3648, 2897, 2819, 2895, 2811, 4174 |
| Total Applications | 1724 |
| Issued Applications | 1539 |
| Pending Applications | 108 |
| Abandoned Applications | 112 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19321533
[patent_doc_number] => 20240243080
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-07-18
[patent_title] => CAP LAYER FOR PAD OXIDATION PREVENTION
[patent_app_type] => utility
[patent_app_number] => 18/307165
[patent_app_country] => US
[patent_app_date] => 2023-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9685
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18307165
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/307165 | CAP LAYER FOR PAD OXIDATION PREVENTION | Apr 25, 2023 | Pending |
Array
(
[id] => 19321533
[patent_doc_number] => 20240243080
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-07-18
[patent_title] => CAP LAYER FOR PAD OXIDATION PREVENTION
[patent_app_type] => utility
[patent_app_number] => 18/307165
[patent_app_country] => US
[patent_app_date] => 2023-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9685
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18307165
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/307165 | CAP LAYER FOR PAD OXIDATION PREVENTION | Apr 25, 2023 | Pending |
Array
(
[id] => 19376706
[patent_doc_number] => 12068286
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-08-20
[patent_title] => Device with embedded high-bandwidth, high-capacity memory using wafer bonding
[patent_app_type] => utility
[patent_app_number] => 18/138270
[patent_app_country] => US
[patent_app_date] => 2023-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 28
[patent_no_of_words] => 12079
[patent_no_of_claims] => 37
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18138270
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/138270 | Device with embedded high-bandwidth, high-capacity memory using wafer bonding | Apr 23, 2023 | Issued |
Array
(
[id] => 19161209
[patent_doc_number] => 20240153916
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-09
[patent_title] => SEMICONDUCTOR DEVICE INCLUDING MOLDED DIE STACK AND METHODS OF FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/304591
[patent_app_country] => US
[patent_app_date] => 2023-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 16419
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 60
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18304591
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/304591 | SEMICONDUCTOR DEVICE INCLUDING MOLDED DIE STACK AND METHODS OF FORMING THE SAME | Apr 20, 2023 | Pending |
Array
(
[id] => 19110214
[patent_doc_number] => 11963347
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-16
[patent_title] => One-time programmable memory device including anti-fuse element
[patent_app_type] => utility
[patent_app_number] => 18/304834
[patent_app_country] => US
[patent_app_date] => 2023-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 38
[patent_figures_cnt] => 46
[patent_no_of_words] => 8254
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18304834
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/304834 | One-time programmable memory device including anti-fuse element | Apr 20, 2023 | Issued |
Array
(
[id] => 18821415
[patent_doc_number] => 20230395756
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-07
[patent_title] => INTERCONNECT STRUCTURES FOR IMPROVED LIGHT-EMITTING DIODE CHIP PERFORMANCE
[patent_app_type] => utility
[patent_app_number] => 18/302106
[patent_app_country] => US
[patent_app_date] => 2023-04-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9675
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -23
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18302106
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/302106 | INTERCONNECT STRUCTURES FOR IMPROVED LIGHT-EMITTING DIODE CHIP PERFORMANCE | Apr 17, 2023 | Pending |
Array
(
[id] => 19161208
[patent_doc_number] => 20240153915
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-09
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/297012
[patent_app_country] => US
[patent_app_date] => 2023-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9739
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18297012
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/297012 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Apr 6, 2023 | Pending |
Array
(
[id] => 18835339
[patent_doc_number] => 20230403866
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-14
[patent_title] => SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/297266
[patent_app_country] => US
[patent_app_date] => 2023-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12610
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18297266
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/297266 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Apr 6, 2023 | Pending |
Array
(
[id] => 19161208
[patent_doc_number] => 20240153915
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-09
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/297012
[patent_app_country] => US
[patent_app_date] => 2023-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9739
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18297012
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/297012 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Apr 6, 2023 | Pending |
Array
(
[id] => 19161208
[patent_doc_number] => 20240153915
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-09
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/297012
[patent_app_country] => US
[patent_app_date] => 2023-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9739
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18297012
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/297012 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Apr 6, 2023 | Pending |
Array
(
[id] => 19484189
[patent_doc_number] => 20240332231
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-10-03
