Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
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[id] => 10206161
[patent_doc_number] => 20150091149
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[patent_title] => 'STACK-TYPE SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/286483
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/286483 | Stack-type semiconductor package | May 22, 2014 | Issued |
Array
(
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[patent_doc_number] => 20150031172
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[patent_title] => 'METHOD FOR INTERCONNECTION OF COMPONENTS ON A SUBSTRATE'
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Array
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[patent_title] => 'Semiconductor package with stress relief and heat spreader'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/277801 | Semiconductor package with stress relief and heat spreader | May 14, 2014 | Issued |
Array
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[patent_title] => 'SURFACE EMITTING SEMICONDUCTOR LASER, SURFACE EMITTING SEMICONDUCTOR LASER ARRAY, SURFACE EMITTING SEMICONDUCTOR LASER DEVICE, OPTICAL TRANSMISSION DEVICE, INFORMATION PROCESSING APPARATUS, AND METHOD OF PRODUCING SURFACE EMITTING SEMICONDUCTOR LASER'
[patent_app_type] => utility
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Array
(
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[patent_doc_number] => 20140239456
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[patent_title] => 'SEMICONDUCTOR WAFER AND ITS MANUFACTURE METHOD, AND SEMICONDUCTOR CHIP'
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Array
(
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Array
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[patent_title] => 'COPPER PILLAR FULL METAL VIA ELECTRICAL CIRCUIT STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 14/255083
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/255083 | Copper pillar full metal via electrical circuit structure | Apr 16, 2014 | Issued |
Array
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Array
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Array
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[patent_title] => 'SEMICONDUCTOR MODULE AND DRIVE DEVICE EQUIPPED WITH SEMICONDUCTOR MODULE'
[patent_app_type] => utility
[patent_app_number] => 15/117238
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Array
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Array
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Array
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