
Marcus E. Windrich
Examiner (ID: 900, Phone: (571)272-6417 , Office: P/3646 )
| Most Active Art Unit | 3646 |
| Art Unit(s) | 3646, 3619 |
| Total Applications | 906 |
| Issued Applications | 670 |
| Pending Applications | 85 |
| Abandoned Applications | 168 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18296256
[patent_doc_number] => 20230105942
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-04-06
[patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/859411
[patent_app_country] => US
[patent_app_date] => 2022-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12976
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17859411
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/859411 | Semiconductor package and method of fabricating the same | Jul 6, 2022 | Issued |
Array
(
[id] => 18882929
[patent_doc_number] => 20240006298
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-04
[patent_title] => SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
[patent_app_type] => utility
[patent_app_number] => 17/855040
[patent_app_country] => US
[patent_app_date] => 2022-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7004
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -20
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17855040
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/855040 | SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS | Jun 29, 2022 | Pending |
Array
(
[id] => 19357030
[patent_doc_number] => 12057488
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-08-06
[patent_title] => Methods of reducing capacitance in field-effect transistors
[patent_app_type] => utility
[patent_app_number] => 17/850393
[patent_app_country] => US
[patent_app_date] => 2022-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 40
[patent_no_of_words] => 9615
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 164
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17850393
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/850393 | Methods of reducing capacitance in field-effect transistors | Jun 26, 2022 | Issued |
Array
(
[id] => 18935444
[patent_doc_number] => 11887887
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-01-30
[patent_title] => Interconnect structures and methods of fabrication
[patent_app_type] => utility
[patent_app_number] => 17/850876
[patent_app_country] => US
[patent_app_date] => 2022-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 22
[patent_no_of_words] => 12741
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 218
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17850876
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/850876 | Interconnect structures and methods of fabrication | Jun 26, 2022 | Issued |
Array
(
[id] => 18444752
[patent_doc_number] => 11680312
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-06-20
[patent_title] => Catalyst enhanced seamless ruthenium gap fill
[patent_app_type] => utility
[patent_app_number] => 17/850022
[patent_app_country] => US
[patent_app_date] => 2022-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 13
[patent_no_of_words] => 18349
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17850022
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/850022 | Catalyst enhanced seamless ruthenium gap fill | Jun 26, 2022 | Issued |
Array
(
[id] => 18865920
[patent_doc_number] => 20230420357
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-28
[patent_title] => SILICON NITRIDE LAYER UNDER A COPPER PAD
[patent_app_type] => utility
[patent_app_number] => 17/848624
[patent_app_country] => US
[patent_app_date] => 2022-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6730
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -22
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17848624
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/848624 | SILICON NITRIDE LAYER UNDER A COPPER PAD | Jun 23, 2022 | Pending |
Array
(
[id] => 17900820
[patent_doc_number] => 20220310482
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-09-29
[patent_title] => Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same
[patent_app_type] => utility
[patent_app_number] => 17/841007
[patent_app_country] => US
[patent_app_date] => 2022-06-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12602
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 47
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17841007
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/841007 | Packaged semiconductor device including liquid-cooled lid and methods of forming the same | Jun 14, 2022 | Issued |
Array
(
[id] => 17870691
[patent_doc_number] => 20220293428
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-09-15
[patent_title] => APPARATUS FOR PROCESSING SUBSTRATE
[patent_app_type] => utility
[patent_app_number] => 17/805057
[patent_app_country] => US
[patent_app_date] => 2022-06-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10615
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17805057
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/805057 | Apparatus for processing substrate | Jun 1, 2022 | Issued |
Array
(
[id] => 18595154
[patent_doc_number] => 11744076
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-08-29
[patent_title] => Integrated assemblies, and methods of forming integrated assemblies
[patent_app_type] => utility
[patent_app_number] => 17/824582
[patent_app_country] => US
[patent_app_date] => 2022-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 29
[patent_no_of_words] => 8922
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 309
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17824582
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/824582 | Integrated assemblies, and methods of forming integrated assemblies | May 24, 2022 | Issued |
Array
(
[id] => 18458915
[patent_doc_number] => 20230200197
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-22
[patent_title] => METHOD OF MANUFACTURING DISPLAY PANEL
[patent_app_type] => utility
[patent_app_number] => 17/824709
[patent_app_country] => US
