
Marcos D. Pizarro Crespo
Examiner (ID: 8349, Phone: (571)272-1716 , Office: P/2814 )
| Most Active Art Unit | 2814 |
| Art Unit(s) | 2814 |
| Total Applications | 1073 |
| Issued Applications | 704 |
| Pending Applications | 106 |
| Abandoned Applications | 293 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7590944
[patent_doc_number] => 07663223
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-02-16
[patent_title] => 'Coupling substrate for semiconductor components and method for producing the same'
[patent_app_type] => utility
[patent_app_number] => 11/522518
[patent_app_country] => US
[patent_app_date] => 2006-09-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 15
[patent_no_of_words] => 5484
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/663/07663223.pdf
[firstpage_image] =>[orig_patent_app_number] => 11522518
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/522518 | Coupling substrate for semiconductor components and method for producing the same | Sep 17, 2006 | Issued |
Array
(
[id] => 4992323
[patent_doc_number] => 20070007667
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-01-11
[patent_title] => 'Electronic package having a sealing structure on predetermined area, and the method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/521369
[patent_app_country] => US
[patent_app_date] => 2006-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 6505
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0007/20070007667.pdf
[firstpage_image] =>[orig_patent_app_number] => 11521369
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/521369 | Flip-chip packaging of a photo-sensor die on a transparent substrate | Sep 14, 2006 | Issued |
Array
(
[id] => 4919356
[patent_doc_number] => 20080067668
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-20
[patent_title] => 'Microelectronic package, method of manufacturing same, and system containing same'
[patent_app_type] => utility
[patent_app_number] => 11/521729
[patent_app_country] => US
[patent_app_date] => 2006-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4243
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0067/20080067668.pdf
[firstpage_image] =>[orig_patent_app_number] => 11521729
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/521729 | Microelectronic package, method of manufacturing same, and system containing same | Sep 14, 2006 | Abandoned |
Array
(
[id] => 4985977
[patent_doc_number] => 20070152315
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-05
[patent_title] => 'Multi-die package and method for fabricating same'
[patent_app_type] => utility
[patent_app_number] => 11/521038
[patent_app_country] => US
[patent_app_date] => 2006-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2391
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0152/20070152315.pdf
[firstpage_image] =>[orig_patent_app_number] => 11521038
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/521038 | Multi-die package and method for fabricating same | Sep 13, 2006 | Abandoned |
Array
(
[id] => 4586681
[patent_doc_number] => 07851840
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-12-14
[patent_title] => 'Devices and circuits based on magnetic tunnel junctions utilizing a multilayer barrier'
[patent_app_type] => utility
[patent_app_number] => 11/520868
[patent_app_country] => US
[patent_app_date] => 2006-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 17
[patent_no_of_words] => 7551
[patent_no_of_claims] => 44
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 79
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/851/07851840.pdf
[firstpage_image] =>[orig_patent_app_number] => 11520868
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/520868 | Devices and circuits based on magnetic tunnel junctions utilizing a multilayer barrier | Sep 12, 2006 | Issued |
Array
(
[id] => 5599527
[patent_doc_number] => 20060289872
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-28
[patent_title] => 'Wiring substrate, electronic device, electro-optical device, and electronic apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/512119
[patent_app_country] => US
[patent_app_date] => 2006-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 13968
[patent_no_of_claims] => 26
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0289/20060289872.pdf
[firstpage_image] =>[orig_patent_app_number] => 11512119
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/512119 | Wiring substrate, electronic device, electro-optical device, and electronic apparatus | Aug 29, 2006 | Issued |
Array
(
[id] => 887810
[patent_doc_number] => 07348209
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-25
[patent_title] => 'Resistance variable memory device and method of fabrication'
[patent_app_type] => utility
[patent_app_number] => 11/511312
[patent_app_country] => US
[patent_app_date] => 2006-08-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 19
[patent_no_of_words] => 6101
[patent_no_of_claims] => 47
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 65
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/348/07348209.pdf
[firstpage_image] =>[orig_patent_app_number] => 11511312
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/511312 | Resistance variable memory device and method of fabrication | Aug 28, 2006 | Issued |
Array
(
[id] => 5000624
[patent_doc_number] => 20070043258
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-22
[patent_title] => 'Data download to imager chip using image sensor as a receptor'
[patent_app_type] => utility
[patent_app_number] => 11/510575
[patent_app_country] => US
[patent_app_date] => 2006-08-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 4644
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0043/20070043258.pdf
[firstpage_image] =>[orig_patent_app_number] => 11510575
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/510575 | Data download to imager chip using image sensor as a receptor | Aug 27, 2006 | Abandoned |
Array
(
[id] => 4997600
[patent_doc_number] => 20070040234
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-22
[patent_title] => 'Data download to imager chip using image sensor as a receptor'
[patent_app_type] => utility
[patent_app_number] => 11/510599
[patent_app_country] => US
[patent_app_date] => 2006-08-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_words] => 4644
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0040/20070040234.pdf
[firstpage_image] =>[orig_patent_app_number] => 11510599
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/510599 | Data download to imager chip using image sensor as a receptor | Aug 27, 2006 | Issued |
Array
(
[id] => 5073009
[patent_doc_number] => 20070012984
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-01-18
[patent_title] => 'Semiconductor device incorporating an electrical contact to an internal conductive layer and method for making the same'
[patent_app_type] => utility
[patent_app_number] => 11/510113
[patent_app_country] => US
[patent_app_date] => 2006-08-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 9481
