Search

Mark V Prenty

Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2814, 2503, 2822, 2899
Total Applications
2970
Issued Applications
2517
Pending Applications
67
Abandoned Applications
386

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17730799 [patent_doc_number] => 11387200 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-07-12 [patent_title] => Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric [patent_app_type] => utility [patent_app_number] => 16/827296 [patent_app_country] => US [patent_app_date] => 2020-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4862 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16827296 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/827296
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric Mar 22, 2020 Issued
Array ( [id] => 17700208 [patent_doc_number] => 11373942 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-06-28 [patent_title] => Semiconductor devices [patent_app_type] => utility [patent_app_number] => 16/826995 [patent_app_country] => US [patent_app_date] => 2020-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 18 [patent_no_of_words] => 4802 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16826995 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/826995
Semiconductor devices Mar 22, 2020 Issued
Array ( [id] => 16332314 [patent_doc_number] => 20200303280 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-09-24 [patent_title] => THERMALLY ENHANCED ASSEMBLY WITH METALLIC INTERFACIAL STRUCTURE BETWEEN HEAT GENERATING COMPONENT AND HEAT SPREADER [patent_app_type] => utility [patent_app_number] => 16/823895 [patent_app_country] => US [patent_app_date] => 2020-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3830 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16823895 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/823895
THERMALLY ENHANCED ASSEMBLY WITH METALLIC INTERFACIAL STRUCTURE BETWEEN HEAT GENERATING COMPONENT AND HEAT SPREADER Mar 18, 2020 Abandoned
Array ( [id] => 17100190 [patent_doc_number] => 20210287981 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => SEMICONDUCTOR ASSEMBLY HAVING T-SHAPED INTERCONNECTION AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 16/819758 [patent_app_country] => US [patent_app_date] => 2020-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6347 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16819758 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/819758
Semiconductor assembly having T-shaped interconnection and method of manufacturing the same Mar 15, 2020 Issued
Array ( [id] => 17100161 [patent_doc_number] => 20210287952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => SYSTEM AND METHOD FOR A DEVICE PACKAGE [patent_app_type] => utility [patent_app_number] => 16/816823 [patent_app_country] => US [patent_app_date] => 2020-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6355 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16816823 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/816823
System and method for a device package Mar 11, 2020 Issued
Array ( [id] => 18131206 [patent_doc_number] => 11557421 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-01-17 [patent_title] => Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method [patent_app_type] => utility [patent_app_number] => 16/809689 [patent_app_country] => US [patent_app_date] => 2020-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6102 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16809689 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/809689
Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method Mar 4, 2020 Issued
Array ( [id] => 16715734 [patent_doc_number] => 20210082881 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-03-18 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 16/809837 [patent_app_country] => US [patent_app_date] => 2020-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3784 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16809837 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/809837
Semiconductor package Mar 4, 2020 Issued
Array ( [id] => 17730758 [patent_doc_number] => 11387159 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-07-12 [patent_title] => Chip package [patent_app_type] => utility [patent_app_number] => 16/808369 [patent_app_country] => US [patent_app_date] => 2020-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 7650 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 248 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16808369 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/808369
Chip package Mar 3, 2020 Issued
Array ( [id] => 16789212 [patent_doc_number] => 10991651 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-04-27 [patent_title] => Interconnection structure having reduced capacitance and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/808041 [patent_app_country] => US [patent_app_date] => 2020-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 5369 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16808041 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/808041
Interconnection structure having reduced capacitance and method of manufacturing the same Mar 2, 2020 Issued
Array ( [id] => 17239771 [patent_doc_number] => 11183666 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-11-23 [patent_title] => Optoelectronic semiconductor component [patent_app_type] => utility [patent_app_number] => 16/806272 [patent_app_country] => US [patent_app_date] => 2020-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 4049 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 263 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16806272 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/806272
Optoelectronic semiconductor component Mar 1, 2020 Issued
Array ( [id] => 16348110 [patent_doc_number] => 20200312761 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-10-01 [patent_title] => CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 16/806160 [patent_app_country] => US [patent_app_date] => 2020-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9879 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16806160 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/806160
Circuit board and method for manufacturing the same Mar 1, 2020 Issued
Array ( [id] => 18047961 [patent_doc_number] => 11521919 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-12-06 [patent_title] => Flex-foil package with coplanar topology for high-frequency signals [patent_app_type] => utility [patent_app_number] => 16/803072 [patent_app_country] => US [patent_app_date] => 2020-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 12805 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 420 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16803072 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/803072
Flex-foil package with coplanar topology for high-frequency signals Feb 26, 2020 Issued
Array ( [id] => 16080685 [patent_doc_number] => 20200194329 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-06-18 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 16/800681 [patent_app_country] => US [patent_app_date] => 2020-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6127 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16800681 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/800681
Semiconductor device Feb 24, 2020 Issued
Array ( [id] => 16080799 [patent_doc_number] => 20200194386 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-06-18 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 16/800537 [patent_app_country] => US [patent_app_date] => 2020-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7275 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16800537 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/800537
Semiconductor device Feb 24, 2020 Issued
Array ( [id] => 16896306 [patent_doc_number] => 11037868 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-06-15 [patent_title] => Semiconductor device package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/801061 [patent_app_country] => US [patent_app_date] => 2020-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 30 [patent_no_of_words] => 5690 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16801061 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/801061
Semiconductor device package and method of manufacturing the same Feb 24, 2020 Issued
Array ( [id] => 17002589 [patent_doc_number] => 11081412 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-08-03 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 16/796557 [patent_app_country] => US [patent_app_date] => 2020-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 33 [patent_no_of_words] => 5936 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16796557 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/796557
Semiconductor device Feb 19, 2020 Issued
Array ( [id] => 16402343 [patent_doc_number] => 20200343201 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-10-29 [patent_title] => SURFACE MOUNT PASSIVE COMPONENT SHORTED TOGETHER AND A DIE [patent_app_type] => utility [patent_app_number] => 16/794360 [patent_app_country] => US [patent_app_date] => 2020-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16745 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -29 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16794360 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/794360
Surface mount passive component shorted together and a die Feb 18, 2020 Issued
Array ( [id] => 16668495 [patent_doc_number] => 10937753 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-03-02 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 16/793546 [patent_app_country] => US [patent_app_date] => 2020-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 11806 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 412 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16793546 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/793546
Semiconductor device Feb 17, 2020 Issued
Array ( [id] => 16593867 [patent_doc_number] => 10903144 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-01-26 [patent_title] => Semiconductor package and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 16/792284 [patent_app_country] => US [patent_app_date] => 2020-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5004 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 289 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16792284 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/792284
Semiconductor package and manufacturing method thereof Feb 15, 2020 Issued
Array ( [id] => 16241562 [patent_doc_number] => 20200258796 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-08-13 [patent_title] => SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE CONTAINER [patent_app_type] => utility [patent_app_number] => 16/786487 [patent_app_country] => US [patent_app_date] => 2020-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4349 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16786487 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/786487
Semiconductor module and semiconductor device container Feb 9, 2020 Issued
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