Search

Mark Rosenbaum

Examiner (ID: 18547, Phone: (571)272-4523 , Office: P/3725 )

Most Active Art Unit
3725
Art Unit(s)
3502, 3206, 2899, 3505, 3725, 3209, 3202, 3204, 3201, 3203, 3103
Total Applications
4526
Issued Applications
3830
Pending Applications
109
Abandoned Applications
597

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 698791 [patent_doc_number] => 07067344 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2006-06-27 [patent_title] => 'Method of manufacturing an external force detection sensor' [patent_app_type] => utility [patent_app_number] => 09/548414 [patent_app_country] => US [patent_app_date] => 2000-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 34 [patent_no_of_words] => 7850 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/067/07067344.pdf [firstpage_image] =>[orig_patent_app_number] => 09548414 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/548414
Method of manufacturing an external force detection sensor Apr 12, 2000 Issued
Array ( [id] => 1585550 [patent_doc_number] => 06358823 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-03-19 [patent_title] => 'Method of fabricating ion implanted doping layers in semiconductor materials and integrated circuits made therefrom' [patent_app_type] => B1 [patent_app_number] => 09/549103 [patent_app_country] => US [patent_app_date] => 2000-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 2761 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/358/06358823.pdf [firstpage_image] =>[orig_patent_app_number] => 09549103 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/549103
Method of fabricating ion implanted doping layers in semiconductor materials and integrated circuits made therefrom Apr 11, 2000 Issued
Array ( [id] => 4247104 [patent_doc_number] => 06221732 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-04-24 [patent_title] => 'Method of producing semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/547903 [patent_app_country] => US [patent_app_date] => 2000-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 27 [patent_no_of_words] => 4339 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/221/06221732.pdf [firstpage_image] =>[orig_patent_app_number] => 547903 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/547903
Method of producing semiconductor device Apr 10, 2000 Issued
Array ( [id] => 4270438 [patent_doc_number] => 06245666 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-12 [patent_title] => 'Method for forming a delamination resistant multi-layer dielectric layer for passivating a conductor layer' [patent_app_type] => 1 [patent_app_number] => 9/541483 [patent_app_country] => US [patent_app_date] => 2000-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 5751 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/245/06245666.pdf [firstpage_image] =>[orig_patent_app_number] => 541483 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/541483
Method for forming a delamination resistant multi-layer dielectric layer for passivating a conductor layer Apr 2, 2000 Issued
Array ( [id] => 1288821 [patent_doc_number] => 06632730 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-10-14 [patent_title] => 'Method for self-doping contacts to a semiconductor' [patent_app_type] => B1 [patent_app_number] => 09/538034 [patent_app_country] => US [patent_app_date] => 2000-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 7941 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/632/06632730.pdf [firstpage_image] =>[orig_patent_app_number] => 09538034 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/538034
Method for self-doping contacts to a semiconductor Mar 28, 2000 Issued
Array ( [id] => 4285606 [patent_doc_number] => 06210994 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-04-03 [patent_title] => 'Process for forming an edge structure to seal integrated electronic devices, and corresponding device' [patent_app_type] => 1 [patent_app_number] => 9/534675 [patent_app_country] => US [patent_app_date] => 2000-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 9078 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/210/06210994.pdf [firstpage_image] =>[orig_patent_app_number] => 534675 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/534675
Process for forming an edge structure to seal integrated electronic devices, and corresponding device Mar 23, 2000 Issued
Array ( [id] => 7643535 [patent_doc_number] => 06429506 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-08-06 [patent_title] => 'Semiconductor device produced by dicing' [patent_app_type] => B1 [patent_app_number] => 09/525514 [patent_app_country] => US [patent_app_date] => 2000-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 50 [patent_no_of_words] => 7933 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/429/06429506.pdf [firstpage_image] =>[orig_patent_app_number] => 09525514 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/525514
Semiconductor device produced by dicing Mar 14, 2000 Issued
Array ( [id] => 4271562 [patent_doc_number] => 06323120 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-27 [patent_title] => 'Method of forming a wiring film' [patent_app_type] => 1 [patent_app_number] => 9/522473 [patent_app_country] => US [patent_app_date] => 2000-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 5164 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/323/06323120.pdf [firstpage_image] =>[orig_patent_app_number] => 522473 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/522473
Method of forming a wiring film Mar 8, 2000 Issued
Array ( [id] => 1391743 [patent_doc_number] => 06533865 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-03-18 [patent_title] => 'Acoustic/ultrasonic agitation to reduce microbubbles in developer' [patent_app_type] => B1 [patent_app_number] => 09/521034 [patent_app_country] => US [patent_app_date] => 2000-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 3040 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/533/06533865.pdf [firstpage_image] =>[orig_patent_app_number] => 09521034 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/521034
Acoustic/ultrasonic agitation to reduce microbubbles in developer Mar 7, 2000 Issued
Array ( [id] => 4347390 [patent_doc_number] => 06214646 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-04-10 [patent_title] => 'Soldering optical subassemblies' [patent_app_type] => 1 [patent_app_number] => 9/515474 [patent_app_country] => US [patent_app_date] => 2000-02-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 2080 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/214/06214646.pdf [firstpage_image] =>[orig_patent_app_number] => 515474 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/515474
