Marcus E. Windrich

Array ( [id] => 18623850 [patent_doc_number] => 11756906 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-12 [patent_title] => Electronic module and method of manufacturing electronic module [patent_app_type] => utility [patent_app_number] => 17/395578 [patent_app_country] => US [patent_app_date] => 2021-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 22 [patent_no_of_words] => 15633 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 262 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17395578 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18913042 [patent_doc_number] => 11876029 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-16 [patent_title] => Method of manufacturing electronic component module, and electronic component module [patent_app_type] => utility [patent_app_number] => 17/395574 [patent_app_country] => US [patent_app_date] => 2021-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 12357 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17395574 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19195842 [patent_doc_number] => 11993066 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-28 [patent_title] => Chuck, lamination process, and manufacturing method of semiconductor package using the same [patent_app_type] => utility [patent_app_number] => 17/395440 [patent_app_country] => US [patent_app_date] => 2021-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 32 [patent_no_of_words] => 8010 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17395440 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17217980 [patent_doc_number] => 20210351318 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-11-11 [patent_title] => SUPPORTS FOR A SEMICONDUCTOR STRUCTURE AND ASSOCIATED WAFERS FOR AN OPTOELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/385138 [patent_app_country] => US [patent_app_date] => 2021-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4538 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17385138 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18563031 [patent_doc_number] => 11728284 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-15 [patent_title] => Chip package structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 17/377583 [patent_app_country] => US [patent_app_date] => 2021-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 33 [patent_no_of_words] => 8359 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17377583 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18548284 [patent_doc_number] => 11721644 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-08 [patent_title] => Semiconductor package with riveting structure between two rings and method for forming the same [patent_app_type] => utility [patent_app_number] => 17/372694 [patent_app_country] => US [patent_app_date] => 2021-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 34 [patent_no_of_words] => 9461 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17372694 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19199123 [patent_doc_number] => 11996372 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-28 [patent_title] => Semiconductor device and method of manufacture [patent_app_type] => utility [patent_app_number] => 17/372677 [patent_app_country] => US [patent_app_date] => 2021-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 20 [patent_no_of_words] => 12924 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17372677 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18623746 [patent_doc_number] => 11756801 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-12 [patent_title] => Stencil structure and method of fabricating package [patent_app_type] => utility [patent_app_number] => 17/371020 [patent_app_country] => US [patent_app_date] => 2021-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 32 [patent_no_of_words] => 8655 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17371020 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17599446 [patent_doc_number] => 20220149020 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-12 [patent_title] => PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/367867 [patent_app_country] => US [patent_app_date] => 2021-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5924 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17367867 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18549864 [patent_doc_number] => 11723237 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-08 [patent_title] => Organic light-emitting display device and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/365940 [patent_app_country] => US [patent_app_date] => 2021-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 28 [patent_no_of_words] => 9485 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17365940 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18721540 [patent_doc_number] => 11798897 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-24 [patent_title] => Package structure and methods of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/363030 [patent_app_country] => US [patent_app_date] => 2021-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 45 [patent_figures_cnt] => 51 [patent_no_of_words] => 24616 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 232 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17363030 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17551613 [patent_doc_number] => 20220122955 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-21 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/357378 [patent_app_country] => US [patent_app_date] => 2021-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5413 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17357378 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18874722 [patent_doc_number] => 11862545 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-02 [patent_title] => Integrated substrate structure, electronic assembly, and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/356534 [patent_app_country] => US [patent_app_date] => 2021-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 22 [patent_no_of_words] => 7830 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 248 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17356534 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18097403 [patent_doc_number] => 20220415744 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => Thermally Enhanced FCBGA Package [patent_app_type] => utility [patent_app_number] => 17/304659 [patent_app_country] => US [patent_app_date] => 2021-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4307 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17304659 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18097463 [patent_doc_number] => 20220415804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => INTEGRATED CHIP WITH INTER-WIRE CAVITIES [patent_app_type] => utility [patent_app_number] => 17/355613 [patent_app_country] => US [patent_app_date] => 2021-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11785 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17355613 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19386958 [patent_doc_number] => 20240276828 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-15 [patent_title] => DISPLAY PANEL, DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY PANEL [patent_app_type] => utility [patent_app_number] => 18/568357 [patent_app_country] => US [patent_app_date] => 2021-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7557 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18568357 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18857409 [patent_doc_number] => 11855004 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Package structure [patent_app_type] => utility [patent_app_number] => 17/350351 [patent_app_country] => US [patent_app_date] => 2021-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 24 [patent_no_of_words] => 8562 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17350351 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18548283 [patent_doc_number] => 11721643 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-08 [patent_title] => Package structure [patent_app_type] => utility [patent_app_number] => 17/350317 [patent_app_country] => US [patent_app_date] => 2021-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 24 [patent_no_of_words] => 9476 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17350317 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17389409 [patent_doc_number] => 20220037261 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-03 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/349174 [patent_app_country] => US [patent_app_date] => 2021-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9074 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17349174 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18507585 [patent_doc_number] => 11705412 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-18 [patent_title] => Device package [patent_app_type] => utility [patent_app_number] => 17/347220 [patent_app_country] => US [patent_app_date] => 2021-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 7552 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17347220 [rel_patent_id] =>[rel_patent_doc_number] =>)