Mark V Prenty

Array ( [id] => 17660797 [patent_doc_number] => 20220181262 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS [patent_app_type] => utility [patent_app_number] => 17/677130 [patent_app_country] => US [patent_app_date] => 2022-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14934 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17677130 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19038169 [patent_doc_number] => 20240087984 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => SEMICONDUCTOR MODULE ASSEMBLY HAVING A COOLING BODY AND AT LEAST ONE SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 18/284751 [patent_app_country] => US [patent_app_date] => 2022-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4811 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18284751 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17645278 [patent_doc_number] => 20220173017 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-02 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/675741 [patent_app_country] => US [patent_app_date] => 2022-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8409 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17675741 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17645617 [patent_doc_number] => 20220173356 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-02 [patent_title] => ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND FABRICATION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/672652 [patent_app_country] => US [patent_app_date] => 2022-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9013 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17672652 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18555288 [patent_doc_number] => 20230253305 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => ELECTRONIC PACKAGE [patent_app_type] => utility [patent_app_number] => 17/668237 [patent_app_country] => US [patent_app_date] => 2022-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7325 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17668237 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18704780 [patent_doc_number] => 11791297 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-17 [patent_title] => Molded semiconductor package and related methods [patent_app_type] => utility [patent_app_number] => 17/649943 [patent_app_country] => US [patent_app_date] => 2022-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 2573 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17649943 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17615369 [patent_doc_number] => 20220157649 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-19 [patent_title] => SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF [patent_app_type] => utility [patent_app_number] => 17/649503 [patent_app_country] => US [patent_app_date] => 2022-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7691 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17649503 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18097486 [patent_doc_number] => 20220415827 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => Chip to Chip Interconnect Beyond Sealring Boundary [patent_app_type] => utility [patent_app_number] => 17/588767 [patent_app_country] => US [patent_app_date] => 2022-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4808 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17588767 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19046680 [patent_doc_number] => 11935800 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Compound metal lid for semiconductor chip package [patent_app_type] => utility [patent_app_number] => 17/585556 [patent_app_country] => US [patent_app_date] => 2022-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 2588 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 239 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17585556 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18122310 [patent_doc_number] => 20230007912 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-12 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACE STRUCTURES AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/577069 [patent_app_country] => US [patent_app_date] => 2022-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5613 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17577069 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18373350 [patent_doc_number] => 11653542 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-16 [patent_title] => Display apparatus [patent_app_type] => utility [patent_app_number] => 17/572922 [patent_app_country] => US [patent_app_date] => 2022-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 20 [patent_no_of_words] => 13382 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17572922 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17566659 [patent_doc_number] => 20220130808 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-28 [patent_title] => Electronic Power Module [patent_app_type] => utility [patent_app_number] => 17/571931 [patent_app_country] => US [patent_app_date] => 2022-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8679 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17571931 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18394827 [patent_doc_number] => 20230163048 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-25 [patent_title] => Temperature Control Element Utilized in Device Die Packages [patent_app_type] => utility [patent_app_number] => 17/570647 [patent_app_country] => US [patent_app_date] => 2022-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4022 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17570647 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17551724 [patent_doc_number] => 20220123066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-21 [patent_title] => PIXEL ARRANGEMENT STRUCTURE, ORGANIC LIGHT EMITTING DIODE DISPLAY PANEL, DISPLAY DEVICE AND MASK PLATE ASSEMBLY [patent_app_type] => utility [patent_app_number] => 17/568073 [patent_app_country] => US [patent_app_date] => 2022-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7773 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17568073 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17551610 [patent_doc_number] => 20220122952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-21 [patent_title] => PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/567169 [patent_app_country] => US [patent_app_date] => 2022-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12987 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17567169 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17551676 [patent_doc_number] => 20220123018 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-21 [patent_title] => Integrated Assemblies Having Vertically-Spaced Channel Material Segments, and Methods of Forming Integrated Assemblies [patent_app_type] => utility [patent_app_number] => 17/561564 [patent_app_country] => US [patent_app_date] => 2021-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8146 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17561564 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18456347 [patent_doc_number] => 20230197629 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK [patent_app_type] => utility [patent_app_number] => 17/557551 [patent_app_country] => US [patent_app_date] => 2021-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4432 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17557551 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18456257 [patent_doc_number] => 20230197539 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS [patent_app_type] => utility [patent_app_number] => 17/644695 [patent_app_country] => US [patent_app_date] => 2021-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7535 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17644695 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17708616 [patent_doc_number] => 20220208624 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-30 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING DUAL STIFFENER [patent_app_type] => utility [patent_app_number] => 17/550284 [patent_app_country] => US [patent_app_date] => 2021-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9118 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17550284 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18440080 [patent_doc_number] => 20230187375 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => CONTAINING ELECTROMAGNETIC INTERFERENCE RADIATION IN LIDLESS SEMICONDUCTOR PACKAGES [patent_app_type] => utility [patent_app_number] => 17/548747 [patent_app_country] => US [patent_app_date] => 2021-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4440 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17548747 [rel_patent_id] =>[rel_patent_doc_number] =>)