Search

Mark V Prenty

Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2814, 2503, 2822, 2899
Total Applications
2970
Issued Applications
2517
Pending Applications
67
Abandoned Applications
386

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 10206161 [patent_doc_number] => 20150091149 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-02 [patent_title] => 'STACK-TYPE SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/286483 [patent_app_country] => US [patent_app_date] => 2014-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 40 [patent_figures_cnt] => 40 [patent_no_of_words] => 12749 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14286483 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/286483
Stack-type semiconductor package May 22, 2014 Issued
Array ( [id] => 9839090 [patent_doc_number] => 20150031172 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-01-29 [patent_title] => 'METHOD FOR INTERCONNECTION OF COMPONENTS ON A SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 14/279891 [patent_app_country] => US [patent_app_date] => 2014-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3090 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14279891 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/279891
METHOD FOR INTERCONNECTION OF COMPONENTS ON A SUBSTRATE May 15, 2014 Abandoned
Array ( [id] => 10165345 [patent_doc_number] => 09196576 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-11-24 [patent_title] => 'Semiconductor package with stress relief and heat spreader' [patent_app_type] => utility [patent_app_number] => 14/277801 [patent_app_country] => US [patent_app_date] => 2014-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 8 [patent_no_of_words] => 3426 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14277801 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/277801
Semiconductor package with stress relief and heat spreader May 14, 2014 Issued
Array ( [id] => 10214325 [patent_doc_number] => 20150099317 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-09 [patent_title] => 'SURFACE EMITTING SEMICONDUCTOR LASER, SURFACE EMITTING SEMICONDUCTOR LASER ARRAY, SURFACE EMITTING SEMICONDUCTOR LASER DEVICE, OPTICAL TRANSMISSION DEVICE, INFORMATION PROCESSING APPARATUS, AND METHOD OF PRODUCING SURFACE EMITTING SEMICONDUCTOR LASER' [patent_app_type] => utility [patent_app_number] => 14/275227 [patent_app_country] => US [patent_app_date] => 2014-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6709 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14275227 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/275227
Surface emitting semiconductor laser, surface emitting semiconductor laser array, surface emitting semiconductor laser device, optical transmission device, information processing apparatus, and method of producing surface emitting semiconductor laser May 11, 2014 Issued
Array ( [id] => 9682693 [patent_doc_number] => 20140239456 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-08-28 [patent_title] => 'SEMICONDUCTOR WAFER AND ITS MANUFACTURE METHOD, AND SEMICONDUCTOR CHIP' [patent_app_type] => utility [patent_app_number] => 14/269840 [patent_app_country] => US [patent_app_date] => 2014-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 18211 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14269840 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/269840
Semiconductor wafer and its manufacture method, and semiconductor chip May 4, 2014 Issued
Array ( [id] => 9928478 [patent_doc_number] => 20150076670 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-03-19 [patent_title] => 'CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 14/255973 [patent_app_country] => US [patent_app_date] => 2014-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3124 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14255973 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/255973
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Apr 17, 2014 Abandoned
Array ( [id] => 9654250 [patent_doc_number] => 20140225255 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-08-14 [patent_title] => 'COPPER PILLAR FULL METAL VIA ELECTRICAL CIRCUIT STRUCTURE' [patent_app_type] => utility [patent_app_number] => 14/255083 [patent_app_country] => US [patent_app_date] => 2014-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 7746 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14255083 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/255083
Copper pillar full metal via electrical circuit structure Apr 16, 2014 Issued
Array ( [id] => 10138469 [patent_doc_number] => 09171791 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-10-27 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/249097 [patent_app_country] => US [patent_app_date] => 2014-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 37 [patent_no_of_words] => 11584 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 399 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14249097 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/249097
Semiconductor device Apr 8, 2014 Issued
Array ( [id] => 10455632 [patent_doc_number] => 20150340647 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-11-26 [patent_title] => 'PACKAGING METHOD AND DISPLAY DEVICE' [patent_app_type] => utility [patent_app_number] => 14/432456 [patent_app_country] => US [patent_app_date] => 2014-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5498 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14432456 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/432456
Packaging method and display device Apr 2, 2014 Issued
Array ( [id] => 11315370 [patent_doc_number] => 20160351480 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-12-01 [patent_title] => 'SEMICONDUCTOR MODULE AND DRIVE DEVICE EQUIPPED WITH SEMICONDUCTOR MODULE' [patent_app_type] => utility [patent_app_number] => 15/117238 [patent_app_country] => US [patent_app_date] => 2014-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4208 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15117238 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/117238