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 6
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0012/20070012984.pdf
[firstpage_image] =>[orig_patent_app_number] => 11510113
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/510113 | Semiconductor device incorporating an electrical contact to an internal conductive layer and method for making the same | Aug 24, 2006 | Abandoned |
Array
(
[id] => 4999923
[patent_doc_number] => 20070042557
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-22
[patent_title] => 'Data download to imager chip using image sensor as a receptor'
[patent_app_type] => utility
[patent_app_number] => 11/509053
[patent_app_country] => US
[patent_app_date] => 2006-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0042/20070042557.pdf
[firstpage_image] =>[orig_patent_app_number] => 11509053
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/509053 | Data download to imager chip using image sensor as a receptor | Aug 23, 2006 | Abandoned |
Array
(
[id] => 4997598
[patent_doc_number] => 20070040232
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-22
[patent_title] => 'Data download to imager chip using image sensor as a receptor'
[patent_app_type] => utility
[patent_app_number] => 11/509051
[patent_app_country] => US
[patent_app_date] => 2006-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[pdf_file] => publications/A1/0040/20070040232.pdf
[firstpage_image] =>[orig_patent_app_number] => 11509051
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/509051 | Data download to imager chip using image sensor as a receptor | Aug 23, 2006 | Abandoned |
Array
(
[id] => 151622
[patent_doc_number] => 07678611
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-16
[patent_title] => 'Spacer die structure and method for attaching'
[patent_app_type] => utility
[patent_app_number] => 11/464631
[patent_app_country] => US
[patent_app_date] => 2006-08-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3548
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/678/07678611.pdf
[firstpage_image] =>[orig_patent_app_number] => 11464631
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/464631 | Spacer die structure and method for attaching | Aug 14, 2006 | Issued |
Array
(
[id] => 5217478
[patent_doc_number] => 20070158789
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Material comprising predetermined number of atomic layers and method for manufacturing predetermined number of atomic layers'
[patent_app_type] => utility
[patent_app_number] => 11/496059
[patent_app_country] => US
[patent_app_date] => 2006-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 6377
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0158/20070158789.pdf
[firstpage_image] =>[orig_patent_app_number] => 11496059
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/496059 | Material comprising predetermined number of atomic layers and method for manufacturing predetermined number of atomic layers | Jul 27, 2006 | Abandoned |
Array
(
[id] => 5730308
[patent_doc_number] => 20060255422
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-16
[patent_title] => 'Systems and methods for biasing high fill-factor sensor arrays and the like'
[patent_app_type] => utility
[patent_app_number] => 11/491998
[patent_app_country] => US
[patent_app_date] => 2006-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0255/20060255422.pdf
[firstpage_image] =>[orig_patent_app_number] => 11491998
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/491998 | Systems and methods for biasing high fill-factor sensor arrays and the like | Jul 24, 2006 | Abandoned |
Array
(
[id] => 876088
[patent_doc_number] => 07358139
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-04-15
[patent_title] => 'Method of forming a field effect transistor including depositing and removing insulative material effective to expose transistor gate conductive material but not transistor gate semiconductor material'
[patent_app_type] => utility
[patent_app_number] => 11/490712
[patent_app_country] => US
[patent_app_date] => 2006-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/358/07358139.pdf
[firstpage_image] =>[orig_patent_app_number] => 11490712
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/490712 | Method of forming a field effect transistor including depositing and removing insulative material effective to expose transistor gate conductive material but not transistor gate semiconductor material | Jul 19, 2006 | Issued |
Array
(
[id] => 574213
[patent_doc_number] => 07462924
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-12-09
[patent_title] => 'Electrical connector with elongated ground contacts'
[patent_app_type] => utility
[patent_app_number] => 11/477068
[patent_app_country] => US
[patent_app_date] => 2006-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => patents/07/462/07462924.pdf
[firstpage_image] =>[orig_patent_app_number] => 11477068
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/477068 | Electrical connector with elongated ground contacts | Jun 26, 2006 | Issued |
Array
(
[id] => 5916675
[patent_doc_number] => 20060237832
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[patent_kind] => A1
[patent_issue_date] => 2006-10-26
[patent_title] => 'Standoffs for centralizing internals in packaging process'
[patent_app_type] => utility
[patent_app_number] => 11/473469
[patent_app_country] => US
[patent_app_date] => 2006-06-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0237/20060237832.pdf
[firstpage_image] =>[orig_patent_app_number] => 11473469
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/473469 | Standoffs for centralizing internals in packaging process | Jun 22, 2006 | Abandoned |
Array
(
[id] => 318591
[patent_doc_number] => 07521300
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[patent_kind] => B2
[patent_issue_date] => 2009-04-21
[patent_title] => 'Semiconductor device substrate including a single-crystalline layer and method of manufacturing semiconductor device substrate'
[patent_app_type] => utility
[patent_app_number] => 11/455735
[patent_app_country] => US
[patent_app_date] => 2006-06-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/07/521/07521300.pdf
[firstpage_image] =>[orig_patent_app_number] => 11455735
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/455735 | Semiconductor device substrate including a single-crystalline layer and method of manufacturing semiconductor device substrate | Jun 19, 2006 | Issued |
Array
(
[id] => 5859023
[patent_doc_number] => 20060228833
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-12
[patent_title] => 'Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein'
[patent_app_type] => utility
[patent_app_number] => 11/447929
[patent_app_country] => US
[patent_app_date] => 2006-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0228/20060228833.pdf
[firstpage_image] =>[orig_patent_app_number] => 11447929
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/447929 | Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein | Jun 6, 2006 | Abandoned |