[patent_app_date] => 2022-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 19145
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17824709
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/824709 | METHOD OF MANUFACTURING DISPLAY PANEL | May 24, 2022 | Issued |
Array
(
[id] => 18721478
[patent_doc_number] => 11798834
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-10-24
[patent_title] => Cyclical deposition method and apparatus for filling a recess formed within a substrate surface
[patent_app_type] => utility
[patent_app_number] => 17/741562
[patent_app_country] => US
[patent_app_date] => 2022-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 5452
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 123
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17741562
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/741562 | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface | May 10, 2022 | Issued |
Array
(
[id] => 17833690
[patent_doc_number] => 20220270994
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-08-25
[patent_title] => INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 17/741457
[patent_app_country] => US
[patent_app_date] => 2022-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9789
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 101
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17741457
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/741457 | Integrated fan-out package and manufacturing method thereof | May 10, 2022 | Issued |
Array
(
[id] => 20267096
[patent_doc_number] => 12438095
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2025-10-07
[patent_title] => Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
[patent_app_type] => utility
[patent_app_number] => 17/737966
[patent_app_country] => US
[patent_app_date] => 2022-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 11
[patent_no_of_words] => 2182
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17737966
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/737966 | Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates | May 4, 2022 | Issued |
Array
(
[id] => 19364367
[patent_doc_number] => 20240266401
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-08
[patent_title] => TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/566051
[patent_app_country] => US
[patent_app_date] => 2022-04-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8526
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18566051
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/566051 | TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF | Apr 13, 2022 | Pending |
Array
(
[id] => 19253135
[patent_doc_number] => 20240204132
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-06-20
[patent_title] => OPTOELECTRONIC DEVICE COMPRISING A STACK OF MULTIPLE QUANTUM WELLS
[patent_app_type] => utility
[patent_app_number] => 18/286894
[patent_app_country] => US
[patent_app_date] => 2022-04-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3614
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18286894
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/286894 | OPTOELECTRONIC DEVICE COMPRISING A STACK OF MULTIPLE QUANTUM WELLS | Apr 3, 2022 | Pending |
Array
(
[id] => 17737962
[patent_doc_number] => 20220223424
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-07-14
[patent_title] => PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/709434
[patent_app_country] => US
[patent_app_date] => 2022-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8076
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17709434
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/709434 | Package structure and method of manufacturing the same | Mar 30, 2022 | Issued |
Array
(
[id] => 18679924
[patent_doc_number] => 20230317582
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-10-05
[patent_title] => GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
[patent_app_type] => utility
[patent_app_number] => 17/707183
[patent_app_country] => US
[patent_app_date] => 2022-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7208
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -22
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17707183
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/707183 | Glass core substrate printed circuit board for warpage reduction | Mar 28, 2022 | Issued |
Array
(
[id] => 17738282
[patent_doc_number] => 20220223744
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-07-14
[patent_title] => LOCALIZED PROTECTION LAYER FOR LASER ANNEALING PROCESS
[patent_app_type] => utility
[patent_app_number] => 17/706199
[patent_app_country] => US
[patent_app_date] => 2022-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11201
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 44
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17706199
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/706199 | Localized protection layer for laser annealing process | Mar 27, 2022 | Issued |
Array
(
[id] => 18782334
[patent_doc_number] => 11824101
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-11-21
[patent_title] => High aspect ratio gate structure formation
[patent_app_type] => utility
[patent_app_number] => 17/705508
[patent_app_country] => US
[patent_app_date] => 2022-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 35
[patent_no_of_words] => 7469
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 73
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17705508
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/705508 | High aspect ratio gate structure formation | Mar 27, 2022 | Issued |
Array
(
[id] => 18950986
[patent_doc_number] => 11894292
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-02-06
[patent_title] => Power module
[patent_app_type] => utility
[patent_app_number] => 17/655216
[patent_app_country] => US
[patent_app_date] => 2022-03-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 5394
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17655216
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/655216 | Power module | Mar 16, 2022 | Issued |