Soldering optical subassemblies Feb 28, 2000 Issued
Array ( [id] => 1291384 [patent_doc_number] => 06633083 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-10-14 [patent_title] => 'Barrier layer integrity test' [patent_app_type] => B2 [patent_app_number] => 09/514413 [patent_app_country] => US [patent_app_date] => 2000-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2513 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 318 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/633/06633083.pdf [firstpage_image] =>[orig_patent_app_number] => 09514413 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/514413
Barrier layer integrity test Feb 27, 2000 Issued
Array ( [id] => 7612847 [patent_doc_number] => 06902987 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-06-07 [patent_title] => 'Method for low temperature bonding and bonded structure' [patent_app_type] => utility [patent_app_number] => 09/505283 [patent_app_country] => US [patent_app_date] => 2000-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 20 [patent_no_of_words] => 8311 [patent_no_of_claims] => 147 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/902/06902987.pdf [firstpage_image] =>[orig_patent_app_number] => 09505283 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/505283
Method for low temperature bonding and bonded structure Feb 15, 2000 Issued
Array ( [id] => 4417162 [patent_doc_number] => 06194274 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-27 [patent_title] => 'Method of fabricating a mask ROM' [patent_app_type] => 1 [patent_app_number] => 9/503693 [patent_app_country] => US [patent_app_date] => 2000-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 17 [patent_no_of_words] => 2790 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/194/06194274.pdf [firstpage_image] =>[orig_patent_app_number] => 503693 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/503693
Method of fabricating a mask ROM Feb 13, 2000 Issued
Array ( [id] => 4344726 [patent_doc_number] => 06284648 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-04 [patent_title] => 'Semiconductor processing method of forming a buried contact' [patent_app_type] => 1 [patent_app_number] => 9/499614 [patent_app_country] => US [patent_app_date] => 2000-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 18 [patent_no_of_words] => 2586 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/284/06284648.pdf [firstpage_image] =>[orig_patent_app_number] => 499614 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/499614
Semiconductor processing method of forming a buried contact Feb 6, 2000 Issued
Array ( [id] => 4275902 [patent_doc_number] => 06281114 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-08-28 [patent_title] => 'Planarization after metal chemical mechanical polishing in semiconductor wafer fabrication' [patent_app_type] => 1 [patent_app_number] => 9/498873 [patent_app_country] => US [patent_app_date] => 2000-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 21 [patent_no_of_words] => 10693 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/281/06281114.pdf [firstpage_image] =>[orig_patent_app_number] => 498873 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/498873
Planarization after metal chemical mechanical polishing in semiconductor wafer fabrication Feb 6, 2000 Issued
Array ( [id] => 7645662 [patent_doc_number] => 06472307 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-29 [patent_title] => 'Methods for improved encapsulation of thick metal features in integrated circuit fabrication' [patent_app_type] => B1 [patent_app_number] => 09/491644 [patent_app_country] => US [patent_app_date] => 2000-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3751 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 9 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/472/06472307.pdf [firstpage_image] =>[orig_patent_app_number] => 09491644 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/491644
Methods for improved encapsulation of thick metal features in integrated circuit fabrication Jan 26, 2000 Issued
Array ( [id] => 1565759 [patent_doc_number] => 06376308 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-23 [patent_title] => 'Process for fabricating an EEPROM device having a pocket substrate region' [patent_app_type] => B1 [patent_app_number] => 09/487073 [patent_app_country] => US [patent_app_date] => 2000-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2594 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/376/06376308.pdf [firstpage_image] =>[orig_patent_app_number] => 09487073 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/487073
Process for fabricating an EEPROM device having a pocket substrate region Jan 18, 2000 Issued
Array ( [id] => 4319201 [patent_doc_number] => 06248668 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-19 [patent_title] => 'Dendritic material sacrificial layer micro-scale gap formation method' [patent_app_type] => 1 [patent_app_number] => 9/483153 [patent_app_country] => US [patent_app_date] => 2000-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 14 [patent_no_of_words] => 1680 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/248/06248668.pdf [firstpage_image] =>[orig_patent_app_number] => 483153 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/483153
Dendritic material sacrificial layer micro-scale gap formation method Jan 13, 2000 Issued
Array ( [id] => 1440988 [patent_doc_number] => 06335236 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-01 [patent_title] => 'Manufacturing method of semiconductor device' [patent_app_type] => B1 [patent_app_number] => 09/478533 [patent_app_country] => US [patent_app_date] => 2000-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 15 [patent_no_of_words] => 2767 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 212 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/335/06335236.pdf [firstpage_image] =>[orig_patent_app_number] => 09478533 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/478533
Manufacturing method of semiconductor device Jan 5, 2000 Issued
Array ( [id] => 1071886 [patent_doc_number] => 06841470 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-01-11 [patent_title] => 'Removal of residue from a substrate' [patent_app_type] => utility [patent_app_number] => 09/476633 [patent_app_country] => US [patent_app_date] => 1999-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 13 [patent_no_of_words] => 2802 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/841/06841470.pdf [firstpage_image] =>[orig_patent_app_number] => 09476633 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/476633
Removal of residue from a substrate Dec 30, 1999 Issued
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