Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 10184666
[patent_doc_number] => 09214347
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-12-15
[patent_title] => 'Overlay mark assistant feature'
[patent_app_type] => utility
[patent_app_number] => 13/969005
[patent_app_country] => US
[patent_app_date] => 2013-08-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 16
[patent_no_of_words] => 6699
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13969005
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/969005 | Overlay mark assistant feature | Aug 15, 2013 | Issued |
Array
(
[id] => 9729167
[patent_doc_number] => 20140264874
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-09-18
[patent_title] => 'Electro-Migration Barrier for Cu Interconnect'
[patent_app_type] => utility
[patent_app_number] => 13/967596
[patent_app_country] => US
[patent_app_date] => 2013-08-15
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/967596 | Electro-migration barrier for Cu interconnect | Aug 14, 2013 | Issued |
Array
(
[id] => 10570225
[patent_doc_number] => 09293403
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-03-22
[patent_title] => 'Semiconductor package with improved redistribution layer design and fabricating method thereof'
[patent_app_type] => utility
[patent_app_number] => 13/955422
[patent_app_country] => US
[patent_app_date] => 2013-07-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/955422 | Semiconductor package with improved redistribution layer design and fabricating method thereof | Jul 30, 2013 | Issued |
Array
(
[id] => 9291534
[patent_doc_number] => 20140035168
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-02-06
[patent_title] => 'BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A BONDING PAD AND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 13/954649
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[patent_app_date] => 2013-07-30
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[patent_drawing_sheets_cnt] => 6
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/954649 | Bonding pad for thermocompression bonding, process for producing a bonding pad and component | Jul 29, 2013 | Issued |
Array
(
[id] => 10577012
[patent_doc_number] => 09299662
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[patent_kind] => B2
[patent_issue_date] => 2016-03-29
[patent_title] => 'Semiconductor device and display device having alignment mark'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/954930 | Semiconductor device and display device having alignment mark | Jul 29, 2013 | Issued |
Array
(
[id] => 9515331
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[patent_issue_date] => 2014-06-05
[patent_title] => 'MEMS DEVICES AND METHODS OF FORMING SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/953238 | MEMS devices and methods of forming same | Jul 28, 2013 | Issued |
Array
(
[id] => 9983550
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[patent_title] => 'Semiconductor constructions and methods of planarizing across a plurality of electrically conductive posts'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/952481 | Semiconductor constructions and methods of planarizing across a plurality of electrically conductive posts | Jul 25, 2013 | Issued |
Array
(
[id] => 9446380
[patent_doc_number] => 20140117548
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/950442 | Semiconductor device and method of manufacturing the same | Jul 24, 2013 | Issued |
Array
(
[id] => 10086357
[patent_doc_number] => 09123712
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[patent_kind] => B1
[patent_issue_date] => 2015-09-01
[patent_title] => 'Leadframe system with warp control mechanism and method of manufacture thereof'
[patent_app_type] => utility
[patent_app_number] => 13/949432
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/949432 | Leadframe system with warp control mechanism and method of manufacture thereof | Jul 23, 2013 | Issued |
Array
(
[id] => 9446370
[patent_doc_number] => 20140117538
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[patent_kind] => A1
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[patent_title] => 'PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 13/949557
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[patent_app_date] => 2013-07-24
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13949557
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/949557 | PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF | Jul 23, 2013 | Abandoned |
Array
(
[id] => 9729191
[patent_doc_number] => 20140264898
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-09-18
[patent_title] => '3-D IC Device with Enhanced Contact Area'
[patent_app_type] => utility
[patent_app_number] => 13/948508
[patent_app_country] => US
[patent_app_date] => 2013-07-23
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/948508 | 3-D IC device with enhanced contact area | Jul 22, 2013 | Issued |
Array
(
[id] => 9161540
[patent_doc_number] => 20130309817
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-11-21
[patent_title] => 'METHOD OF FABRICATING PACKAGE STRUCTURE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/948671 | Method of fabricating package structure | Jul 22, 2013 | Issued |
Array
(
[id] => 9750273
[patent_doc_number] => 08841755
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[patent_kind] => B2
[patent_issue_date] => 2014-09-23
[patent_title] => 'Through silicon via and method of forming the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/947125 | Through silicon via and method of forming the same | Jul 21, 2013 | Issued |
Array
(
[id] => 9277935
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/945484 | SEMICONDUCTOR DEVICE | Jul 17, 2013 | Abandoned |
Array
(
[id] => 10883120
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Array
(
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Array
(
[id] => 11201123
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/941684 | Semiconductor device | Jul 14, 2013 | Issued |
Array
(
[id] => 10004051
[patent_doc_number] => 09048149
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/934562 | Packaging devices, methods of manufacture thereof, and packaging methods | Jul 2, 2013 | Issued |