Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
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[id] => 9566018
[patent_doc_number] => 20140183731
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[patent_title] => 'Package on Package (PoP) Bonding Structures'
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Array
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[patent_issue_date] => 2015-05-26
[patent_title] => 'Single mask package apparatus and method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/903740 | Single mask package apparatus and method | May 27, 2013 | Issued |
Array
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[patent_title] => 'Substrate of semiconductor package and method of fabricating semiconductor package using the same'
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Array
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Array
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Array
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Array
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Array
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[patent_title] => 'STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDER BALL'
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Array
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Array
(
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[patent_title] => 'Exposed die overmolded flip chip package and fabrication method'
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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