
Marcus Smith
Examiner (ID: 7124, Phone: (571)270-1096 , Office: P/2467 )
| Most Active Art Unit | 2467 |
| Art Unit(s) | 2616, 2468, 2419, 2467, 2619 |
| Total Applications | 664 |
| Issued Applications | 499 |
| Pending Applications | 20 |
| Abandoned Applications | 148 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10395047
[patent_doc_number] => 20150280054
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[patent_kind] => A1
[patent_issue_date] => 2015-10-01
[patent_title] => 'METHOD FOR MAKING LIGHT EMITTING DIODE'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/565430 | Method for making light emitting diode | Dec 9, 2014 | Issued |
Array
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[patent_title] => 'Method for making epitaxial structure'
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Array
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[patent_title] => 'Impedance calibration circuit, and semiconductor memory and memory system using the same'
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Array
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[patent_issue_date] => 2017-10-17
[patent_title] => 'TVS structures for high surge and low capacitance'
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Array
(
[id] => 10509772
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Array
(
[id] => 10202102
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[patent_issue_date] => 2015-03-26
[patent_title] => 'MONITOR TEST KEY OF EPI PROFILE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/555314 | Monitor test key of epi profile | Nov 25, 2014 | Issued |
Array
(
[id] => 10802685
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[patent_title] => 'DICING OF LOW-K WAFERS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/552086 | DICING OF LOW-K WAFERS | Nov 23, 2014 | Abandoned |
Array
(
[id] => 10394803
[patent_doc_number] => 20150279810
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-10-01
[patent_title] => 'WIRE BONDING METHOD EMPLOYING TWO SCRUB SETTINGS'
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[patent_app_number] => 14/552472
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/552472 | Wire bonding method employing two scrub settings | Nov 23, 2014 | Issued |
Array
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Array
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Array
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Array
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Array
(
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Array
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Array
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Array
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