Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 9812609
[patent_doc_number] => 20150024554
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-01-22
[patent_title] => 'Chip To Package Interface'
[patent_app_type] => utility
[patent_app_number] => 14/511472
[patent_app_country] => US
[patent_app_date] => 2014-10-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 7780
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14511472
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/511472 | Chip to package interface | Oct 9, 2014 | Issued |
Array
(
[id] => 10255786
[patent_doc_number] => 20150140783
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-05-21
[patent_title] => 'WAFER DICING PRESS AND METHOD AND SEMICONDUCTOR WAFER DICING SYSTEM INCLUDING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/510246
[patent_app_country] => US
[patent_app_date] => 2014-10-09
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/510246 | Wafer dicing press and method and semiconductor wafer dicing system including the same | Oct 8, 2014 | Issued |
Array
(
[id] => 11077646
[patent_doc_number] => 20160274610
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-09-22
[patent_title] => 'ELECTRONIC CONTROL DEVICE'
[patent_app_type] => utility
[patent_app_number] => 15/027665
[patent_app_country] => US
[patent_app_date] => 2014-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/027665 | ELECTRONIC CONTROL DEVICE | Oct 5, 2014 | Abandoned |
Array
(
[id] => 14797111
[patent_doc_number] => 10401556
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2019-09-03
[patent_title] => Light source module and backlight unit having the same
[patent_app_type] => utility
[patent_app_number] => 15/025457
[patent_app_country] => US
[patent_app_date] => 2014-09-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 6496
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/025457 | Light source module and backlight unit having the same | Sep 29, 2014 | Issued |
Array
(
[id] => 11043565
[patent_doc_number] => 20160240521
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-08-18
[patent_title] => 'Circuit Device And Method For The Production Thereof'
[patent_app_type] => utility
[patent_app_number] => 15/027030
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/027030 | Circuit device and method for the production thereof | Sep 25, 2014 | Issued |
Array
(
[id] => 9809808
[patent_doc_number] => 20150021753
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-01-22
[patent_title] => 'PACKAGING STRUCTURE OF A SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/488586
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/488586 | Packaging structure of a semiconductor device | Sep 16, 2014 | Issued |
Array
(
[id] => 12253480
[patent_doc_number] => 09925612
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[patent_kind] => B2
[patent_issue_date] => 2018-03-27
[patent_title] => 'Semiconductor component, semiconductor-mounted product including the component, and method of producing the product'
[patent_app_type] => utility
[patent_app_number] => 14/437012
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14437012
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/437012 | Semiconductor component, semiconductor-mounted product including the component, and method of producing the product | Sep 9, 2014 | Issued |
Array
(
[id] => 10964698
[patent_doc_number] => 20140367729
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-12-18
[patent_title] => 'ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/476881
[patent_app_country] => US
[patent_app_date] => 2014-09-04
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[patent_drawing_sheets_cnt] => 14
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14476881
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/476881 | ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND SEMICONDUCTOR DEVICE | Sep 3, 2014 | Abandoned |
Array
(
[id] => 10286022
[patent_doc_number] => 20150171020
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-06-18
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/475270
[patent_app_country] => US
[patent_app_date] => 2014-09-02
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/475270 | Semiconductor device and method of manufacturing semiconductor device | Sep 1, 2014 | Issued |
Array
(
[id] => 9905929
[patent_doc_number] => 20150061129
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[patent_kind] => A1
[patent_issue_date] => 2015-03-05
[patent_title] => 'Bump Electrode, Board Which Has Bump Electrodes, and Method for Manufacturing the Board'
[patent_app_type] => utility
[patent_app_number] => 14/475249
[patent_app_country] => US
[patent_app_date] => 2014-09-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14475249
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/475249 | Bump electrode, board which has bump electrodes, and method for manufacturing the board | Sep 1, 2014 | Issued |
Array
(
[id] => 11765120
[patent_doc_number] => 09373567
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-06-21
[patent_title] => 'Lead frame, manufacture method and package structure thereof'
[patent_app_type] => utility
[patent_app_number] => 14/459515
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/459515 | Lead frame, manufacture method and package structure thereof | Aug 13, 2014 | Issued |
Array
(
[id] => 11792645
[patent_doc_number] => 09402315
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-07-26
[patent_title] => 'Semiconductor package having magnetic connection member'
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[patent_app_number] => 14/457493
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Array
(
[id] => 11967244
[patent_doc_number] => 20170271397
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[patent_title] => 'Anti-Reflective Treatment Of The Rear Side Of A Semiconductor Wafer'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/502212 | Anti-Reflective Treatment Of The Rear Side Of A Semiconductor Wafer | Aug 7, 2014 | Abandoned |
Array
(
[id] => 10277269
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[patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME'
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Array
(
[id] => 10929960
[patent_doc_number] => 20140332981
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-11-13
[patent_title] => 'LOW-STRESS VIAS'
[patent_app_type] => utility
[patent_app_number] => 14/450109
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/450109 | Low-stress vias | Jul 31, 2014 | Issued |
Array
(
[id] => 10691485
[patent_doc_number] => 20160037631
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[patent_kind] => A1
[patent_issue_date] => 2016-02-04
[patent_title] => 'DISPLAY APPARATUS WITH NARROW BEZEL'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/445438 | DISPLAY APPARATUS WITH NARROW BEZEL | Jul 28, 2014 | Abandoned |
Array
(
[id] => 10826380
[patent_doc_number] => 20160172547
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-06-16
[patent_title] => 'Surface-Mountable Optoelectronic Semiconductor Component and Method for Producing Same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/907043 | Surface-mountable optoelectronic semiconductor component with conductive connection on housing body | Jul 15, 2014 | Issued |
Array
(
[id] => 10916669
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[patent_issue_date] => 2014-10-30
[patent_title] => 'Protection Layers for Conductive Pads and Methods of Formation Thereof'
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Array
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[patent_title] => 'DICING DIE-BONDING FILM AND METHOD OF FORMING A CUT ON THE DICING DIE-BONDING FILM'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/315495 | Dicing die-bonding film and method of forming a cut on the dicing die-bonding film | Jun 25, 2014 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/287749 | Semiconductor device and method for manufacturing the same | May 26, 2014 | Issued |