[patent_title] => DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES
[patent_app_type] => utility
[patent_app_number] => 18/194591
[patent_app_country] => US
[patent_app_date] => 2023-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12239
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18194591
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/194591 | DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES | Mar 30, 2023 | Pending |
Array
(
[id] => 19356916
[patent_doc_number] => 12057373
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-08-06
[patent_title] => Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same
[patent_app_type] => utility
[patent_app_number] => 18/126893
[patent_app_country] => US
[patent_app_date] => 2023-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 31
[patent_no_of_words] => 11776
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18126893
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/126893 | Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same | Mar 26, 2023 | Issued |
Array
(
[id] => 18714798
[patent_doc_number] => 20230337443
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-10-19
[patent_title] => SRAM DEVICE AND 3D SEMICONDUCTOR INTEGRATED CIRCUIT THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/126761
[patent_app_country] => US
[patent_app_date] => 2023-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11074
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18126761
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/126761 | SRAM device and 3D semiconductor integrated circuit thereof | Mar 26, 2023 | Issued |
Array
(
[id] => 18500585
[patent_doc_number] => 20230223380
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-07-13
[patent_title] => BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/124771
[patent_app_country] => US
[patent_app_date] => 2023-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12274
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 179
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18124771
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/124771 | Bonded wafer device structure and methods for making the same | Mar 21, 2023 | Issued |
Array
(
[id] => 18882987
[patent_doc_number] => 20240006356
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-04
[patent_title] => SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD
[patent_app_type] => utility
[patent_app_number] => 18/181731
[patent_app_country] => US
[patent_app_date] => 2023-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10516
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 154
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18181731
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/181731 | SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD | Mar 9, 2023 | Pending |
Array
(
[id] => 18456626
[patent_doc_number] => 20230197908
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-22
[patent_title] => DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
[patent_app_type] => utility
[patent_app_number] => 18/112810
[patent_app_country] => US
[patent_app_date] => 2023-02-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6845
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -14
[patent_words_short_claim] => 125
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18112810
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/112810 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | Feb 21, 2023 | Pending |
Array
(
[id] => 18456626
[patent_doc_number] => 20230197908
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-22
[patent_title] => DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
[patent_app_type] => utility
[patent_app_number] => 18/112810
[patent_app_country] => US
[patent_app_date] => 2023-02-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6845
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -14
[patent_words_short_claim] => 125
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18112810
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/112810 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | Feb 21, 2023 | Pending |
Array
(
[id] => 18617724
[patent_doc_number] => 20230284465
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-07
[patent_title] => SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS
[patent_app_type] => utility
[patent_app_number] => 18/111287
[patent_app_country] => US
[patent_app_date] => 2023-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8455
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 183
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18111287
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/111287 | SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS | Feb 16, 2023 | Pending |
Array
(
[id] => 19063192
[patent_doc_number] => 11942444
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-03-26
[patent_title] => Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods
[patent_app_type] => utility
[patent_app_number] => 18/108935
[patent_app_country] => US
[patent_app_date] => 2023-02-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 25
[patent_no_of_words] => 10425
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18108935
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/108935 | Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods | Feb 12, 2023 | Issued |
Array
(
[id] => 18782216
[patent_doc_number] => 11823982
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-11-21
[patent_title] => Semiconductor chip including through electrode, and semiconductor package including the same
[patent_app_type] => utility
[patent_app_number] => 18/103346
[patent_app_country] => US
[patent_app_date] => 2023-01-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 17
[patent_no_of_words] => 8608
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18103346
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/103346 | Semiconductor chip including through electrode, and semiconductor package including the same | Jan 29, 2023 | Issued |