Mark V Prenty

Array ( [id] => 9220375 [patent_doc_number] => 20140015150 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-01-16 [patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME' [patent_app_type] => utility [patent_app_number] => 13/933621 [patent_app_country] => US [patent_app_date] => 2013-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3047 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13933621 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9335135 [patent_doc_number] => 20140061917 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-06 [patent_title] => 'SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/930187 [patent_app_country] => US [patent_app_date] => 2013-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 7683 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13930187 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10066894 [patent_doc_number] => 09105754 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-08-11 [patent_title] => 'Adhesive film, method of manufacturing semiconductor device, and semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/929612 [patent_app_country] => US [patent_app_date] => 2013-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 9527 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13929612 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9789776 [patent_doc_number] => 20150001720 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-01-01 [patent_title] => 'Interconnect Structure and Method for Forming Interconnect Structure' [patent_app_type] => utility [patent_app_number] => 13/929341 [patent_app_country] => US [patent_app_date] => 2013-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3935 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13929341 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9406287 [patent_doc_number] => 20140097539 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-10 [patent_title] => 'TECHNIQUE FOR UNIFORM CMP' [patent_app_type] => utility [patent_app_number] => 13/928084 [patent_app_country] => US [patent_app_date] => 2013-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5070 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13928084 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10857431 [patent_doc_number] => 08883628 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-11-11 [patent_title] => 'Electrical connection structure' [patent_app_type] => utility [patent_app_number] => 13/925924 [patent_app_country] => US [patent_app_date] => 2013-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2826 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13925924 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9259865 [patent_doc_number] => 20130341794 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-12-26 [patent_title] => 'ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES' [patent_app_type] => utility [patent_app_number] => 13/923979 [patent_app_country] => US [patent_app_date] => 2013-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5265 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13923979 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10525574 [patent_doc_number] => 09252095 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-02-02 [patent_title] => 'Semiconductor package and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 13/922722 [patent_app_country] => US [patent_app_date] => 2013-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 29 [patent_no_of_words] => 10194 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13922722 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9380991 [patent_doc_number] => 20140084472 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-27 [patent_title] => 'COMPOUND DIELECTRIC ANTI-COPPER-DIFFUSION BARRIER LAYER FOR COPPER CONNECTION AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/920637 [patent_app_country] => US [patent_app_date] => 2013-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2103 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13920637 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9832419 [patent_doc_number] => 08941237 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-01-27 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/920520 [patent_app_country] => US [patent_app_date] => 2013-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 12768 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13920520 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9145441 [patent_doc_number] => 20130299964 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-11-14 [patent_title] => 'METHOD FOR FORMING A FINE PATTERN USING ISOTROPIC ETCHING' [patent_app_type] => utility [patent_app_number] => 13/917207 [patent_app_country] => US [patent_app_date] => 2013-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4830 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13917207 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9818346 [patent_doc_number] => 08928134 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-01-06 [patent_title] => 'Package on package bonding structure and method for forming the same' [patent_app_type] => utility [patent_app_number] => 13/916243 [patent_app_country] => US [patent_app_date] => 2013-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 4637 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13916243 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9876056 [patent_doc_number] => 08963329 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-02-24 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/915278 [patent_app_country] => US [patent_app_date] => 2013-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 8263 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13915278 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9729165 [patent_doc_number] => 20140264872 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-18 [patent_title] => 'Metal Capping Layer for Interconnect Applications' [patent_app_type] => utility [patent_app_number] => 13/915376 [patent_app_country] => US [patent_app_date] => 2013-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4074 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13915376 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9202480 [patent_doc_number] => 20140001657 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-01-02 [patent_title] => 'ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/914231 [patent_app_country] => US [patent_app_date] => 2013-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 17668 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13914231 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9188902 [patent_doc_number] => 20130328217 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-12-12 [patent_title] => 'METHOD OF MARKING SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/910304 [patent_app_country] => US [patent_app_date] => 2013-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 14585 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13910304 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10883113 [patent_doc_number] => 08907496 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2014-12-09 [patent_title] => 'Circuit structures and methods of fabrication with enhanced contact via electrical connection' [patent_app_type] => utility [patent_app_number] => 13/909301 [patent_app_country] => US [patent_app_date] => 2013-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 4585 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13909301 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10028781 [patent_doc_number] => 09070690 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-06-30 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/909551 [patent_app_country] => US [patent_app_date] => 2013-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 47 [patent_no_of_words] => 23793 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 282 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13909551 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10950820 [patent_doc_number] => 20140353841 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-12-04 [patent_title] => 'METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS' [patent_app_type] => utility [patent_app_number] => 13/907119 [patent_app_country] => US [patent_app_date] => 2013-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 5576 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13907119 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10888656 [patent_doc_number] => 08912652 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-12-16 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/906441 [patent_app_country] => US [patent_app_date] => 2013-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 13 [patent_no_of_words] => 7158 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13906441 [rel_patent_id] =>[rel_patent_doc_number] =>)