Semiconductor module and drive device equipped with semiconductor module Mar 27, 2014 Issued
Array ( [id] => 9888866 [patent_doc_number] => 08975120 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-03-10 [patent_title] => 'Method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/204988 [patent_app_country] => US [patent_app_date] => 2014-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 34 [patent_no_of_words] => 18150 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 311 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14204988 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/204988
Method of manufacturing semiconductor device Mar 10, 2014 Issued
Array ( [id] => 9566044 [patent_doc_number] => 20140183757 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-03 [patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT' [patent_app_type] => utility [patent_app_number] => 14/202067 [patent_app_country] => US [patent_app_date] => 2014-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3263 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14202067 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/202067
Semiconductor device including passivation layer encapsulant Mar 9, 2014 Issued
Array ( [id] => 9518348 [patent_doc_number] => 20140154840 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-06-05 [patent_title] => 'CHIP PACKAGE AND METHOD FOR FORMING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/173340 [patent_app_country] => US [patent_app_date] => 2014-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3612 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14173340 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/173340
Chip package and method for forming the same Feb 4, 2014 Issued
Array ( [id] => 11770314 [patent_doc_number] => 09379006 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-06-28 [patent_title] => 'Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus' [patent_app_type] => utility [patent_app_number] => 14/162140 [patent_app_country] => US [patent_app_date] => 2014-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 56 [patent_no_of_words] => 15359 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14162140 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/162140
Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus Jan 22, 2014 Issued
Array ( [id] => 10172030 [patent_doc_number] => 09202742 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-12-01 [patent_title] => 'Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof' [patent_app_type] => utility [patent_app_number] => 14/156271 [patent_app_country] => US [patent_app_date] => 2014-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 4423 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14156271 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/156271
Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof Jan 14, 2014 Issued
Array ( [id] => 10597360 [patent_doc_number] => 09318455 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-19 [patent_title] => 'Method of forming a plurality of bumps on a substrate and method of forming a chip package' [patent_app_type] => utility [patent_app_number] => 14/151855 [patent_app_country] => US [patent_app_date] => 2014-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 15 [patent_no_of_words] => 4654 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14151855 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/151855
Method of forming a plurality of bumps on a substrate and method of forming a chip package Jan 9, 2014 Issued
Array ( [id] => 9460464 [patent_doc_number] => 20140124890 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-08 [patent_title] => 'Semiconductor Package Having Multi-Phase Power Inverter with Internal Temperature Sensor' [patent_app_type] => utility [patent_app_number] => 14/152640 [patent_app_country] => US [patent_app_date] => 2014-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 11853 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14152640 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/152640
Semiconductor package having multi-phase power inverter with internal temperature sensor Jan 9, 2014 Issued
Array ( [id] => 9632001 [patent_doc_number] => 20140210109 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-31 [patent_title] => 'BUILT-IN ELECTRONIC COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 14/150952 [patent_app_country] => US [patent_app_date] => 2014-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 11133 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14150952 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/150952
Built-in electronic component substrate and method for manufacturing the substrate Jan 8, 2014 Issued
Array ( [id] => 11221614 [patent_doc_number] => 09449957 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-09-20 [patent_title] => 'Control and driver circuits on a power quad flat no-lead (PQFN) leadframe' [patent_app_type] => utility [patent_app_number] => 14/150469 [patent_app_country] => US [patent_app_date] => 2014-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 10803 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14150469 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/150469
Control and driver circuits on a power quad flat no-lead (PQFN) leadframe Jan 7, 2014 Issued
Array ( [id] => 10631540 [patent_doc_number] => 09349696 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-05-24 [patent_title] => 'Integrated antennas in wafer level package' [patent_app_type] => utility [patent_app_number] => 14/148585 [patent_app_country] => US [patent_app_date] => 2014-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 4524 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14148585 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/148585
Integrated antennas in wafer level package Jan 5, 2014 Issued
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