Search

Marcus E. Windrich

Examiner (ID: 900, Phone: (571)272-6417 , Office: P/3646 )

Most Active Art Unit
3646
Art Unit(s)
3646, 3619
Total Applications
906
Issued Applications
670
Pending Applications
85
Abandoned Applications
168

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19460162 [patent_doc_number] => 12100669 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-24 [patent_title] => Multi-component modules (MCMs) including configurable electromagnetic isolation (EMI) shield structures and related methods [patent_app_type] => utility [patent_app_number] => 18/356839 [patent_app_country] => US [patent_app_date] => 2023-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 60 [patent_no_of_words] => 12249 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18356839 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/356839
Multi-component modules (MCMs) including configurable electromagnetic isolation (EMI) shield structures and related methods Jul 20, 2023 Issued
Array ( [id] => 18975242 [patent_doc_number] => 20240055334 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE [patent_app_type] => utility [patent_app_number] => 18/354863 [patent_app_country] => US [patent_app_date] => 2023-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9110 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18354863 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/354863
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE Jul 18, 2023 Pending
Array ( [id] => 18991140 [patent_doc_number] => 20240063109 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => FLIP CHIP SEMICONDUCTOR PACKAGES [patent_app_type] => utility [patent_app_number] => 18/354777 [patent_app_country] => US [patent_app_date] => 2023-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11057 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18354777 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/354777
FLIP CHIP SEMICONDUCTOR PACKAGES Jul 18, 2023 Pending
Array ( [id] => 19507882 [patent_doc_number] => 12119312 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-15 [patent_title] => Device package [patent_app_type] => utility [patent_app_number] => 18/223525 [patent_app_country] => US [patent_app_date] => 2023-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 7571 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18223525 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/223525
Device package Jul 17, 2023 Issued
Array ( [id] => 19696430 [patent_doc_number] => 20250014975 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-09 [patent_title] => ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES [patent_app_type] => utility [patent_app_number] => 18/348167 [patent_app_country] => US [patent_app_date] => 2023-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8082 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18348167 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/348167
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES Jul 5, 2023 Pending
Array ( [id] => 18927145 [patent_doc_number] => 20240030149 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-25 [patent_title] => WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE [patent_app_type] => utility [patent_app_number] => 18/347167 [patent_app_country] => US [patent_app_date] => 2023-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13371 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18347167 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/347167
WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE Jul 4, 2023 Pending
Array ( [id] => 19468089 [patent_doc_number] => 20240321759 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-26 [patent_title] => PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBSTRATE PORTION, AND METHODS OF FORMING THE PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/344900 [patent_app_country] => US [patent_app_date] => 2023-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16603 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18344900 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/344900
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBSTRATE PORTION, AND METHODS OF FORMING THE PACKAGE STRUCTURE Jun 29, 2023 Pending
Array ( [id] => 19688099 [patent_doc_number] => 20250006644 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-02 [patent_title] => SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/343757 [patent_app_country] => US [patent_app_date] => 2023-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10174 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18343757 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/343757
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Jun 28, 2023 Pending
Array ( [id] => 19494309 [patent_doc_number] => 12113033 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-08 [patent_title] => Chip package structure [patent_app_type] => utility [patent_app_number] => 18/344039 [patent_app_country] => US [patent_app_date] => 2023-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 33 [patent_no_of_words] => 8441 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18344039 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/344039
Chip package structure Jun 28, 2023 Issued
Array ( [id] => 19662076 [patent_doc_number] => 20240429141 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-26 [patent_title] => PACKAGE COMPRISING SIDEWALL INTERCONNECTS CONFIGURED FOR POWER ROUTING [patent_app_type] => utility [patent_app_number] => 18/340556 [patent_app_country] => US [patent_app_date] => 2023-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14094 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18340556 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/340556
PACKAGE COMPRISING SIDEWALL INTERCONNECTS CONFIGURED FOR POWER ROUTING Jun 22, 2023 Pending
Array ( [id] => 18729428 [patent_doc_number] => 20230343724 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-26 [patent_title] => PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/336258 [patent_app_country] => US [patent_app_date] => 2023-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9561 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18336258 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/336258
Package structure Jun 15, 2023 Issued
Array ( [id] => 18696442 [patent_doc_number] => 20230326881 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-12 [patent_title] => SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/336303 [patent_app_country] => US [patent_app_date] => 2023-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9477 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18336303 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/336303
Semiconductor package with riveting structure between two rings and method for forming the same Jun 15, 2023 Issued
Array ( [id] => 18655230 [patent_doc_number] => 20230301081 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => METHODS OF FORMING MICROELECTRONIC DEVICES [patent_app_type] => utility [patent_app_number] => 18/321659 [patent_app_country] => US [patent_app_date] => 2023-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16033 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 219 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18321659 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/321659
Methods of forming microelectronic devices May 21, 2023 Issued
Array ( [id] => 18615793 [patent_doc_number] => 20230282532 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-07 [patent_title] => SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 18/196513 [patent_app_country] => US [patent_app_date] => 2023-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5600 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18196513 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/196513
Semiconductor devices and methods of manufacturing semiconductor devices May 11, 2023 Issued
Array ( [id] => 19742957 [patent_doc_number] => 12219820 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-04 [patent_title] => Organic light-emitting display device and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/317048 [patent_app_country] => US [patent_app_date] => 2023-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 28 [patent_no_of_words] => 9505 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 280 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18317048 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/317048
Organic light-emitting display device and method of manufacturing the same May 11, 2023 Issued
Array ( [id] => 18812722 [patent_doc_number] => 20230387059 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/143983 [patent_app_country] => US [patent_app_date] => 2023-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7053 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18143983 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/143983
Semiconductor device and method of fabricating the same May 4, 2023 Issued
Array ( [id] => 18570586 [patent_doc_number] => 20230260923 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/307277 [patent_app_country] => US [patent_app_date] => 2023-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9090 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18307277 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/307277
Semiconductor package Apr 25, 2023 Issued
Array ( [id] => 19023131 [patent_doc_number] => 20240079302 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => SEMICONDUCTOR PACKAGE WITH ORGANIC INTERPOSER [patent_app_type] => utility [patent_app_number] => 18/139535 [patent_app_country] => US [patent_app_date] => 2023-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8636 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18139535 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/139535
SEMICONDUCTOR PACKAGE WITH ORGANIC INTERPOSER Apr 25, 2023 Pending
Array ( [id] => 19487303 [patent_doc_number] => 12107028 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-01 [patent_title] => Thermally enhanced FCBGA package [patent_app_type] => utility [patent_app_number] => 18/305913 [patent_app_country] => US [patent_app_date] => 2023-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 20 [patent_no_of_words] => 4336 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18305913 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/305913
Thermally enhanced FCBGA package Apr 23, 2023 Issued
Array ( [id] => 19376722 [patent_doc_number] => 12068302 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-20 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 18/301420 [patent_app_country] => US [patent_app_date] => 2023-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 11735 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18301420 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/301420
Semiconductor package Apr 16, 2023 Issued
Menu