Search

Marie D. Bays

Examiner (ID: 15536, Phone: (571)272-4559 , Office: P/3765 )

Most Active Art Unit
3728
Art Unit(s)
3728, 3765, 3732, 3208, 2404
Total Applications
3864
Issued Applications
2754
Pending Applications
238
Abandoned Applications
904

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18008497 [patent_doc_number] => 20220367264 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SELECTIVE TUNGSTEN DEPOSITION AT LOW TEMPERATURES [patent_app_type] => utility [patent_app_number] => 17/878599 [patent_app_country] => US [patent_app_date] => 2022-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5706 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17878599 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/878599
Selective tungsten deposition at low temperatures Jul 31, 2022 Issued
Array ( [id] => 18008568 [patent_doc_number] => 20220367335 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/816376 [patent_app_country] => US [patent_app_date] => 2022-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5826 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17816376 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/816376
Semiconductor device and method for manufacturing the same Jul 28, 2022 Issued
Array ( [id] => 18008565 [patent_doc_number] => 20220367332 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/816264 [patent_app_country] => US [patent_app_date] => 2022-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6987 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17816264 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/816264
Semiconductor package device with integrated inductor and manufacturing method thereof Jul 28, 2022 Issued
Array ( [id] => 19314483 [patent_doc_number] => 12040309 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-16 [patent_title] => Bonding through multi-shot laser reflow [patent_app_type] => utility [patent_app_number] => 17/815713 [patent_app_country] => US [patent_app_date] => 2022-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7006 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17815713 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/815713
Bonding through multi-shot laser reflow Jul 27, 2022 Issued
Array ( [id] => 18008843 [patent_doc_number] => 20220367610 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => METAL INSULATOR METAL CAPACITOR STRUCTURE HAVING HIGH CAPACITANCE [patent_app_type] => utility [patent_app_number] => 17/875026 [patent_app_country] => US [patent_app_date] => 2022-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9131 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17875026 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/875026
Metal insulator metal capacitor structure having high capacitance Jul 26, 2022 Issued
Array ( [id] => 19370447 [patent_doc_number] => 12062541 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-13 [patent_title] => Epitaxies of a chemical compound semiconductor [patent_app_type] => utility [patent_app_number] => 17/873274 [patent_app_country] => US [patent_app_date] => 2022-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2276 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873274 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/873274
Epitaxies of a chemical compound semiconductor Jul 25, 2022 Issued
Array ( [id] => 18967335 [patent_doc_number] => 11901115 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Substrate assembly with encapsulated magnetic feature [patent_app_type] => utility [patent_app_number] => 17/873509 [patent_app_country] => US [patent_app_date] => 2022-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 25 [patent_no_of_words] => 8287 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873509 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/873509
Substrate assembly with encapsulated magnetic feature Jul 25, 2022 Issued
Array ( [id] => 18008624 [patent_doc_number] => 20220367391 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/873835 [patent_app_country] => US [patent_app_date] => 2022-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8707 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873835 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/873835
Semiconductor structure Jul 25, 2022 Issued
Array ( [id] => 18005456 [patent_doc_number] => 20220364222 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering [patent_app_type] => utility [patent_app_number] => 17/814796 [patent_app_country] => US [patent_app_date] => 2022-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3463 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17814796 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/814796
Cooling device and process for cooling double-sided SiP devices during sputtering Jul 24, 2022 Issued
Array ( [id] => 19093990 [patent_doc_number] => 11955455 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-09 [patent_title] => Embedded stress absorber in package [patent_app_type] => utility [patent_app_number] => 17/814788 [patent_app_country] => US [patent_app_date] => 2022-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 22 [patent_no_of_words] => 6983 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17814788 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/814788
Embedded stress absorber in package Jul 24, 2022 Issued
Array ( [id] => 17993372 [patent_doc_number] => 20220359409 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS [patent_app_type] => utility [patent_app_number] => 17/872731 [patent_app_country] => US [patent_app_date] => 2022-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14203 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17872731 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/872731
Reconstituted substrate for radio frequency applications Jul 24, 2022 Issued
Array ( [id] => 19108686 [patent_doc_number] => 11961800 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-16 [patent_title] => Via for semiconductor device connection and methods of forming the same [patent_app_type] => utility [patent_app_number] => 17/814152 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 23 [patent_no_of_words] => 10027 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17814152 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/814152
Via for semiconductor device connection and methods of forming the same Jul 20, 2022 Issued
Array ( [id] => 17993290 [patent_doc_number] => 20220359327 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => Semiconductor Device and Method of Manufacture [patent_app_type] => utility [patent_app_number] => 17/870222 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13765 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17870222 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/870222
Semiconductor device and method of manufacture Jul 20, 2022 Issued
Array ( [id] => 19582591 [patent_doc_number] => 12148719 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-11-19 [patent_title] => Forming large chips through stitching [patent_app_type] => utility [patent_app_number] => 17/869296 [patent_app_country] => US [patent_app_date] => 2022-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 5435 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17869296 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/869296
Forming large chips through stitching Jul 19, 2022 Issued
Array ( [id] => 19467906 [patent_doc_number] => 20240321576 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-26 [patent_title] => NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/579934 [patent_app_country] => US [patent_app_date] => 2022-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4879 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18579934 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/579934
NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Jul 18, 2022 Pending
Array ( [id] => 17985996 [patent_doc_number] => 20220352033 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-03 [patent_title] => STRUCTURE AND FORMATION METHOD OF FIN-LIKE FIELD EFFECT TRANSISTOR [patent_app_type] => utility [patent_app_number] => 17/813000 [patent_app_country] => US [patent_app_date] => 2022-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7130 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17813000 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/813000
Structure and formation method of fin-like field effect transistor Jul 14, 2022 Issued
Array ( [id] => 17985996 [patent_doc_number] => 20220352033 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-03 [patent_title] => STRUCTURE AND FORMATION METHOD OF FIN-LIKE FIELD EFFECT TRANSISTOR [patent_app_type] => utility [patent_app_number] => 17/813000 [patent_app_country] => US [patent_app_date] => 2022-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7130 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17813000 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/813000
Structure and formation method of fin-like field effect transistor Jul 14, 2022 Issued
Array ( [id] => 18906060 [patent_doc_number] => 20240021545 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => CAPACITOR HAVING ELECTRODES FORMED WITHIN A SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/812565 [patent_app_country] => US [patent_app_date] => 2022-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9487 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -30 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17812565 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/812565
Capacitor having electrodes formed within a substrate Jul 13, 2022 Issued
Array ( [id] => 20612904 [patent_doc_number] => 12588525 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-24 [patent_title] => Packaging substrate including an underfill injection opening and methods of forming the same [patent_app_type] => utility [patent_app_number] => 17/864564 [patent_app_country] => US [patent_app_date] => 2022-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 6673 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17864564 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/864564
Packaging substrate including an underfill injection opening and methods of forming the same Jul 13, 2022 Issued
Array ( [id] => 17949355 [patent_doc_number] => 20220336374 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-20 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/810625 [patent_app_country] => US [patent_app_date] => 2022-07-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5046 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17810625 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/810625
Semiconductor package structure Jul 3, 2022 Issued
Menu